JPH0419315B2 - - Google Patents
Info
- Publication number
- JPH0419315B2 JPH0419315B2 JP60115278A JP11527885A JPH0419315B2 JP H0419315 B2 JPH0419315 B2 JP H0419315B2 JP 60115278 A JP60115278 A JP 60115278A JP 11527885 A JP11527885 A JP 11527885A JP H0419315 B2 JPH0419315 B2 JP H0419315B2
- Authority
- JP
- Japan
- Prior art keywords
- gold
- gold plating
- plating solution
- plating
- uniform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 60
- 239000010931 gold Substances 0.000 claims description 48
- 229910052737 gold Inorganic materials 0.000 claims description 48
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 45
- 238000004070 electrodeposition Methods 0.000 claims description 15
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 claims description 12
- -1 amine compound Chemical class 0.000 claims description 10
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 claims description 8
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 claims description 5
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- SDKPSXWGRWWLKR-UHFFFAOYSA-M sodium;9,10-dioxoanthracene-1-sulfonate Chemical compound [Na+].O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)[O-] SDKPSXWGRWWLKR-UHFFFAOYSA-M 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 9
- 239000012535 impurity Substances 0.000 description 8
- SBMSLRMNBSMKQC-UHFFFAOYSA-N pyrrolidin-1-amine Chemical compound NN1CCCC1 SBMSLRMNBSMKQC-UHFFFAOYSA-N 0.000 description 6
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 4
- 150000002343 gold Chemical class 0.000 description 4
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 4
- 244000248349 Citrus limon Species 0.000 description 3
- 235000005979 Citrus limon Nutrition 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- ICSNLGPSRYBMBD-UHFFFAOYSA-N 2-aminopyridine Chemical compound NC1=CC=CC=N1 ICSNLGPSRYBMBD-UHFFFAOYSA-N 0.000 description 2
- CUYKNJBYIJFRCU-UHFFFAOYSA-N 3-aminopyridine Chemical compound NC1=CC=CN=C1 CUYKNJBYIJFRCU-UHFFFAOYSA-N 0.000 description 2
- NUKYPUAOHBNCPY-UHFFFAOYSA-N 4-aminopyridine Chemical compound NC1=CC=NC=C1 NUKYPUAOHBNCPY-UHFFFAOYSA-N 0.000 description 2
- JAJIPIAHCFBEPI-UHFFFAOYSA-N 9,10-dioxoanthracene-1-sulfonic acid Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)O JAJIPIAHCFBEPI-UHFFFAOYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 description 2
- 229960004979 fampridine Drugs 0.000 description 2
- 229940046892 lead acetate Drugs 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 229910052716 thallium Inorganic materials 0.000 description 2
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 2
- CJNRGSHEMCMUOE-UHFFFAOYSA-N 2-piperidin-1-ylethanamine Chemical compound NCCN1CCCCC1 CJNRGSHEMCMUOE-UHFFFAOYSA-N 0.000 description 1
- WRXNJTBODVGDRY-UHFFFAOYSA-N 2-pyrrolidin-1-ylethanamine Chemical compound NCCN1CCCC1 WRXNJTBODVGDRY-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 1
- 235000019796 monopotassium phosphate Nutrition 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- IYPZRUYMFDWKSS-UHFFFAOYSA-N piperazin-1-amine Chemical compound NN1CCNCC1 IYPZRUYMFDWKSS-UHFFFAOYSA-N 0.000 description 1
- PVCOXMQIAVGPJN-UHFFFAOYSA-N piperazine-1,4-diamine Chemical compound NN1CCN(N)CC1 PVCOXMQIAVGPJN-UHFFFAOYSA-N 0.000 description 1
- 125000004193 piperazinyl group Chemical group 0.000 description 1
- LWMPFIOTEAXAGV-UHFFFAOYSA-N piperidin-1-amine Chemical compound NN1CCCCC1 LWMPFIOTEAXAGV-UHFFFAOYSA-N 0.000 description 1
- DBMHTLOVZSDLFD-UHFFFAOYSA-N piperidin-1-ylmethanamine Chemical compound NCN1CCCCC1 DBMHTLOVZSDLFD-UHFFFAOYSA-N 0.000 description 1
- 125000003386 piperidinyl group Chemical group 0.000 description 1
- 229940097322 potassium arsenite Drugs 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- GNSKLFRGEWLPPA-UHFFFAOYSA-M potassium dihydrogen phosphate Chemical compound [K+].OP(O)([O-])=O GNSKLFRGEWLPPA-UHFFFAOYSA-M 0.000 description 1
- LWIHDJKSTIGBAC-UHFFFAOYSA-K potassium phosphate Substances [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- NRTDAKURTMLAFN-UHFFFAOYSA-N potassium;gold(3+);tetracyanide Chemical compound [K+].[Au+3].N#[C-].N#[C-].N#[C-].N#[C-] NRTDAKURTMLAFN-UHFFFAOYSA-N 0.000 description 1
- HEQWEGCSZXMIJQ-UHFFFAOYSA-M potassium;oxoarsinite Chemical compound [K+].[O-][As]=O HEQWEGCSZXMIJQ-UHFFFAOYSA-M 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 125000000719 pyrrolidinyl group Chemical group 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- YTQVHRVITVLIRD-UHFFFAOYSA-L thallium sulfate Chemical compound [Tl+].[Tl+].[O-]S([O-])(=O)=O YTQVHRVITVLIRD-UHFFFAOYSA-L 0.000 description 1
- 229910000374 thallium(I) sulfate Inorganic materials 0.000 description 1
- 235000015870 tripotassium citrate Nutrition 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電解金めつき液に関し、更に詳しく
述べるならば、均一電着性に優れる金めつき液に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrolytic gold plating solution, and more specifically, to a gold plating solution that has excellent uniform electrodeposition properties.
金めつきは、半導体産業において種々のICパ
ツケージ等に広く用いられているが、凹凸の多い
形状を有するものの場合、各被めつき物間または
同一被めつき物内におけるめつき厚のばらつきが
大きく、より均一なめつき厚分布を与える金めつ
き浴が要望されている。
Gold plating is widely used in the semiconductor industry for various IC packages, etc., but in the case of objects with many uneven shapes, variations in plating thickness between each plated object or within the same plated object may occur. There is a need for a gold plating bath that provides a larger, more uniform plating thickness distribution.
金めつきは高価であるから、コストダウンのた
め被めつき物のめつき厚のばらつきを抑え、必要
とされる厚さ以上に金を付着させないようにする
必要がある（例えば、特開昭56−84495及び56−
108892参照）。しかしながら、電解めつきにおい
ては、電流が集中する被めつき物の凸部に多量に
金が電析する傾向を示すため、均一なめつき厚が
得られない。従来の金めつき液においては、フイ
ールドの式より求めた均一電着性が最大50％程度
のものしか得られていない。このため、めつき厚
のばらつきが大きく、厚く付いた部分ではワイヤ
ー付特性に悪影響がみられ、またスルーホール内
ではめつき厚が極端に薄く、耐熱性やハンダ付け
性において良好な特性が得られない等、製品によ
つては均一電着性の不良に関する問題点はコスト
のみにとどまらず、特性の問題にまで及び、改善
が求められている。 Gold plating is expensive, so in order to reduce costs, it is necessary to suppress variations in the plating thickness of the plated object and avoid depositing more gold than the required thickness (for example, 56−84495 and 56−
108892). However, in electrolytic plating, a large amount of gold tends to be deposited on the convex portions of the plated object where the current is concentrated, so that a uniform plating thickness cannot be obtained. Conventional gold plating solutions can only achieve a maximum uniformity of electrodeposition of about 50%, as determined by Field's equation. For this reason, the plating thickness varies widely, and the thicker parts have a negative effect on the wire attachment characteristics.In addition, the plating thickness is extremely thin inside the through-hole, which does not provide good characteristics in terms of heat resistance and solderability. Depending on the product, problems related to poor uniform electrodeposition are not limited to cost, but also extend to property problems, and improvements are required.
（発明が解決しようとする問題点）
本発明は、金めつきにおける上記の如き従来技
術の問題点を解決しようとするものである。即
ち、本発明は、電流密度の分布に依存せず、各被
めつき物間または同一被めつき物内におけるめつ
き厚が一様になる様な液組成の金めつき液を開発
することにより、被めつき物に均一な厚みの金め
つきを与え、特性の改善とともにコストダウンを
はかることを目的とする。(Problems to be Solved by the Invention) The present invention attempts to solve the above-mentioned problems of the prior art in gold plating. That is, the present invention aims to develop a gold plating liquid having a liquid composition that makes the plating thickness uniform between each plated object or within the same plated object without depending on the current density distribution. The purpose of this method is to provide gold plating with a uniform thickness to the plated object, thereby improving properties and reducing costs.
（問題点を解決するための手段）
本発明によれば可溶性金塩と伝導塩からなる電
解金めつき液が提供されるのであつて、この液
は、金めつきの均一電着性を改善する作用を有す
るピロリジン、ピプラジン、ピペリジンまたはピ
リジン骨格を有するアミン化合物を含有すること
を特徴とする。(Means for Solving the Problems) According to the present invention, an electrolytic gold plating solution comprising a soluble gold salt and a conductive salt is provided, and this solution improves uniform electrodeposition of gold plating. It is characterized by containing an amine compound having an active pyrrolidine, piprazine, piperidine or pyridine skeleton.
即ち、本発明によれば、シアン化金カリウム等
の可溶性金塩を、一般には金属金として２ｇ／
以上の量で、含有する電解金めつき液にピロリジ
ン、ピプラジン、ピペリジンまたはピリジン骨格
を有するアミン化合物を加えることにより良好な
均一電着性を達成できることが見出されたのであ
る。 That is, according to the present invention, a soluble gold salt such as gold potassium cyanide is generally used at a rate of 2 g/g as metallic gold.
It has been found that good uniform electrodeposition can be achieved by adding pyrrolidine, piprazine, piperidine, or an amine compound having a pyridine skeleton to the electrolytic gold plating solution in the above amount.
本発明に有用な可溶性金塩の例としては、シア
ン化金カリウム、亜硫酸金等がある。また、伝導
塩の例としては、燐酸、クエン酸、ピロリン酸、
シユウ酸等の有機酸あるいはこれらのアルカリ金
属塩、特に好ましくはカリウム塩がある。 Examples of soluble gold salts useful in the present invention include potassium gold cyanide, gold sulfite, and the like. Examples of conductive salts include phosphoric acid, citric acid, pyrophosphoric acid,
Organic acids such as oxalic acid or alkali metal salts thereof, particularly preferably potassium salts.
本発明に有用なピロリジン骨格を有するアミン
化合物の例としては、Ｎ−アミノピロリジン、Ｎ
−アミノメチルピロリジン、Ｎ−アミノエチルピ
ロリジン等がある。ピペラジン骨格を有するアミ
ン化合物としては、例えば、Ｎ−アミノピペラジ
ン、Ｎ−アミノエチルピペラジン、Ｎ，N′−ジ
アミノピペラジン等がある。また、ピペリジン骨
格を有するアミン化合物としては、例えば、Ｎ−
アミノピペリジン、Ｎ−アミノメチルピペリジ
ン、Ｎ−アミノエチルピペリジン等があり、ピリ
ジン骨格を有するアミン化合物としては、例え
ば、２−アミノピリジン、３−アミノピリジン、
４−アミノピリジン等がある。そして、これらの
化合物は、0.1〜100ｇ／、特に１〜30ｇ／の
量で本発明のめつき液中に含有されているのが好
ましい。 Examples of amine compounds having a pyrrolidine skeleton useful in the present invention include N-aminopyrrolidine, N-aminopyrrolidine,
-aminomethylpyrrolidine, N-aminoethylpyrrolidine, etc. Examples of amine compounds having a piperazine skeleton include N-aminopiperazine, N-aminoethylpiperazine, and N,N'-diaminopiperazine. Further, as an amine compound having a piperidine skeleton, for example, N-
There are aminopiperidine, N-aminomethylpiperidine, N-aminoethylpiperidine, etc., and examples of amine compounds having a pyridine skeleton include 2-aminopyridine, 3-aminopyridine,
Examples include 4-aminopyridine. These compounds are preferably contained in the plating solution of the present invention in an amount of 0.1 to 100 g/, particularly 1 to 30 g/.
本発明の電解金めつき液は、ラツクめつき、ジ
エツトめつき、バレルめつき等の通常の方法によ
る電解金めつきに容易に用いることができる。 The electrolytic gold plating solution of the present invention can be easily used for electrolytic gold plating by conventional methods such as easy plating, jet plating, and barrel plating.
本発明に係る電解金めつき液は、また、タリウ
ム、鉛あるいはヒ素等の結晶調整剤を含んでいて
もよい。 The electrolytic gold plating solution according to the present invention may also contain a crystal modifier such as thallium, lead, or arsenic.
次に、実施例により、本発明を更に説明する。 Next, the present invention will be further explained by examples.
例 １浴組成
シアン化金カリウム
12ｇ／（金属金として ８ｇ／）
クエン酸 25ｇ／
燐酸水素二カリウム 75ｇ／
Ｎ−アミノピロリジン 10ml／
亜ヒ酸カリウム（ヒ素として） 2ppm
上記組成の金めつき液（PH6.0、浴温60℃）を
用いて、中程度の撹拌をしながら、0.3Aで５分
間ハルセルめつきを行つたところ、レモンイエロ
ーの光沢めつきが得られた。尚、この金めつき
は、密着性、耐熱性等のICパツケージ用として
要求される特性を十分満足するものであつた。こ
のハルセルパネル上の４点の膜厚を螢光Ｘ線微小
部膜厚計により測定し、フイールドの式を用いて
均一電着性を求めたところ、92％であつた。Example 1 bath composition Potassium gold cyanide
12g/(as metal gold 8g/) citric acid 25g/ dipotassium hydrogen phosphate 75g/ N-aminopyrrolidine 10ml/ potassium arsenite (as arsenic) 2ppm Gold plating solution with the above composition (PH6.0, bath temperature 60℃) ), Halcel plating was performed at 0.3A for 5 minutes with moderate stirring, and a lemon yellow glossy plating was obtained. This gold plating sufficiently satisfied the properties required for IC packages, such as adhesion and heat resistance. The film thickness at four points on this Hull Cell panel was measured using a fluorescent X-ray micro film thickness meter, and the uniformity of electrodeposition was determined using Field's equation, and found to be 92%.
上記組成から均一電着性改善剤であるＮ−アミ
ノピロリジンを除いた金めつき液について同様な
方法で均一電着性を調べたところ42％であつた。 The uniform electrodeposition property of a gold plating solution obtained by removing the uniform electrodeposition improving agent N-aminopyrrolidine from the above composition was examined in the same manner and found to be 42%.
例 ２浴組成
シアン化金カリウム
12ｇ／（金属金として ８ｇ／）
クエン酸 25ｇ／
燐酸水素二カリウム 75ｇ／
Ｎ−アミノエチルピペラジン １ml／
硫酸第一タリウム（タリウムとして） 10ppm
上記組成の金めつき液（PH6.0、浴温60℃）を
用いて、例１と同様にハルセルめつきを行うと、
レモンイエローの半光沢めつきが得られた。尚、
この金めつきは密着性、耐熱性等のICパツケー
ジ用として要求される特性を十分満足するもので
あつた。均一電着性について例１と同様な方法で
求めたところ、74％であつた。また、上記組成か
らＮ−アミノエチルピペラジンを除いた組成の金
めつき液の均一電着性は33％であつた。Example 2- bath composition Potassium gold cyanide
12g/(as metal gold 8g/) citric acid 25g/ dipotassium hydrogen phosphate 75g/ N-aminoethylpiperazine 1ml/ thallous sulfate (as thallium) 10ppm Gold plating solution with the above composition (PH6.0, bath temperature 60 When Hull cell plating is performed in the same manner as in Example 1 using
A lemon yellow semi-gloss finish was obtained. still,
This gold plating sufficiently satisfied the properties required for IC packages, such as adhesion and heat resistance. The uniform electrodeposition property was determined in the same manner as in Example 1 and was found to be 74%. Further, the uniform electrodeposition property of the gold plating solution having the above composition excluding N-aminoethylpiperazine was 33%.
例 ３浴組成
シアン化金カリウム
12ｇ／（金属金として ８ｇ／）
クエン酸三カリウム 50ｇ／
リン酸一カリウム 50ｇ／
４−アミノピリジン 20ｇ／
酢酸鉛（鉛として） 5ppm
上記組成の金めつき液（PH6.0、浴温60℃）を
用いて、例１と同様にハルセルめつきを行つたと
ころ、レモンイエローの半光沢めつきが得られ
た。尚、この金めつきは密着性、耐熱性等のIC
パツケージ用として要求される特性を十分満足す
るものであつた。均一電着性について例１と同様
な方法で求めたところ、69％であつた。また、上
記組成からＮ−アミノエチルピペラジンを除いた
組成の金めつき液の均一電着性は27％であつた。
この例において、酢酸鉛をEDTA（エチレンジア
ミン四酢酸）のような錯化剤により錯形成させた
鉛で置き換えた場合、均一電着性は95％とさらに
改善された。Example 3 bath composition Potassium gold cyanide
12g/(as metal gold 8g/) Tripotassium citrate 50g/ Monopotassium phosphate 50g/ 4-aminopyridine 20g/ Lead acetate (as lead) 5ppm Gold plating solution with the above composition (PH6.0, bath temperature 60℃) ), Halcel plating was performed in the same manner as in Example 1, and lemon yellow semi-gloss plating was obtained. In addition, this gold plating is used to improve adhesion, heat resistance, etc.
It sufficiently satisfied the characteristics required for packaging. The uniform electrodeposition property was determined in the same manner as in Example 1 and was found to be 69%. Further, the uniform electrodeposition property of the gold plating solution having the above composition excluding N-aminoethylpiperazine was 27%.
In this example, when lead acetate was replaced with lead complexed with a complexing agent such as EDTA (ethylenediaminetetraacetic acid), the uniform electrodeposition was further improved to 95%.
以上説明したように、ピロリジン、ピペラジ
ン、ピペリジン及びピリジン骨格を有する化合物
を金めつき液に添加することにより、結晶調整剤
の種類にかかわらず均一電着性が約40〜50％向上
することがわかつた。 As explained above, by adding pyrrolidine, piperazine, piperidine, and compounds having a pyridine skeleton to the gold plating solution, uniform electrodeposition can be improved by about 40 to 50% regardless of the type of crystal modifier. I understand.
金めつき液は、通常、使い込むにつれて被めつ
き物からの溶け出しにより金めつき液中の金属不
純物濃度が増加する。そして、金属不純物濃度が
高くなるにつれ、金めつきの金属不純物共析量も
増加することにより、金めつき特性が劣化する。
このため、金めつき液の寿命は金めつき浴中の金
属不純物の濃度によつて決まる。 As the gold plating solution is used, the concentration of metal impurities in the gold plating solution usually increases due to dissolution from the object to be plated. Then, as the metal impurity concentration increases, the amount of metal impurity eutectoid in gold plating also increases, thereby degrading the gold plating characteristics.
Therefore, the lifespan of a gold plating solution is determined by the concentration of metal impurities in the gold plating bath.
例１において、Ｎ−アミノピロリジンを除いた
組成の金めつき液の場合、１ヶ月の使用により、
めつき液中の金属不純物濃度は鉄・ニツケルあわ
せて約100ppm増加した。しかしながら、Ｎ−ア
ミノピロリジンの添加により、１ヶ月使用した場
合のめつき液金属不純物濃度の増加は50ppmと、
無添加の場合に比較してめつき液中の金属不純物
濃度の増加は半分に抑えられた。 In Example 1, in the case of a gold plating solution with a composition excluding N-aminopyrrolidine, after one month of use,
The concentration of metal impurities in the plating solution increased by approximately 100 ppm in total for iron and nickel. However, due to the addition of N-aminopyrrolidine, the metal impurity concentration in the plating solution increased by 50 ppm after one month of use.
The increase in metal impurity concentration in the plating solution was suppressed to half compared to the case without additives.
以上述べてきたように、本発明に係る金めつき
液によれば、従来の金めつき液と比較して、製品
に付着する過剰な金を大幅に低減することがで
き、製品のコストダウンが図れる。また、均一付
着性が向上して、品質の大幅な改善が得られる。
また、アミン系化合物は腐食抑制効果も有するた
め、金めつき液中に添加したアミン化合物は金と
めつき素地との間の置換反応を抑制する。このた
め、金めつき液中の金属不純物濃度の増加の割合
が減り、金めつき液の寿命が長くなる。
As described above, the gold plating solution according to the present invention can significantly reduce excess gold adhering to products compared to conventional gold plating solutions, reducing product costs. can be achieved. Furthermore, uniform adhesion is improved, resulting in a significant improvement in quality.
Furthermore, since amine compounds also have a corrosion inhibiting effect, the amine compound added to the gold plating solution inhibits the substitution reaction between gold and the plating base. Therefore, the rate of increase in the concentration of metal impurities in the gold plating solution is reduced, and the life of the gold plating solution is extended.
Claims (1)
であつて、金めつきの均一電着性を改善する作用
を有するピロリジン、ピプラジン、ピペリジンま
たはピリジン骨格を有するアミン化合物を含有す
ることを特徴とする電解金めつき液。1. An electrolytic gold plating solution consisting of a soluble gold salt and a conductive salt, characterized by containing an amine compound having a pyrrolidine, piprazine, piperidine or pyridine skeleton, which has the effect of improving the uniform electrodeposition of gold plating. Electrolytic gold plating solution.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11527885A JPS61276990A (en) | 1985-05-30 | 1985-05-30 | Gold electroplating solution |
| US06/845,522 US4717459A (en) | 1985-05-30 | 1986-03-28 | Electrolytic gold plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11527885A JPS61276990A (en) | 1985-05-30 | 1985-05-30 | Gold electroplating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61276990A JPS61276990A (en) | 1986-12-06 |
| JPH0419315B2 true JPH0419315B2 (en) | 1992-03-30 |
Family
ID=14658698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11527885A Granted JPS61276990A (en) | 1985-05-30 | 1985-05-30 | Gold electroplating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61276990A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5559455B2 (en) * | 2007-06-29 | 2014-07-23 | 日本高純度化学株式会社 | Electrolytic gold plating solution and gold film obtained using the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5075531A (en) * | 1973-11-07 | 1975-06-20 |
-
1985
- 1985-05-30 JP JP11527885A patent/JPS61276990A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5075531A (en) * | 1973-11-07 | 1975-06-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61276990A (en) | 1986-12-06 |
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