JPH0418456U - - Google Patents
Info
- Publication number
- JPH0418456U JPH0418456U JP1990060310U JP6031090U JPH0418456U JP H0418456 U JPH0418456 U JP H0418456U JP 1990060310 U JP1990060310 U JP 1990060310U JP 6031090 U JP6031090 U JP 6031090U JP H0418456 U JPH0418456 U JP H0418456U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor substrate
- diameter
- opposite
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990060310U JP2508634Y2 (ja) | 1990-06-07 | 1990-06-07 | 樹脂封止ピンヘッド型半導体素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990060310U JP2508634Y2 (ja) | 1990-06-07 | 1990-06-07 | 樹脂封止ピンヘッド型半導体素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0418456U true JPH0418456U (ro) | 1992-02-17 |
JP2508634Y2 JP2508634Y2 (ja) | 1996-08-28 |
Family
ID=31587565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990060310U Expired - Lifetime JP2508634Y2 (ja) | 1990-06-07 | 1990-06-07 | 樹脂封止ピンヘッド型半導体素子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2508634Y2 (ro) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60129137U (ja) * | 1984-02-03 | 1985-08-30 | 新電元工業株式会社 | 樹脂モ−ルド型半導体装置 |
JPS6356946A (ja) * | 1986-08-28 | 1988-03-11 | Fuji Electric Co Ltd | 半導体素子 |
-
1990
- 1990-06-07 JP JP1990060310U patent/JP2508634Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60129137U (ja) * | 1984-02-03 | 1985-08-30 | 新電元工業株式会社 | 樹脂モ−ルド型半導体装置 |
JPS6356946A (ja) * | 1986-08-28 | 1988-03-11 | Fuji Electric Co Ltd | 半導体素子 |
Also Published As
Publication number | Publication date |
---|---|
JP2508634Y2 (ja) | 1996-08-28 |