JPH0418453U - - Google Patents

Info

Publication number
JPH0418453U
JPH0418453U JP1990059926U JP5992690U JPH0418453U JP H0418453 U JPH0418453 U JP H0418453U JP 1990059926 U JP1990059926 U JP 1990059926U JP 5992690 U JP5992690 U JP 5992690U JP H0418453 U JPH0418453 U JP H0418453U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
heat sink
ceramic substrate
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990059926U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990059926U priority Critical patent/JPH0418453U/ja
Publication of JPH0418453U publication Critical patent/JPH0418453U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015Shape
    • H01L2924/10155Shape being other than a cuboid

Landscapes

  • Die Bonding (AREA)
JP1990059926U 1990-06-05 1990-06-05 Pending JPH0418453U (pt)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990059926U JPH0418453U (pt) 1990-06-05 1990-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990059926U JPH0418453U (pt) 1990-06-05 1990-06-05

Publications (1)

Publication Number Publication Date
JPH0418453U true JPH0418453U (pt) 1992-02-17

Family

ID=31586858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990059926U Pending JPH0418453U (pt) 1990-06-05 1990-06-05

Country Status (1)

Country Link
JP (1) JPH0418453U (pt)

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