JPH0418435U - - Google Patents
Info
- Publication number
- JPH0418435U JPH0418435U JP5803890U JP5803890U JPH0418435U JP H0418435 U JPH0418435 U JP H0418435U JP 5803890 U JP5803890 U JP 5803890U JP 5803890 U JP5803890 U JP 5803890U JP H0418435 U JPH0418435 U JP H0418435U
- Authority
- JP
- Japan
- Prior art keywords
- chemical
- piping line
- tank
- filter device
- chemical liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000126 substance Substances 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims 10
- 238000007599 discharging Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Weting (AREA)
Description
第１図は、本考案に係る半導体処理用薬液循環
装置を含む半導体処理装置全体のシステム構成図
、第２図は、半導体処理用薬液循環装置を示す１
部破断斜視図、第３図は、第１図に示すコントロ
ールユニツトを概略的に示す斜視図である。
１……半導体処理装置、４……薬液槽、５……
半導体処理用薬液循環装置、６……ポンプ、７…
…フイルター装置、９……熱交換器、１８……ケ
ーシング。
FIG. 1 is a system configuration diagram of the entire semiconductor processing apparatus including the chemical circulation apparatus for semiconductor processing according to the present invention, and FIG. 2 is a diagram showing the chemical circulation apparatus for semiconductor processing.
3 is a perspective view schematically showing the control unit shown in FIG. 1; FIG. 1... Semiconductor processing equipment, 4... Chemical tank, 5...
Chemical circulation device for semiconductor processing, 6...pump, 7...
...Filter device, 9... Heat exchanger, 18... Casing.
Claims (1)
ある薬液を、供給配管ライン及び排出配管ライン
を通して循環させる半導体処理用薬液循環装置で
あつて、 前記排出配管ラインに接続してあるポンプと、 このポンプで吸引した薬液槽内薬液が送り込ま
れるフイルター装置と、 前記供給配管ラインに接続してあり、前記フイ
ルター装置で濾過された薬液が送り込まれて所定
温度に熱交換された薬液を、前記給油配管ライン
を通して前記薬液槽内に戻す熱交換器とを有し、 前記ポンプと、フイルター装置と、熱交換器と
が、枠体により一体にユニツト化してあることを
特徴とする半導体処理用薬液循環装置。 (2) 半導体を処理するための薬液を収容してあ
る薬液槽と、 前記薬液槽に貯留してある薬液の一部を薬液槽
外に排出する排出配管ラインと、 前記薬液槽内に薬液を供給する供給配管ライン
と、 前記排出配管ラインに接続してあるポンプと、 このポンプで吸引した薬液槽内薬液が送り込ま
れるフイルター装置と、 前記供給配管ラインに接続してあり、前記フイ
ルター装置で濾過された薬液が送り込まれて所定
温度に熱交換された薬液を、前記給油配管ライン
を通して前記薬液槽内に戻す熱交換器とを有し、 前記ポンプと、フイルター装置と、熱交換器と
、排出配管ラインと、供給配管ラインと、薬液槽
とが、枠体により一体にユニツト化してある半導
体処理装置。[Scope of Claim for Utility Model Registration] (1) A chemical liquid circulation device for semiconductor processing that is connected to a chemical liquid tank and circulates the chemical liquid stored in the chemical liquid tank through a supply piping line and a discharge piping line, which A pump connected to the piping line; A filter device into which the chemical liquid in the chemical liquid tank sucked by the pump is sent; A filter device connected to the supply piping line, into which the chemical liquid filtered by the filter device is fed to a predetermined temperature. and a heat exchanger for returning the chemical solution heat-exchanged to the chemical solution tank through the oil supply piping line, and the pump, the filter device, and the heat exchanger are integrated into a unit by a frame. A chemical circulation device for semiconductor processing characterized by the following. (2) A chemical tank containing a chemical solution for processing semiconductors; a discharge piping line for discharging a part of the chemical solution stored in the chemical solution tank to the outside of the chemical solution tank; A supply piping line to supply, a pump connected to the discharge piping line, a filter device into which the chemical solution in the chemical tank sucked by the pump is sent, and a filter device connected to the supply piping line and filtered by the filter device. a heat exchanger that returns the chemical liquid into which the chemical liquid is sent and which has been heat-exchanged to a predetermined temperature into the chemical liquid tank through the oil supply piping line, the pump, the filter device, the heat exchanger, and the discharge A semiconductor processing device in which a piping line, a supply piping line, and a chemical tank are integrated into a unit by a frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5803890U JPH0418435U (en) | 1990-06-01 | 1990-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5803890U JPH0418435U (en) | 1990-06-01 | 1990-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0418435U true JPH0418435U (en) | 1992-02-17 |
Family
ID=31583285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5803890U Pending JPH0418435U (en) | 1990-06-01 | 1990-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0418435U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010113792A1 (en) * | 2009-03-31 | 2010-10-07 | 栗田工業株式会社 | Apparatus and method for treating etching solution |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6294939A (en) * | 1985-10-22 | 1987-05-01 | Nec Corp | Circulative filtering system of chemical solution |
| JPS63110731A (en) * | 1986-10-29 | 1988-05-16 | Nec Kyushu Ltd | Semiconductor substrate processor |
| JPH01244622A (en) * | 1988-03-25 | 1989-09-29 | Nec Corp | Silicon substrate processor |
-
1990
- 1990-06-01 JP JP5803890U patent/JPH0418435U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6294939A (en) * | 1985-10-22 | 1987-05-01 | Nec Corp | Circulative filtering system of chemical solution |
| JPS63110731A (en) * | 1986-10-29 | 1988-05-16 | Nec Kyushu Ltd | Semiconductor substrate processor |
| JPH01244622A (en) * | 1988-03-25 | 1989-09-29 | Nec Corp | Silicon substrate processor |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010113792A1 (en) * | 2009-03-31 | 2010-10-07 | 栗田工業株式会社 | Apparatus and method for treating etching solution |
| KR20120002522A (en) * | 2009-03-31 | 2012-01-05 | 쿠리타 고교 가부시키가이샤 | Apparatus and method for treating etching solution |
| CN102356454A (en) * | 2009-03-31 | 2012-02-15 | 栗田工业株式会社 | Apparatus and method for treating etching solution |
| CN102356454B (en) * | 2009-03-31 | 2014-03-26 | 栗田工业株式会社 | Apparatus and method for treating etching solution |
| JP5477375B2 (en) * | 2009-03-31 | 2014-04-23 | 栗田工業株式会社 | Etching solution processing apparatus and processing method |
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