JPH04181607A - Conductive carbon paste - Google Patents
Conductive carbon pasteInfo
- Publication number
- JPH04181607A JPH04181607A JP2306144A JP30614490A JPH04181607A JP H04181607 A JPH04181607 A JP H04181607A JP 2306144 A JP2306144 A JP 2306144A JP 30614490 A JP30614490 A JP 30614490A JP H04181607 A JPH04181607 A JP H04181607A
- Authority
- JP
- Japan
- Prior art keywords
- carbon paste
- conductive carbon
- carbon powder
- carbon
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 42
- 239000002245 particle Substances 0.000 claims abstract description 21
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 11
- 239000000057 synthetic resin Substances 0.000 claims abstract description 11
- 239000002904 solvent Substances 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 abstract description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 abstract description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003973 paint Substances 0.000 abstract description 2
- 239000000843 powder Substances 0.000 abstract description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 abstract description 2
- 229920002554 vinyl polymer Polymers 0.000 abstract description 2
- 239000008096 xylene Substances 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 9
- 229920006267 polyester film Polymers 0.000 description 5
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 241000282320 Panthera leo Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 235000019241 carbon black Nutrition 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000001132 ultrasonic dispersion Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Non-Adjustable Resistors (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント回路基板、特にフレキシブルプリン
ト回路基板の電気入力用接点に使用される導電性カーボ
ンペーストに関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a conductive carbon paste used for electrical input contacts of printed circuit boards, particularly flexible printed circuit boards.
〔従来の技術とその問題点］
導電性カーボンペーストは、その組成物中に炭素粉末を
含有させることで導電性を発渾する。[Prior art and its problems] Conductive carbon paste develops conductivity by incorporating carbon powder into its composition.
これらの組成物には、導電性を高めるためや導電性の経
時的な変化を押えるために、カーボン粉末とグラファイ
ト粉末を混合したり、また、それらの粒径の異なるもの
を混合して用いることが一般的である。 この導電性カ
ーボンペース）・には、平均粒径として数μｍであるが
、最大粒径では数十μｍの炭素粉末を含有している。In order to increase conductivity or suppress changes in conductivity over time, these compositions may include a mixture of carbon powder and graphite powder, or a mixture of these powders with different particle sizes. is common. This conductive carbon paste) contains carbon powder with an average particle size of several μm and a maximum particle size of several tens of μm.
ところで、このＫＭ性カーボンペーストを用いて、ポリ
エステルフィルム等の基材にスクリーン印刷等の方法に
より所望のパターンを印刷し、熱風乾燥機等で硬化させ
、電気入力用ソートとする。By the way, using this KM carbon paste, a desired pattern is printed on a base material such as a polyester film by a method such as screen printing, and the paste is cured using a hot air dryer or the like to form a sort for electrical input.
このソートは、絶縁性のスベ〜サーを介して上下２枚重
ね合わせ、電気入力用接点として用いられる。In this sort, two upper and lower panels are stacked together via an insulating spacer and used as electrical input contacts.
この場合、導電性カーボンペーストからなる硬化膜表面
の凹凸が大きいために、電気入力部の薄膜化は困難であ
り、また、極端には入力操作をしなくても入力状態を呈
し、人力の信頼性が極めて劣るという問題点を有してい
る。In this case, because the surface of the cured film made of conductive carbon paste has large irregularities, it is difficult to make the electrical input section thinner, and in extreme cases, the input state can be maintained even without input operation, making it difficult to rely on human power. The problem is that the performance is extremely poor.
本発明者らは、このような問題点を解決するために、導
電性カーボンペースト中の炭素粉末の最大粒径をできる
だけ小さくするという事実が有効であることを見出し、
本発明に至った。The present inventors have found that in order to solve such problems, it is effective to reduce the maximum particle size of the carbon powder in the conductive carbon paste as much as possible,
This led to the present invention.
すなわち、本発明は、炭素粉末及び合成樹脂を主成分と
する導電性カーボンペーストにおいて、炭素粉末の量が
合成樹脂１００重量部に対して、２０〜１００重量部で
あり、かつ炭素粉末の最大粒径が２０μｍ以下であるこ
とを特徴とする導電性カーボンペーストである。That is, the present invention provides a conductive carbon paste containing carbon powder and synthetic resin as main components, in which the amount of carbon powder is 20 to 100 parts by weight based on 100 parts by weight of synthetic resin, and the largest particle of carbon powder is This is a conductive carbon paste characterized by having a diameter of 20 μm or less.
本発明における炭素粉末の種類としては、導電性カーボ
ンブランクが好ましい。As the type of carbon powder in the present invention, conductive carbon blank is preferable.
導電性カーボンブラックとしては、例えば、デンカブラ
ック（電気化学工業■製、商品名）、ケッチエンブラッ
クＥＣ（ライオン■製、商品名）、パルカンＸＣ−７２
（キャボット■製、商品名）、Ｍ Ｓ −５００（旭カ
ーボン■製、商品名） 、＃！３７５０（三菱化成昧製
、商品名）等が挙げられる。Examples of conductive carbon black include Denka Black (manufactured by Denki Kagaku Kogyo ■, trade name), Ketchen Black EC (manufactured by Lion ■, trade name), and Palkan XC-72.
(manufactured by Cabot ■, product name), MS-500 (manufactured by Asahi Carbon ■, product name), #! 3750 (manufactured by Mitsubishi Kasei, trade name) and the like.
これらのカーボンブランクは、それ自体、凝集しており
、銘柄によっては粒径の大きいもので数闘あり、また、
凝集力の度合いにも強弱がある。These carbon blanks themselves are agglomerated, and depending on the brand, there are some with large particle sizes, and
There are also strengths and weaknesses in the degree of cohesion.
ところで、導電性カーボンペーストは、主成分である炭
素粉末と合成樹脂、及び溶剤をミキサー等で混合し、更
に、混練機を用いて製造する。By the way, conductive carbon paste is produced by mixing carbon powder, which is the main component, a synthetic resin, and a solvent using a mixer or the like, and then using a kneader.
混練機としては、播潰機、ロール、ニーダ−等を使用す
ることができるが、炭素粉末を均一に分散させ、しかも
短時間で微細化するためには、ロールが最も通している
。As a kneader, a crusher, a roll, a kneader, etc. can be used, but in order to uniformly disperse the carbon powder and to make it fine in a short time, a roll is most suitable.
本発明における炭素粉末の粒径は、あくまで、カーボン
ペーストの状態になったときに、最大粒径として、２０
μｍ以下であればよい。The particle size of the carbon powder in the present invention is limited to a maximum particle size of 20
It is sufficient if it is not more than μm.
この最大粒径が２０μｍを越える場合、本発明の目的で
ある入力信転性を改良することができない。If this maximum particle size exceeds 20 μm, it is impossible to improve the input reliability, which is the object of the present invention.
前記導電性カーボンブラックの中で凝集力が非常に強い
ものは、本発明において使用できるが、ロールによる混
練回数が多くなり、必ずしも実用的ではない。Among the conductive carbon blacks described above, those having very strong cohesive force can be used in the present invention, but the number of kneading operations using rolls is increased, which is not necessarily practical.
また、グラファイト粉末は、通常入手できるものでは、
前記導電性カーボンブランクと比べて、カーボンペース
ト状での最大粒径、及び凝集力が大きく、好ましくない
。In addition, graphite powder is not normally available.
Compared to the conductive carbon blank, the maximum particle size and cohesive force in the form of carbon paste are large, which is not preferable.
本発明における炭素粉末の量は、合成樹脂１００重量部
に対して、２０〜１００重量部であり、好ましくは、３
０〜７０重量部である。The amount of carbon powder in the present invention is 20 to 100 parts by weight, preferably 3 parts by weight, based on 100 parts by weight of the synthetic resin.
It is 0 to 70 parts by weight.
炭素粉末の量が２０重量部未満の場合には、導電性が極
めて不安定になり、１００重量部を越える場合には、プ
リント回路基板への密着性が劣り、いずれも実用に耐え
ない。When the amount of carbon powder is less than 20 parts by weight, the conductivity becomes extremely unstable, and when it exceeds 100 parts by weight, the adhesion to the printed circuit board is poor, and neither is practical.
本発明における合成樹脂としては、通常の塗料用樹脂な
らば全て使用することができる。As the synthetic resin in the present invention, all common resins for paints can be used.
例えば、ウレタン系樹脂、ビニール系樹脂、エポキシ系
樹脂、フェノール系樹脂、メラミン系樹脂、アルキッド
系樹脂、エポキシアクリレート系樹脂、ポリエステルア
クリレート系樹脂等である。Examples include urethane resin, vinyl resin, epoxy resin, phenol resin, melamine resin, alkyd resin, epoxy acrylate resin, polyester acrylate resin, and the like.
これらの樹脂は、加熱乾燥、加熱硬化、紫外線硬化、電
子線硬化等の方法により硬化させる。These resins are cured by methods such as heat drying, heat curing, ultraviolet curing, and electron beam curing.
本発明のカーボンペーストには、流動性を付与するため
に、溶剤を添加することが一般的である。A solvent is generally added to the carbon paste of the present invention in order to impart fluidity to the carbon paste.
その溶剤としては、例えば、キシレン、シクロヘキサノ
ン、メチルシクロヘキサノン、ジイソブチルケトン、イ
ソホロン、エチルセロソルブ、ブチルセロソルブ、メチ
ルカルピトール、エチルカルピトール、カルピトールア
セテート、ブチルセロソルブアセテート等が挙げられる
。Examples of the solvent include xylene, cyclohexanone, methylcyclohexanone, diisobutyl ketone, isophorone, ethyl cellosolve, butyl cellosolve, methyl calpitol, ethyl calpitol, carpitol acetate, butyl cellosolve acetate, and the like.
これらの溶剤は、合成樹脂の溶解性、プリント回路基板
への転写方法、作業環境条件、硬化条件等により適宜選
択し、１種又は２種以上混合して用いられる。These solvents are appropriately selected depending on the solubility of the synthetic resin, the transfer method to the printed circuit board, the working environment conditions, the curing conditions, etc., and are used singly or in combination of two or more.
また、溶剤の添加量は、特に限定されず、上記の各条件
を考慮して、適宜法められる。Further, the amount of the solvent added is not particularly limited, and can be determined as appropriate in consideration of each of the above conditions.
更に、導電性カーボンペーストの特性を損なわない範囲
において、種々の添加剤を加えることは差し支えない。Furthermore, various additives may be added as long as the properties of the conductive carbon paste are not impaired.
ここにいう添加剤とは、微粒子シリカ、ヘントナイト等
、最大粒径１０μｍ以下の無機物、及びこれらを有機物
で処理したもの、また、消泡剤、分散剤、カップリング
剤等である。The additives mentioned here include inorganic substances having a maximum particle size of 10 μm or less, such as fine-particle silica and hentonite, and those treated with organic substances, as well as antifoaming agents, dispersants, coupling agents, and the like.
〔実施例） 以下、実施例により本発明を具体的に説明する。〔Example) Hereinafter, the present invention will be specifically explained with reference to Examples.
なお、得られたカーボンペースト及びその硬化膜につい
て、次の試験により評価した。The obtained carbon paste and its cured film were evaluated by the following tests.
・最大粒径
カーボンペーストを粒度ゲージ（ヨシミツ精機■製）の
溝の深い所へ乗せ、かきとり刃をその所の長手方向に直
角、及び粒度ゲージ面に垂直になるように押しあてる。・Place the carbon paste with the maximum particle size in the deep groove of a particle size gauge (manufactured by Yoshimitsu Seiki ■) and press the scraping blade against it so that it is perpendicular to the longitudinal direction of that area and perpendicular to the surface of the particle size gauge.
かきとり刃を目盛０の方向へ均等な速さで引き動かし
、線が出たところの目盛を読み、これを量大粒径とした
。The scraping blade was moved in the direction of 0 on the scale at an even speed, and the scale where the line appeared was read, and this was determined to be the large particle size.
・平均粒径
カーボンペーストをブチルセロソルブアセテートで希釈
し、超音波分散機に５分間かけ、粒径分布測定機（堀場
製作所■製）で測定した。- Average particle size The carbon paste was diluted with butyl cellosolve acetate, subjected to an ultrasonic dispersion machine for 5 minutes, and measured with a particle size distribution measuring machine (manufactured by Horiba, Ltd.).
・表面粗さ
ポリエステルフィルムの面にカーボンペーストによるパ
ターン（長方形、５０ｍｍ Ｘ ’１０ｍｍ ）をスク
リーン印刷し、熱風乾燥機（１００’Ｃ１３０分間）に
て硬化させた。 得られた硬化膜について、表面粗さ計
（小板研究所■製）で中心線粗さを測定した。-Surface Roughness A carbon paste pattern (rectangular, 50 mm x 10 mm) was screen printed on the surface of the polyester film and cured in a hot air dryer (100'C for 130 minutes). The center line roughness of the obtained cured film was measured using a surface roughness meter (manufactured by Koita Research Institute).
・密着性
上記と同様の硬化膜を用い、ＪＩＳ−に５４００に準じ
て試験した。- Adhesion Using the same cured film as above, it was tested according to JIS-5400.
この硬化膜にカンタ−ナイフで直交するように切り目（
１ｍｍ間隔、縦横各１１本）を入れ、１００個の枡目を
作った。 その上にセロテープを充分に圧着した後、急
激に引き剥がし、１００個の枡目のうちポリエステルフ
ィルム面に残った枡目の個数を分数で表わし、密着性と
した。Make perpendicular cuts (
11 squares each in length and width at 1 mm intervals) to make 100 squares. After sufficiently pressing cellophane tape onto the film, it was rapidly peeled off, and the number of squares remaining on the polyester film surface out of 100 squares was expressed as a fraction, and the adhesion was determined.
・表面抵抗
ポリエステルフィルムの面にカーボンペーストによる５
本線（輻２１ＩＩｍ、長さ８０Ｉ）をスクリーン印刷し
、熱風乾燥機（１００°Ｃ２３０分間）にて硬化させた
。 各５木線について電気抵抗値と膜厚を測定し、その
平均値を求め、膜厚１０μ−での電気抵抗値を表面抵抗
（ｏｈｍ／ｓｑ）とした。・Surface resistance 5 with carbon paste on the surface of the polyester film
The main line (radius 21 IIm, length 80I) was screen printed and cured in a hot air dryer (100°C for 230 minutes). The electrical resistance value and film thickness of each five-wood wire were measured, the average value thereof was determined, and the electrical resistance value at a film thickness of 10 μm was defined as the surface resistance (ohm/sq).
・入力借問性
２枚のガラス板面に、予め、端子として銀ペーストを印
刷・硬化させておく。 次に、これらのガラス板面にカ
ーボンペーストによるパターン（長方形、５０ｍｍ Ｘ
７０ｍｍ ）をスクリーン印刷し、熱風乾燥機（１０
０°Ｃ１３０分間）にて硬化させた。 更に、硬化膜面
が向かい合うように、１枚目のガラス板を上側に、及び
２枚目のガラス板を下側にして、それらの間に絶縁用ス
ペーサーとしてポリエステルフィルム（厚さ２５μ転長
四角状ガスケント）を挟んで重ね合わせた。・Print and harden silver paste as a terminal on the surfaces of two glass plates in advance. Next, a pattern (rectangular, 50 mm x
70mm) was screen printed, and a hot air dryer (10mm) was screen printed.
It was cured at 0°C for 130 minutes). Furthermore, with the cured film surfaces facing each other, place the first glass plate on the top side and the second glass plate on the bottom side, and place a polyester film (25μ thick rolled square) between them as an insulating spacer. Gaskent) were sandwiched and stacked one on top of the other.
上下２個の端子間に１００■の電圧をかけ、電気絶縁性
を測定した。Electrical insulation was measured by applying a voltage of 100 μ between the upper and lower terminals.
このとき、硬化膜を通して短絡なしく０）又は、短絡あ
り（×）で、入力信顧性の目安とした。At this time, the input reliability was determined by 0 (no short circuit) or 0 (x) with short circuit through the cured film.
実施例１〜３及び比較例１．２
第１表に示す割合で、ウレタン系樹脂ハイプレン（三井
東圧化学■製、商品名）とデンカブラック（１！１気化
学工業■製、商品名）を混合し、更に、ブチルセロソル
ブアセテートを加え、３本ロールで５回混練し、カーボ
ンペーストを得た。Examples 1 to 3 and Comparative Example 1.2 Urethane resin Hyprene (manufactured by Mitsui Toatsu Chemical ■, trade name) and Denka Black (manufactured by 1!1 Ki Kagaku Kogyo ■, trade name) were used in the proportions shown in Table 1. were mixed, and further, butyl cellosolve acetate was added and kneaded five times using three rolls to obtain a carbon paste.
ブチルセロソルブアセテートの量は、カーボンペースト
の粘度が４００〜６００ ｐｏｉｓｅになるように加え
た。このことは、以下の実施例及び比較例において、全
て同様である。The amount of butyl cellosolve acetate was added so that the viscosity of the carbon paste was 400 to 600 poise. This is the same in all of the following Examples and Comparative Examples.
得られたカーボンペースト及びその硬化膜を前記試験に
より評価し、その結果を第１表に示した。The obtained carbon paste and its cured film were evaluated by the above test, and the results are shown in Table 1.
実施例４
実施例１と同様の操作で、ただし、デンカブランク３０
部をケッチエンブランクＥＣ（ライオン■製、商品名）
４５部に代えて、カーボンペーストを得た。Example 4 Same operation as Example 1, except that Denka Blank 30
Ketch enblank EC (manufactured by Lion ■, product name)
Carbon paste was obtained in place of 45 parts.
得られたカーボンペースト及びその硬化膜を前記試験に
より評価し、その結果を第１表に示した。The obtained carbon paste and its cured film were evaluated by the above test, and the results are shown in Table 1.
実施例５．６
実施例４において、ロール混練回数だけを変えて、カー
ボンペーストを得た。Example 5.6 In Example 4, a carbon paste was obtained by changing only the number of times of roll kneading.
得られたカーボンペースト及びその硬化膜を前記試験に
より評価し、その結果を第１表に示した。The obtained carbon paste and its cured film were evaluated by the above test, and the results are shown in Table 1.
比較例３
実施例４において、ケッチエンブラックＥＣの１／３量
（１５部）をＣＰＢ−５０００（グラファイト粉末、日
本黒鉛■製、商品名）１５部に代えて、カーボンペース
トを得た。Comparative Example 3 In Example 4, 1/3 amount (15 parts) of Ketchien Black EC was replaced with 15 parts of CPB-5000 (graphite powder, manufactured by Nippon Graphite ■, trade name) to obtain a carbon paste.
得られたカーボンペースト及びその硬化膜を前記試験に
より評価し、その結果を第１表に示した。The obtained carbon paste and its cured film were evaluated by the above test, and the results are shown in Table 1.
比較例４
比較例３において、ロール混練回数だけを変えて、カー
ボンペーストを得た。Comparative Example 4 In Comparative Example 3, a carbon paste was obtained by changing only the number of roll kneading times.
得うれたカーボンペースト及びその硬化膜を前記試験に
より評価し、その結果を第１表に示した。The obtained carbon paste and its cured film were evaluated by the above tests, and the results are shown in Table 1.
／
〔発明の効果］
本発明の導電性カーボンペーストによる硬化膜は、従来
技術では達成されなかった優れたプリント回路基板への
密着性、かつ、良好な入力の信軽性を有している。/ [Effects of the Invention] The cured film made of the conductive carbon paste of the present invention has excellent adhesion to a printed circuit board and good reliability of input, which was not achieved with the prior art.
すなわち、カーボンペースト中の炭素粉末の量が本発明
の範囲外である比較例１．２において、入力信頼性は良
好であったが、比較例１では表面抵抗が高く、比較例２
では密着性が不良であった。That is, in Comparative Example 1.2 in which the amount of carbon powder in the carbon paste was outside the range of the present invention, the input reliability was good, but in Comparative Example 1 the surface resistance was high, and in Comparative Example 2
Adhesion was poor.
更に、カーボンペースト中の炭素粉末の最大粒径が本発
明の範囲外である比較例３．４では、表面抵抗と密着性
は良好であるが、入力信頼性が不良であった。Furthermore, in Comparative Example 3.4, in which the maximum particle size of the carbon powder in the carbon paste was outside the range of the present invention, the surface resistance and adhesion were good, but the input reliability was poor.
これに対して、カーボンペースト中の炭素粉末の量及び
最大粒径が本発明の範囲内である実施例１〜６は、これ
らの性能が全て優れているのが明らかであり、本発明の
意義は大きい。On the other hand, in Examples 1 to 6, in which the amount of carbon powder in the carbon paste and the maximum particle size are within the range of the present invention, it is clear that all of these performances are excellent, and the significance of the present invention is is big.
Claims (1)
ーボンペーストにおいて、炭素粉末の量が合成樹脂１０
０重量部に対して、２０〜１００重量部であり、かつ炭
素粉末の最大粒径が２０μｍ以下であることを特徴とす
る導電性カーボンペースト。(1). In a conductive carbon paste mainly composed of carbon powder and synthetic resin, the amount of carbon powder is 10% of the synthetic resin.
A conductive carbon paste characterized in that the amount is 20 to 100 parts by weight relative to 0 parts by weight, and the maximum particle size of the carbon powder is 20 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2306144A JPH04181607A (en) | 1990-11-14 | 1990-11-14 | Conductive carbon paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2306144A JPH04181607A (en) | 1990-11-14 | 1990-11-14 | Conductive carbon paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04181607A true JPH04181607A (en) | 1992-06-29 |
Family
ID=17953586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2306144A Pending JPH04181607A (en) | 1990-11-14 | 1990-11-14 | Conductive carbon paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04181607A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6381121B1 (en) | 1999-05-24 | 2002-04-30 | Showa Denko Kabushiki Kaisha | Solid electrolytic capacitor |
| US6556427B2 (en) | 2000-03-28 | 2003-04-29 | Showa Denko Kabushiki Kaisha | Solid electrolytic capacitor and method for producing the same |
| JP2007005460A (en) * | 2005-06-22 | 2007-01-11 | Tdk Corp | Electronic component and manufacturing method thereof |
-
1990
- 1990-11-14 JP JP2306144A patent/JPH04181607A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6381121B1 (en) | 1999-05-24 | 2002-04-30 | Showa Denko Kabushiki Kaisha | Solid electrolytic capacitor |
| US6783703B2 (en) | 1999-05-24 | 2004-08-31 | Showa Denko Kabushiki Kaisha | Solid electrolytic capacitor and method for producing the same |
| US7060205B2 (en) | 1999-05-24 | 2006-06-13 | Showa Denko Kabushiki Kaisha | Solid electrolytic capacitor and method for producing the same |
| US6556427B2 (en) | 2000-03-28 | 2003-04-29 | Showa Denko Kabushiki Kaisha | Solid electrolytic capacitor and method for producing the same |
| JP2007005460A (en) * | 2005-06-22 | 2007-01-11 | Tdk Corp | Electronic component and manufacturing method thereof |
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