JPH04174979A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH04174979A JPH04174979A JP2301411A JP30141190A JPH04174979A JP H04174979 A JPH04174979 A JP H04174979A JP 2301411 A JP2301411 A JP 2301411A JP 30141190 A JP30141190 A JP 30141190A JP H04174979 A JPH04174979 A JP H04174979A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- lead terminal
- soldering
- board
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims abstract description 19
- 230000013011 mating Effects 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は、プリント基板の端面に配置される表面実装タ
イプのコネクタのランドを改良したプリント配線基板に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board in which the land of a surface mount type connector disposed on the end face of the printed wiring board is improved.
［従来の技術］
従来、ＳＭＴタイプでアングルタイプのボードｔＯボー
ドコネクタは、通常、基板の端面部に配置されることが
多く、たとえば、第４図に示すように構成されている。[Prior Art] Conventionally, an SMT type and angle type board-to-O board connector is usually disposed at an end face of a board, and is configured, for example, as shown in FIG. 4.
第４図において、２１はプリント基板、２２はコネクタ
、２３はリード端子、２４は補強板、２５は半田付はラ
ンドである。In FIG. 4, 21 is a printed circuit board, 22 is a connector, 23 is a lead terminal, 24 is a reinforcing plate, and 25 is a soldering land.
［発明が解決しようとする課題］
しかしなから、第４図に示した従来例では、そのコネク
タ２２をリフロー半田付けによって実装する際に、下記
のような問題点があった。[Problems to be Solved by the Invention] However, the conventional example shown in FIG. 4 has the following problems when the connector 22 is mounted by reflow soldering.
すなわち、第４図に示したタイプのコネクタ２２では、
通常、表面実装部品であるため、チップ部品と同様に、
チップ部品マウンタによりマウントし、リフロー装置に
より、半田付けを行う。ところが、この場合、コネクタ
２２の接続強度を上げるため、半田付はラント２５をで
きるだけ大きくとる場合が多い。That is, in the connector 22 of the type shown in FIG.
Since it is usually a surface-mounted component, like a chip component,
Mount using a chip component mounter and solder using a reflow device. However, in this case, in order to increase the connection strength of the connector 22, the soldering runt 25 is often made as large as possible.
そのため、リフロー半田付は時において、コネクタ２２
がセルフアライメントによりプリント基板２１の内側方
向へ引張られてしまい、実際のマウント位置からずれて
しまう。これは半田付はランド２５をリード端子２３の
長手方向に長くランドを形成するために発生し、コネク
タ２２が奥側へ１３動じてしまい、相手側のコネクタが
差し込めなくなることがあった。Therefore, reflow soldering sometimes
is pulled inward of the printed circuit board 21 due to self-alignment, and is displaced from the actual mounting position. This occurs because the soldering makes the land 25 long in the longitudinal direction of the lead terminal 23, causing the connector 22 to move 13 to the back, making it impossible to insert the mating connector.
本発明は、上記のような問題点を解決しようとするもの
である。すなわち、本発明は、コネクタのリード端子の
半田付はランドの長手方向を規定することにより、相手
側のコネクタの取りつけに支障がないようにしたプリン
ト配線基板を提供することを目的とするものである。The present invention aims to solve the above problems. That is, an object of the present invention is to provide a printed wiring board in which soldering of the lead terminals of the connector is done by specifying the longitudinal direction of the land so that there is no problem in attaching the mating connector. be.
［課題を解決するための手段］
上記目的を達成するために、本発明は、基板の端面にア
ングルタイプのコネクタを配置するプリント配線基板に
おいて、該コネクタに取りつく相手側のコネクタを電気
的に接続した状態で、その相手側コネクタが該プリント
配線基板に最も接近した状態において、該コネクタのリ
ード端子の先端に沿って、半田付はランドの端面を設け
た。[Means for Solving the Problems] In order to achieve the above object, the present invention provides a printed wiring board in which an angle-type connector is disposed on the end face of the board, in which a mating connector attached to the connector is electrically connected to the connector. In the connected state, with the mating connector closest to the printed wiring board, the end face of the soldering land was provided along the tip of the lead terminal of the connector.
［作 用］
本゛発明によれは、コネクタの半田付はランドの長手方
向の先端か、相手側のコネクタを取りつけたとき、最も
奥側に配置されたコネクタのリード端子の先端と同し位
置に設定されているので、コネクタかプリント基板の内
側方向へ引張られることか少なく、その方向への移動か
殆どなくなって、相手側のコネクタを差しこめなくなる
ということが避けられる。[Function] According to the present invention, the connector is soldered at the longitudinal end of the land, or at the same position as the end of the lead terminal of the connector located furthest back when the mating connector is attached. Since it is set to , the connector is less likely to be pulled inward of the printed circuit board, and there is almost no movement in that direction, which prevents the mating connector from being unable to be inserted.
［実 施 例コ
第１図および第２図は本発明の第１実施例を示している
。Embodiment FIGS. 1 and 2 show a first embodiment of the present invention.
第１図において、１はプリント基板、２は該基板１の端
面に配置されたコネクタ、３はリード端子、４は該コネ
クタ２の取りつけ強度を増すための補強板、５は該リー
ト端子３の半田付けをする半田付はランドである。In FIG. 1, 1 is a printed circuit board, 2 is a connector disposed on the end surface of the board 1, 3 is a lead terminal, 4 is a reinforcing plate for increasing the mounting strength of the connector 2, and 5 is the lead terminal 3. The soldering material used for soldering is a land.
また第２図において、６はレジストである。Further, in FIG. 2, 6 is a resist.
すなわち、この第１実施例では、リード端子３の半田付
は部の端面をレジスト６によって規定し、つまり、その
部の半田付はラント５の長さを規定したものである。That is, in this first embodiment, the end face of the soldering portion of the lead terminal 3 is defined by the resist 6, that is, the length of the runt 5 is defined by the soldering of that portion.
第１図および第２図に示すように構成されたプリント配
線基板においては、コネクタ２のリート端子３の半田付
はランド５の長手方向がレジスト６によって規定されて
いるので、第１に、半田付はランド５が存在する部分ま
でセルフアライメントにより部品が移動しても、相手側
のコネクタが取りつけられなくなることがない、第２に
、多少プリント基板１の端面から外側へ突出してマウン
トされた場合であっても、セルフアライメントにより、
適正の位置へ移動することが期待できる。In the printed wiring board configured as shown in FIGS. 1 and 2, the longitudinal direction of the land 5 is defined by the resist 6 when soldering the lead terminal 3 of the connector 2. Even if the component moves to the part where the land 5 is present by self-alignment, the mating connector will not become unable to be attached.Secondly, if the component is mounted so as to protrude outward from the end surface of the printed circuit board 1 to some extent. However, due to self-alignment,
You can expect it to move to an appropriate position.
第３に、このため、コストアップなく、コネクタ２の実
装精度を向上させることがで鮒る。Thirdly, it is possible to improve the mounting accuracy of the connector 2 without increasing costs.
第４に、コネクタ２の取りつけ位置の不良確証が目視に
より可能となる。Fourthly, it becomes possible to visually confirm that the mounting position of the connector 2 is defective.
′ｆＳ３図は本発明の第２実施例を示している。Figure 'fS3 shows a second embodiment of the invention.
第３図において、１１はプリント基板、１２は該基板１
１の端面に配置されたコネクタ、１３はリートｆＪ子、
１４は補強板、１５は該。In FIG. 3, 11 is a printed circuit board, and 12 is the printed circuit board 1.
1 is a connector placed on the end face of 1, 13 is a REET fJ connector,
14 is a reinforcing plate, and 15 is the same.
リード端子１３の半田付けをする半田付はランドである
。The solder to which the lead terminal 13 is soldered is a land.
この第２実施例では、信号線パターンをリード端子１３
の長手方向の該基板１１の内側に引き出されないように
したものである。In this second embodiment, the signal line pattern is connected to the lead terminal 13.
This prevents the substrate 11 from being pulled out inside the substrate 11 in the longitudinal direction.
このようにすることによって、この第２実施においても
、前述の第１実施例と同等の効果か得られる。By doing so, the second embodiment can also achieve the same effect as the first embodiment described above.
［発明の効果］
以上説明したように、本発明によれば、コネクタのリー
ト端子の半田付はランドの長手方向を規定しているので
、半田付はラントか存在する部分まで、セルフアライメ
ントにより、部品が移動しても、相手側のコネクタが取
りつけられなくなることはなく、また多少プリント基板
の端面から外側へ突出してマウントされた場合であって
も、セルフアライメントにより、通正の位置へ移動する
ことか期待てきる。このため、コストアップなく、コネ
クタの実装精度を向上させることかできる。しかも、目
視により、コネクタの取りつけ位置の不良確認か可能と
なる。[Effects of the Invention] As explained above, according to the present invention, since the soldering of the lead terminal of the connector defines the longitudinal direction of the land, the soldering can be performed up to the part where the runt is present by self-alignment. Even if the component moves, the mating connector will not become unattached, and even if it is mounted slightly protruding from the edge of the printed circuit board, it will move to the correct position due to self-alignment. I'm looking forward to it. Therefore, the mounting accuracy of the connector can be improved without increasing costs. In addition, it is possible to visually confirm whether the connector is installed in a defective position.
第１図は本発明の第１実施例を示した斜視図、第２図は
同しく側面断面図、第３図は本発明の第２実施例を示し
た斜視図、第４図は従来の技術の一例を示した斜視図で
ある。
１・・・プリント基板 ２・・・コネクタ３・・・
ソート端子 ４・・・補強板５・・・半田ラント
６・・・レジスト１１・・・プリント基板
１２・・・コネクタ１３・・・リード端子 １４・
・・補強板１５・・・半田ラント ２２・・・コネ
クタ２３・・・リート端子 ２４・・・補強板２５
・・・半田付はランド
第１ＩＩ
第２図Fig. 1 is a perspective view showing the first embodiment of the present invention, Fig. 2 is a side sectional view, Fig. 3 is a perspective view showing the second embodiment of the invention, and Fig. 4 is a conventional FIG. 2 is a perspective view showing an example of the technique. 1... Printed circuit board 2... Connector 3...
Sort terminal 4...Reinforcement plate 5...Solder runt 6...Resist 11...Printed circuit board
12... Connector 13... Lead terminal 14.
... Reinforcement plate 15 ... Solder runt 22 ... Connector 23 ... Lead terminal 24 ... Reinforcement board 25
...Soldering is done on land 1II Fig. 2
Claims (1)
プリント基板において、該コネクタに取りつく相手側の
コネクタを電気的に接続した状態で、その相手側のコネ
クタが該プリント基板に最も接近した状態において、該
コネクタのリード端子の先端に沿って、半田付けランド
端面部が設けられていることを特徴とするプリント配線
基板。1. In a printed circuit board in which an angle type connector is arranged on the end face of the board, when the mating connector attached to the connector is electrically connected and the mating connector is closest to the printed circuit board, A printed wiring board characterized in that a soldering land end surface portion is provided along the tip of a lead terminal of the connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2301411A JPH04174979A (en) | 1990-11-07 | 1990-11-07 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2301411A JPH04174979A (en) | 1990-11-07 | 1990-11-07 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04174979A true JPH04174979A (en) | 1992-06-23 |
Family
ID=17896556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2301411A Pending JPH04174979A (en) | 1990-11-07 | 1990-11-07 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04174979A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020071452A (en) * | 2001-03-05 | 2002-09-12 | 니혼 앗사쿠단시세이조 가부시키가이샤 | Horizontal electric connector |
| JP2012252780A (en) * | 2011-05-31 | 2012-12-20 | Jst Mfg Co Ltd | Electric connector |
-
1990
- 1990-11-07 JP JP2301411A patent/JPH04174979A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020071452A (en) * | 2001-03-05 | 2002-09-12 | 니혼 앗사쿠단시세이조 가부시키가이샤 | Horizontal electric connector |
| JP2012252780A (en) * | 2011-05-31 | 2012-12-20 | Jst Mfg Co Ltd | Electric connector |
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