JPH0417326U - - Google Patents
Info
- Publication number
- JPH0417326U JPH0417326U JP5769190U JP5769190U JPH0417326U JP H0417326 U JPH0417326 U JP H0417326U JP 5769190 U JP5769190 U JP 5769190U JP 5769190 U JP5769190 U JP 5769190U JP H0417326 U JPH0417326 U JP H0417326U
- Authority
- JP
- Japan
- Prior art keywords
- clamp
- moving means
- clamp member
- separating
- swingably supported
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009966 trimming Methods 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 1
Landscapes
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5769190U JPH0718426Y2 (ja) | 1990-05-30 | 1990-05-30 | クランプ装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5769190U JPH0718426Y2 (ja) | 1990-05-30 | 1990-05-30 | クランプ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0417326U true JPH0417326U (enrdf_load_stackoverflow) | 1992-02-13 |
JPH0718426Y2 JPH0718426Y2 (ja) | 1995-05-01 |
Family
ID=31582632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5769190U Expired - Fee Related JPH0718426Y2 (ja) | 1990-05-30 | 1990-05-30 | クランプ装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0718426Y2 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023049466A (ja) * | 2021-09-29 | 2023-04-10 | 株式会社イノアックコーポレーション | 金型の固定機構、および、発泡成形部材 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7517551B2 (en) | 2000-05-12 | 2009-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a light-emitting device |
SG113448A1 (en) | 2002-02-25 | 2005-08-29 | Semiconductor Energy Lab | Fabrication system and a fabrication method of a light emitting device |
EP1369499A3 (en) | 2002-04-15 | 2004-10-20 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating light-emitting device and apparatus for manufacturing light-emitting device |
-
1990
- 1990-05-30 JP JP5769190U patent/JPH0718426Y2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023049466A (ja) * | 2021-09-29 | 2023-04-10 | 株式会社イノアックコーポレーション | 金型の固定機構、および、発泡成形部材 |
Also Published As
Publication number | Publication date |
---|---|
JPH0718426Y2 (ja) | 1995-05-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |