JPH0416823U - - Google Patents
Info
- Publication number
- JPH0416823U JPH0416823U JP5716190U JP5716190U JPH0416823U JP H0416823 U JPH0416823 U JP H0416823U JP 5716190 U JP5716190 U JP 5716190U JP 5716190 U JP5716190 U JP 5716190U JP H0416823 U JPH0416823 U JP H0416823U
- Authority
- JP
- Japan
- Prior art keywords
- wiring material
- thickness
- utility
- melting point
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 229920006122 polyamide resin Polymers 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Organic Insulating Materials (AREA)
Description
図面は本考案の配線材の断面説明図である。 １……導体、２……ポリアミド被覆層。 The drawing is an explanatory cross-sectional view of the wiring material of the present invention. 1... Conductor, 2... Polyamide coating layer.
Claims (1)
０．３mm以下の厚さに押出被覆してなることを特
徴とする配線材。 A wiring material comprising a conductor coated with a polyamide resin having a melting point of 280° C. or higher to a thickness of 0.3 mm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5716190U JPH0416823U (en) | 1990-05-30 | 1990-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5716190U JPH0416823U (en) | 1990-05-30 | 1990-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0416823U true JPH0416823U (en) | 1992-02-12 |
Family
ID=31581627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5716190U Pending JPH0416823U (en) | 1990-05-30 | 1990-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0416823U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001250431A (en) * | 1999-12-27 | 2001-09-14 | Furukawa Electric Co Ltd:The | Insulated wire |
-
1990
- 1990-05-30 JP JP5716190U patent/JPH0416823U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001250431A (en) * | 1999-12-27 | 2001-09-14 | Furukawa Electric Co Ltd:The | Insulated wire |