JPH0416823U - - Google Patents

Info

Publication number

JPH0416823U

JPH0416823U JP5716190U JP5716190U JPH0416823U JP H0416823 U JPH0416823 U JP H0416823U JP 5716190 U JP5716190 U JP 5716190U JP 5716190 U JP5716190 U JP 5716190U JP H0416823 U JPH0416823 U JP H0416823U

Authority

JP

Japan

Prior art keywords

wiring material

thickness

utility

melting point

scope

Prior art date

1990-05-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004020 conductor Substances 0.000 claims description 2
• 239000000463 material Substances 0.000 claims description 2
• 230000008018 melting Effects 0.000 claims 1
• 238000002844 melting Methods 0.000 claims 1
• 229920006122 polyamide resin Polymers 0.000 claims 1
• 239000004952 Polyamide Substances 0.000 description 1
• 239000011247 coating layer Substances 0.000 description 1
• 229920002647 polyamide Polymers 0.000 description 1

Cited By (1)