JPH04165652A - Electronic component container and piezoelectric device using same - Google Patents
Electronic component container and piezoelectric device using sameInfo
- Publication number
- JPH04165652A JPH04165652A JP29327590A JP29327590A JPH04165652A JP H04165652 A JPH04165652 A JP H04165652A JP 29327590 A JP29327590 A JP 29327590A JP 29327590 A JP29327590 A JP 29327590A JP H04165652 A JPH04165652 A JP H04165652A
- Authority
- JP
- Japan
- Prior art keywords
- base
- container
- cover
- electronic component
- metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims description 40
- 239000013078 crystal Substances 0.000 claims description 21
- 239000010453 quartz Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000002585 base Substances 0.000 description 18
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 2
- 239000003637 basic solution Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 210000004072 lung Anatomy 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Abstract
Description
（産業上の利用分野）
本発明は電子部品用容器及びこれを用いた圧電装置を利
用分野とし、特に水晶片と回路素子とを密封して構成し
た水晶発振器に関する。
（発明の背景）
水晶発振器は、周波数安定度が高いことから、周波数あ
るいは時間の基準源として、種々の電子機器に多用され
ている。近年では、小型化指向に伴い、水晶振動子（水
晶片）と回路素子とを一つの容器内に密封したものが需
要を増大させている。
（従来技術）
第４図はこの種の一従来例を説明する水晶発振器の図で
、同図（ａ）は断面図、同図（ｂ）は回路図である。
水晶発振器は金属ペース１１回路基板２）水晶片３、他
の回路素子４．及び金属カバー５からなる。金属ベース
１は３本の気密端子６を有し、周縁に７ランジ７を有す
る。回路基板２は金属ベース１上に敷設され、図示しな
い回路パターンが形成される。水晶片３は両生面に電極
（未図示）を形成され、電極の延出した両端部を保持具
８により固着される。同型路素子４はＩＣチップ４ａ、
抵抗４ｂ及びコンデンサ４０等とし、インバータ発振回
路を形成する。金属カバー５は有底筒体状とし、開［」
面側にフランジ９を有する。そして。
金属ベース］−と金属カバー５とのフランジ７．９を当
接し、抵抗溶接により接合する。
（従来技術の問題点）
しかしながら、」−記構成の水晶発振器では、抵抗溶接
のため、金属ベース１と金属カバー５にはフランジ７．
９を要する。そして、通常では、第５図の一部所面図に
示したように、金属ベース１の７ランジ７には、溶接し
やすくするため、周回する突起１０を設ける。したがっ
て、フランジの長さを大きくせざるを得なかった。この
ようなことから、水晶片３を含む回路素−ｆ−４を搭載
するには本来不要ともいうべきフランジの存在により。
回路素子４の搭載面積を実質的に少なくし、小型化を阻
害する問題があった。 また、突起１．０の形状は例え
ば３角形状としてその加工を＊＊にし、金型費用等も嵩
む。また、抵抗溶接は一度に全周を溶接するので、部品
精度をも要求される問題もあった。
（発明の１．Ｊ的）
本発明は、回路素子の搭載面積を実質的に増加させて小
型化に適した電子部品用容器を、及びこれを用いた圧電
装置を合併することをＩＩ的とする（解決手段）
本発明は、金属ベースの外周と金属カバーの開［Ｊ端側
の内周とを嵌合し、両者の先端側をシーム溶接あるいは
レーザ溶接により接合(Industrial Application Field) The present invention relates to an electronic component container and a piezoelectric device using the same, and particularly to a crystal oscillator constructed by sealing a crystal piece and a circuit element. (Background of the Invention) Since crystal oscillators have high frequency stability, they are often used as frequency or time reference sources in various electronic devices. In recent years, with the trend toward miniaturization, demand has increased for devices in which a crystal resonator (crystal piece) and a circuit element are sealed in a single container. (Prior Art) FIG. 4 is a diagram of a crystal oscillator illustrating a conventional example of this type, in which FIG. 4(a) is a sectional view and FIG. 4(b) is a circuit diagram. The crystal oscillator consists of metal paste 11 circuit board 2) crystal blank 3, other circuit elements 4. and a metal cover 5. The metal base 1 has three hermetic terminals 6 and has seven flanges 7 at its periphery. The circuit board 2 is placed on the metal base 1, and a circuit pattern (not shown) is formed thereon. The crystal blank 3 has electrodes (not shown) formed on its amphiboid surfaces, and both ends of the electrodes are fixed by holders 8. The same type path element 4 includes an IC chip 4a,
A resistor 4b, a capacitor 40, etc. are used to form an inverter oscillation circuit. The metal cover 5 has a cylindrical shape with a bottom, and is open.
It has a flange 9 on the surface side. and. The flanges 7.9 of the metal base] and the metal cover 5 are brought into contact and joined by resistance welding. (Problems with the Prior Art) However, in the crystal oscillator having the configuration shown in "-", due to resistance welding, the metal base 1 and the metal cover 5 have flanges 7.
It takes 9. Usually, as shown in the partial plan view of FIG. 5, the seven flange 7 of the metal base 1 is provided with a protrusion 10 that goes around it in order to facilitate welding. Therefore, the length of the flange had to be increased. For this reason, due to the existence of a flange which should be said to be unnecessary in order to mount the circuit element-f-4 including the crystal piece 3. There is a problem in that the mounting area of the circuit element 4 is substantially reduced, which impedes miniaturization. In addition, the shape of the protrusion 1.0 is, for example, a triangular shape, which requires machining, which increases the mold cost and the like. In addition, since resistance welding involves welding the entire circumference at once, there is also the problem of requiring component precision. (Objective 1.J of the invention) The present invention provides an electronic component container suitable for miniaturization by substantially increasing the mounting area of circuit elements, and a piezoelectric device using the same. (Solution) The present invention fits the outer periphery of the metal base and the inner periphery of the open [J end side of the metal cover, and joins the two tip sides by seam welding or laser welding.
【７て電子部品用容器としたこと
を基本的な解決手段とする。以ト１本発明の一実施例を
水晶発振器の容器を例として説明する。
（実施例）
第１図は本発明の一実施例を説明する水晶発振器の特に
容器の断面図である。なお、容器内に封入される航述し
た水晶片等の説明は省略する。
水晶発振器用の容器は気密端子の導出した平面形状を矩
形とした金属ベース１］と有底筒体状の金属カバーとか
らなる。金属ベース１１は、その外周にフランジを設け
ることなく、弔坦面とする金属カバー１２は開口端側に
例えば絞り加工等による突出部１３を周回して設ける。
そして、金属ベース１−１と金属カバー１２とを突出部
１：３により嵌合させ、両社の先端側をシーム溶接して
接合する。
具体的には、シーム溶接器の一対の電極ローラを一対の
対向辺にそれぞれ当接して押圧する。そして、押圧しな
がら、一対の電極ローラ開に電流を流し、金属ベース］
、１と金属カバー１−２との接触する特に先端側を抵抗
熱により溶融して接合する。そして、電極ローラを順次
に進行させて一対の対向辺を溶接する。そして、同様に
地対の対向辺をシーム溶接して、金属ベース１１と金属
カバー１．２とを接合して封止する。
このようなものでは、金属カバー１２の突出部１３は、
−＠に金属ベース１１と嵌合する作用を持てばよい
ので、その長さを極力小さくできる。したがって５ 基
本的には、前述したフランジ７及び突起１０を不要とす
るので（ＩｔｆＪ＊４図参照）、平面面積を小さくでき
る。
ちなみに、 −辺の長さＡを２０ ｍ ｍとした正方形
の容器を例にすると、従来のものは７ランジ７の長さＢ
を約３ ｍ ｍ必要とし、実質的な部品の搭載面積Ｓは
２８９ ｍ ｍ ２となる。 一方、上記実施例のもの
では、突出部１：３を含めた金属カバー１−２の厚みＢ
′を０．２ｍｍ程度にでき、同搭載面積Ｓ′を３９２．
０４ｍｍ２とする。したがって、従来例に比し、約３０
％の搭載面積を広げることになる。
このようなことから、本実施例の容器であれば、金属ベ
ース１］−上に敷設される回路基板２（未図示）を大き
くでき、回路素子４の搭ＩＩ＆面積を実質的に増加させ
て水晶発振器の小型化を促進できる。
（他の実施例）
第３図（ａ）（ｂ）（ｃ）はそれぞれ本発明の他の実施
例を示す図である。なお、これらの各実施例は前実施例
の突出部１３による嵌合形態を別の態様に置換したもの
である。
すなわち、第３図（ａ）は金属ベース」】の外周に突出
部１−３としての段部１．５ ａを、同（ｂ）は金属カ
バー１２の内周先端側に段部１５ｂを、同図（ｃ）は金
属ベース１１の外周と金属カバー１２の内周に段部１５
（ｃｄ）を形成して、それぞれ両者を嵌合し、前述同
様に先端側をシーム溶接して接合するようにしたもので
ある。
したがって、このようなものでも、各段部１５の突出部
分は、単に嵌合する作用を持てばよいので、その長さを
極力小さくでき、回路素子４の搭載面積を実質的に増加
させて水晶発振器の小型化を促進できる。
（他の事項）
なお、航述の各実施例では、突出部は金属ベース１１の
外周あるいは金属カバー１２の内周を周回させて形成し
たが、金属ベース１１と金属カバー１２とを単に嵌合さ
せればよいので、必ずしも周回させる必要はなく、例え
ば各辺の１箇所にて部分的に嵌合させてもよいものであ
る。また、金属ベース１１と金属カバー１２との接合に
はシーム溶接を用いたが、これをレーザ溶接に置換した
としてもよい。また、容器はその平面形状を矩形状とし
たが、例えば円であってもよくその形状には制約を受け
るものではない。また、水晶発振器を例として説明した
が、他の電子部品の容器にも、あるいは圧電振動子単体
を含む他の圧電装置にも利用できることはいうまでもな
い。
（発明の効果）
本発明は、金属ベースの外周と金属カバーの開口端側の
内周とを嵌合し、両者の先端側をシーム溶接あるいはレ
ーザ溶接により接合したので、回路素子の搭載面積を実
質的に増加させて小型化に適した電子部品用容器、及び
これを用いた圧電装置を提供できる。[7] The basic solution is to use a container for electronic parts. Hereinafter, one embodiment of the present invention will be described using a crystal oscillator container as an example. (Embodiment) FIG. 1 is a sectional view of a crystal oscillator, particularly a container, explaining an embodiment of the present invention. Note that a description of the above-mentioned crystal piece etc. sealed in the container will be omitted. The container for the crystal oscillator consists of a metal base 1 which has a rectangular planar shape from which airtight terminals are derived, and a metal cover in the form of a cylinder with a bottom. The metal base 11 does not have a flange on its outer periphery, and the metal cover 12, which serves as a flattened surface, is provided with a protrusion 13 formed by, for example, drawing, around the opening end side. Then, the metal base 1-1 and the metal cover 12 are fitted with the protrusion 1:3, and the leading ends of both are seam welded and joined. Specifically, a pair of electrode rollers of a seam welder are brought into contact with and pressed against a pair of opposing sides, respectively. Then, while pressing, a current is applied to the pair of electrode rollers to open the metal base]
, 1 and the metal cover 1-2 are melted and joined by resistance heat, especially at the ends where they come into contact. Then, the electrode rollers are sequentially advanced to weld the pair of opposing sides. Then, the opposing sides of the ground pair are seam welded in the same manner to join and seal the metal base 11 and the metal cover 1.2. In such a case, the protrusion 13 of the metal cover 12 is
- Since it is sufficient that the @ has the function of fitting into the metal base 11, its length can be made as small as possible. Therefore, 5. Basically, the above-mentioned flange 7 and protrusion 10 are unnecessary (see ItfJ*4 diagram), so the plane area can be reduced. By the way, if we take as an example a square container with - side length A of 20 mm, the conventional one has 7 lunges 7 length B.
3 mm is required, and the actual component mounting area S is 289 mm 2 . On the other hand, in the above embodiment, the thickness B of the metal cover 1-2 including the protrusion 1:3 is
' can be reduced to approximately 0.2 mm, and the mounting area S' can be reduced to 392.
04mm2. Therefore, compared to the conventional example, approximately 30
% of the mounting area. For this reason, with the container of this embodiment, the circuit board 2 (not shown) placed on the metal base 1 can be enlarged, and the area of the circuit element 4 can be substantially increased. This can promote miniaturization of crystal oscillators. (Other Embodiments) FIGS. 3(a), 3(b), and 3(c) are diagrams showing other embodiments of the present invention, respectively. In each of these embodiments, the fitting form using the protrusion 13 of the previous embodiment is replaced with another form. That is, FIG. 3(a) shows a stepped portion 1.5a as a protruding portion 1-3 on the outer periphery of the metal base, and FIG. 3(b) shows a stepped portion 15b on the inner periphery tip side of the metal cover 12. The figure (c) shows a stepped portion 15 on the outer periphery of the metal base 11 and the inner periphery of the metal cover 12.
(cd), the two are fitted together, and the distal ends are seam welded and joined in the same manner as described above. Therefore, even with such a structure, the protruding portions of each stepped portion 15 only need to have a fitting function, so the length can be made as small as possible, and the mounting area of the circuit element 4 can be substantially increased. This can promote miniaturization of the oscillator. (Other Matters) In each of the embodiments described above, the protrusion was formed by going around the outer periphery of the metal base 11 or the inner periphery of the metal cover 12. Therefore, it is not necessarily necessary to rotate them, and for example, they may be partially fitted at one location on each side. Further, although seam welding is used to join the metal base 11 and the metal cover 12, this may be replaced with laser welding. Further, although the container has a rectangular planar shape, the shape is not limited, and may be, for example, a circle. Moreover, although the crystal oscillator has been described as an example, it goes without saying that the present invention can also be used in containers for other electronic components or other piezoelectric devices including a single piezoelectric vibrator. (Effects of the Invention) In the present invention, the outer periphery of the metal base and the inner periphery of the metal cover on the open end side are fitted, and the tip sides of both are joined by seam welding or laser welding, thereby reducing the mounting area of circuit elements. It is possible to provide a container for electronic components that is substantially increased in size and suitable for miniaturization, and a piezoelectric device using the same.
第１図は本発明の一実施例を説明する水晶発振器の特に
容器の断面図である。第２図は上記実施例の効果を従来
例に比して説明する図で、同図（ａ）は従来例の、同図
（ｂ）は同実施例の平面図である。
Ｍ３図（ａ）（ｂ）（ｃ）は本発明の他の実施例を説明
する水晶発振器の特に容器の一部断面図である。 第
４図はこの種の一従来例を説明する水晶発振器の図で、
同図（ａ）は断面図、同図（ｂ）は回路図である。第５
図は同従来倒の一部断面図である。FIG. 1 is a sectional view of a crystal oscillator, particularly a container, explaining an embodiment of the present invention. FIG. 2 is a diagram illustrating the effects of the above embodiment in comparison with a conventional example. FIG. 2(a) is a plan view of the conventional example, and FIG. 2(b) is a plan view of the same embodiment. FIGS. M3 (a), (b), and (c) are partial sectional views of a crystal oscillator, particularly a container, for explaining another embodiment of the present invention. Figure 4 is a diagram of a crystal oscillator explaining one conventional example of this type.
FIG. 5(a) is a cross-sectional view, and FIG. 2(b) is a circuit diagram. Fifth
The figure is a partial sectional view of the same conventional inverted version.
Claims (3)
属カバーとを接合して密封した電子部品用容器において
、前記金属ベースの外周と前記金属カバーの開口端側の
内周とを嵌合し、両者の先端側をシーム溶接により接合
したことを特徴とする電子部品用容器。(1) In a container for electronic components in which a metal base from which an airtight terminal is led out and a bottomed cylindrical metal cover are joined and sealed, the outer periphery of the metal base and the inner periphery of the open end side of the metal cover are connected. A container for electronic components, characterized in that they fit together and their tip sides are joined by seam welding.
レーザ溶接に置換して構成したことを特徴とする電子部
品用容器。(2) A container for electronic parts, characterized in that the seam welding described in claim 1 is replaced with laser welding.
容器内に少なくとも水晶片を封入して構成したことを特
徴とする圧電装置。(3) A piezoelectric device characterized in that it is constructed by enclosing at least a crystal piece in the electronic component container according to claim 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29327590A JPH04165652A (en) | 1990-10-30 | 1990-10-30 | Electronic component container and piezoelectric device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29327590A JPH04165652A (en) | 1990-10-30 | 1990-10-30 | Electronic component container and piezoelectric device using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04165652A true JPH04165652A (en) | 1992-06-11 |
Family
ID=17792721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29327590A Pending JPH04165652A (en) | 1990-10-30 | 1990-10-30 | Electronic component container and piezoelectric device using same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04165652A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0721669A1 (en) * | 1993-09-30 | 1996-07-17 | Motorola, Inc. | Method for manufacturing a frequency control device |
-
1990
- 1990-10-30 JP JP29327590A patent/JPH04165652A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0721669A1 (en) * | 1993-09-30 | 1996-07-17 | Motorola, Inc. | Method for manufacturing a frequency control device |
| EP0721669A4 (en) * | 1993-09-30 | 1997-11-26 | Motorola Inc | Method for manufacturing a frequency control device |
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