JPH04164943A - Saponified ethylene-vinyl acetate copolymer composition having improved property and use thereof - Google Patents
Saponified ethylene-vinyl acetate copolymer composition having improved property and use thereofInfo
- Publication number
- JPH04164943A JPH04164943A JP29307090A JP29307090A JPH04164943A JP H04164943 A JPH04164943 A JP H04164943A JP 29307090 A JP29307090 A JP 29307090A JP 29307090 A JP29307090 A JP 29307090A JP H04164943 A JPH04164943 A JP H04164943A
- Authority
- JP
- Japan
- Prior art keywords
- ethylene
- vinyl acetate
- acetate copolymer
- acid
- copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 title claims abstract description 23
- 239000005038 ethylene vinyl acetate Substances 0.000 title claims abstract description 19
- 239000000203 mixture Substances 0.000 title claims description 30
- 239000004952 Polyamide Substances 0.000 claims abstract description 11
- 229920002647 polyamide Polymers 0.000 claims abstract description 11
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 11
- 229920000578 graft copolymer Polymers 0.000 claims abstract description 8
- 229920001038 ethylene copolymer Polymers 0.000 claims abstract description 7
- 238000000465 moulding Methods 0.000 claims description 11
- 239000002253 acid Substances 0.000 claims description 9
- 150000001721 carbon Chemical class 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 9
- 230000004888 barrier function Effects 0.000 abstract description 9
- 229910052760 oxygen Inorganic materials 0.000 abstract description 9
- 239000001301 oxygen Substances 0.000 abstract description 9
- 239000000155 melt Substances 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract description 4
- 239000005977 Ethylene Substances 0.000 abstract description 4
- 238000007127 saponification reaction Methods 0.000 abstract description 4
- 150000001735 carboxylic acids Chemical class 0.000 abstract description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 abstract description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 abstract description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 abstract description 2
- 239000011976 maleic acid Substances 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 31
- 238000000034 method Methods 0.000 description 21
- 229920001577 copolymer Polymers 0.000 description 11
- 238000001125 extrusion Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005992 thermoplastic resin Polymers 0.000 description 8
- -1 polyethylene Polymers 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 6
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229920000092 linear low density polyethylene Polymers 0.000 description 5
- 229920001684 low density polyethylene Polymers 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 229920000098 polyolefin Polymers 0.000 description 5
- 150000004985 diamines Chemical class 0.000 description 4
- 239000004707 linear low-density polyethylene Substances 0.000 description 4
- 239000004702 low-density polyethylene Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920001903 high density polyethylene Polymers 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000004711 α-olefin Substances 0.000 description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000009998 heat setting Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229920000554 ionomer Polymers 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920001179 medium density polyethylene Polymers 0.000 description 2
- 239000004701 medium-density polyethylene Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 description 2
- IWTMSCUHCJHPPR-ACCUITESSA-N (E)-hexadec-2-enedioic acid Chemical compound OC(=O)CCCCCCCCCCCC\C=C\C(O)=O IWTMSCUHCJHPPR-ACCUITESSA-N 0.000 description 1
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 description 1
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- DWFUTNJGNBYHNN-UHFFFAOYSA-N 2,2,4-trimethylhexanedioic acid Chemical compound OC(=O)CC(C)CC(C)(C)C(O)=O DWFUTNJGNBYHNN-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- UPZFLZYXYGBAPL-UHFFFAOYSA-N 2-ethyl-2-methyl-1,3-dioxolane Chemical compound CCC1(C)OCCO1 UPZFLZYXYGBAPL-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000003905 agrochemical Substances 0.000 description 1
- RZJRJXONCZWCBN-UHFFFAOYSA-N alpha-octadecene Natural products CCCCCCCCCCCCCCCCCC RZJRJXONCZWCBN-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- CJYXCQLOZNIMFP-UHFFFAOYSA-N azocan-2-one Chemical compound O=C1CCCCCCN1 CJYXCQLOZNIMFP-UHFFFAOYSA-N 0.000 description 1
- YDLSUFFXJYEVHW-UHFFFAOYSA-N azonan-2-one Chemical compound O=C1CCCCCCCN1 YDLSUFFXJYEVHW-UHFFFAOYSA-N 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical class C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000004653 carbonic acids Chemical class 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 239000003317 industrial substance Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000010102 injection blow moulding Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002074 melt spinning Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- FJDUDHYHRVPMJZ-UHFFFAOYSA-N nonan-1-amine Chemical compound CCCCCCCCCN FJDUDHYHRVPMJZ-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- XUWHAWMETYGRKB-UHFFFAOYSA-N piperidin-2-one Chemical compound O=C1CCCCN1 XUWHAWMETYGRKB-UHFFFAOYSA-N 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、酸素遮断性に優れ、かつ延伸性や成膜性等の
成型加工性や柔軟性等の物性が著しく改善されたエチレ
ン−酢酸ビニル共重合体ケン化物系の組成物を提供する
ものである。Detailed Description of the Invention [Industrial Field of Application] The present invention provides ethylene-acetic acid which has excellent oxygen barrier properties and has significantly improved formability such as stretchability and film-forming properties, and physical properties such as flexibility. The present invention provides a saponified vinyl copolymer composition.
[従来の技術]
エチレン−酢酸ビニル共重合体ケン化物は酸素遮断性、
機械的強度等の諸性質に優れていることから、フィルム
、シー斗、容器、繊維等の各種用途に多用されている。[Prior art] Saponified ethylene-vinyl acetate copolymer has oxygen barrier properties,
Due to its excellent properties such as mechanical strength, it is widely used in various applications such as films, containers, fibers, etc.
しかし、該共重合体ケン化物はフィルム・シート等の成
型加工時において、その膜厚にバラツキを生じて商品価
値が低下したり、又、成型物の延伸性や柔軟性が不足す
るため深絞り加工等の延伸を伴う加工において延伸ムラ
が起こったり、成型物の使用時にピンホール等が発生し
て包装材料としての用途に制約を受けるのか現状である
。However, when the saponified copolymer is processed into a film or sheet, it causes variations in film thickness, reducing the commercial value, and the molded product lacks stretchability and flexibility, so deep drawing is required. The current situation is whether stretching unevenness occurs during processing that involves stretching, or whether pinholes or the like occur during use of the molded product, which limits its use as a packaging material.
かかる対策として、例えばエチレン−酢酸ビニル共重合
体ケン化物フィルム、シートにポリオレフィン等の耐水
性樹脂をラミネートしたり、あるいは該ケン化物にポリ
オレフィンを配合して、延伸性、柔軟性の改良を行うこ
とが試みられている。As a countermeasure against this, for example, laminating a water-resistant resin such as polyolefin to a saponified ethylene-vinyl acetate copolymer film or sheet, or blending polyolefin with the saponified product to improve stretchability and flexibility. is being attempted.
[発明が解決しようとする課題]
しかしながら、前者の方法ではラミネート操作が必須と
なるし、又、後者の方法ではエチレン−酢酸ビニル共重
合体ケン化物とポリオレフィンとの相溶性が必ずしも充
分でなく、各種添加剤の併用により、その欠点を排除す
るための工夫がなされているものの、本質的な解決とは
ならず、エチレン−酢酸ビニル共重合体ケン化物が本来
有している特徴を保持しながら、膜厚精度、延伸性、柔
軟性を向上させるには未だ不充分であり、その解決が望
まれるところである。[Problems to be Solved by the Invention] However, the former method requires a lamination operation, and the latter method does not necessarily have sufficient compatibility between the saponified ethylene-vinyl acetate copolymer and the polyolefin. Efforts have been made to eliminate this drawback by using various additives in combination, but this does not provide a fundamental solution, and while the saponified ethylene-vinyl acetate copolymer retains its original characteristics, However, it is still insufficient to improve film thickness accuracy, stretchability, and flexibility, and a solution is desired.
[課題を解決するための手段]
本発明者等はかかる課題を解決すべく鋭意研究を重ねた
結果、
(A)エチレン−酢酸ビニル共重合体ケン化物か、50
〜99.5重量%、
(B)密度0.90〜0.949/cm3のエチレン系
共重合体が 0.4
〜50重量%、(C)ポリオレフィン系樹脂にエチレン
性不飽和カルボン酸又はその誘導体をグラフト反応させ
、更にポリアミドを反応させてなるグラフト重合体か、
O1〜15重量%
の割合からなるエチレン−酢酸ビニル共重合体ケン化物
系組成物がその目的を達成出来ることを見出し本発明を
完成した。[Means for Solving the Problem] As a result of intensive research to solve the problem, the present inventors found that (A) saponified ethylene-vinyl acetate copolymer, 50
~99.5% by weight, (B) ethylene copolymer with a density of 0.90 to 0.949/cm3 is 0.4
~50% by weight, (C) a graft polymer obtained by grafting a polyolefin resin with an ethylenically unsaturated carboxylic acid or a derivative thereof, and further reacting with a polyamide;
The present invention was completed by discovering that a saponified ethylene-vinyl acetate copolymer composition containing 1 to 15% by weight of O can achieve the object.
以下、かかる組成物、特に成型物の用途を中心にして本
発明の詳細な説明する。Hereinafter, the present invention will be described in detail, focusing on the use of such a composition, especially a molded product.
本発明で対象とする(A)エチレン−酢酸ビニル共重合
体ケン化物はエチレン含量20〜60モル%、好ましく
は25〜55モル%、酢酸ビニル成分のケン化度95モ
ル%以上のものである。The saponified ethylene-vinyl acetate copolymer (A) targeted by the present invention has an ethylene content of 20 to 60 mol%, preferably 25 to 55 mol%, and a degree of saponification of the vinyl acetate component of 95 mol% or more. .
エチレン含量が20モル%以下では高湿時の酸素遮断性
が低下し、一方60モル%以上では酸素遮断性や印刷適
性等の物性が低下する。又、ケン化度が95モル%以下
では酸素遮断性や耐湿性が低下する。かかるケン化物の
中でも、メルトフロレート(210℃、21609、以
下同様)が0.5〜1001J/ I O分程度のもの
が有用である。If the ethylene content is less than 20 mol %, the oxygen barrier properties at high humidity will decrease, while if it is 60 mol % or more, physical properties such as oxygen barrier properties and printability will decrease. Furthermore, if the degree of saponification is less than 95 mol%, oxygen barrier properties and moisture resistance will decrease. Among such saponified materials, those having a melt fluorate (210° C., 21609, the same applies hereinafter) of about 0.5 to 1001 J/IO min are useful.
又、該共重合体ケン化物は更に少量のプロピレン、イソ
ブチン、α−オクテン、α−ドデセン、α−オクタデセ
ン等のα−オレフィン、不飽和カルボン酸又はその塩、
部分アルキルエステル、完全アルキルエステル、ニトリ
ル、アミド、無水物や不飽和スルホン酸又はその塩等の
コモノマーを共璽合成分として含有して差支えない。In addition, the saponified copolymer further contains a small amount of propylene, isobutyne, α-olefin such as α-octene, α-dodecene, α-octadecene, unsaturated carboxylic acid or a salt thereof,
Comonomers such as partial alkyl esters, complete alkyl esters, nitriles, amides, anhydrides, and unsaturated sulfonic acids or salts thereof may be contained as co-sealing components.
(B)のエチレン系共重合体とは市販品として入手容易
な低密度ポリエチレンや直鎖状低密度ポリエチレン、更
にはエチレン−酢酸ビニル共重合体、エチレン−アクリ
ル酸エステル共重合体等である。The ethylene copolymer (B) includes low-density polyethylene and linear low-density polyethylene, which are easily available commercially, as well as ethylene-vinyl acetate copolymers, ethylene-acrylic ester copolymers, and the like.
いずれのものも密度が0.9 (1−0,94fl/c
m”cJ IS K 6760)でなければならな
い。かかるポリエチレン以外の中密度ポリエチレン、高
密度ポリエチレンでは本発明の効果は得難い。Both have a density of 0.9 (1-0.94fl/c
m"cJ IS K 6760). It is difficult to obtain the effects of the present invention with medium-density polyethylene or high-density polyethylene other than such polyethylene.
(B)の中でもメルトフロレート(190℃、荷重21
60g、以下同様)が0.3〜309/70分程度のも
のか多用される。Among (B), melt fluorate (190℃, load 21
60g (the same applies hereafter) is often used for about 0.3 to 309/70 minutes.
本発明では(A)と(B)との相溶化を良好にするため
(C)の配合が必須である。In the present invention, blending of (C) is essential to ensure good compatibility between (A) and (B).
(C)はポリオレフィン系樹脂にエチレン性不飽和カル
ホン酸又はその誘導体をグラフト反応させ、更に該カル
ボン酸又はその誘導体とポリアミドを反応させてなるク
ラフト重合体である。(C) is a craft polymer obtained by subjecting a polyolefin resin to a graft reaction with an ethylenically unsaturated carbonic acid or its derivative, and further reacting the carboxylic acid or its derivative with a polyamide.
該グラフト重合体はポリオレフィン系樹脂を適当な溶媒
に溶解又は懸濁させ、あるいは溶融状態で過酸化物やジ
アゾ系の開始剤でポリオレフィン系樹脂鎖を活性化して
、これにエチレン性不飽和カルボン酸又はその誘導体を
グラフト反応させて重合体を得、該重合体とポリアミド
を溶融状態で混合することによって製造される。The graft polymer is prepared by dissolving or suspending the polyolefin resin in a suitable solvent, or activating the polyolefin resin chain in the molten state with a peroxide or diazo initiator, and then adding an ethylenically unsaturated carboxylic acid to the polyolefin resin chain. Alternatively, it is produced by grafting a derivative thereof to obtain a polymer, and then mixing the polymer and polyamide in a molten state.
かかる反応の際にはブラベンダー、パスブレンダー、単
軸スクリュー押出機、ウェーナー及びフライプラー型2
軸押出機等が使用される。Brabenders, path blenders, single screw extruders, Wehner and Frypler types 2 are used for such reactions.
A screw extruder or the like is used.
使用するポリオレフィン系樹脂の重合度は350〜45
000.好ましくは500〜10000程度のものが選
ばれる。メルトフロレート(230’C1荷重216
Of、以下同様)とLCIiO,1〜50f//10分
程度か実用的である。The degree of polymerization of the polyolefin resin used is 350 to 45.
000. Preferably, a number of about 500 to 10,000 is selected. Melt fluorate (230'C1 load 216
Of, the same applies hereinafter) and LCIiO, 1 to 50f//about 10 minutes, which is practical.
ポリオレフィン系樹脂とエチレン性不飽和カルボン酸又
はその誘導体との反応比率は重量比で10010.05
〜I 00/I O1好ましくは+0010.5〜10
0/3である。The reaction ratio of polyolefin resin and ethylenically unsaturated carboxylic acid or its derivative is 10010.05 by weight
~I 00/I O1 preferably +0010.5~10
It is 0/3.
10010.5以下では相溶性の改善効果が不充分とな
りl 00/I 0以上では成型時の増粘が大となり実
用性に乏しい。If it is less than 10010.5, the effect of improving compatibility is insufficient, and if it is more than l 00/I 0, the viscosity increases during molding and is impractical.
又、ポリアミドの重合度は80〜1000、好ましくは
100〜500程度か実用的であり、その反応比率はカ
ルボキシル基当たり0.01〜1モル、好ましくは0゜
05〜09モルが望ましい。The degree of polymerization of the polyamide is practically 80 to 1000, preferably about 100 to 500, and the reaction ratio is preferably 0.01 to 1 mol, preferably 0.05 to 0.09 mol per carboxyl group.
上記におけるポリオレフィン系樹脂としては直鎖状低密
度・低密度・高密度ポリエチレン、アイオノマー、エチ
レン−プロピレン共重合体、エチレン−酢酸ビニル共重
合体、エチレン−アクリル酸エステル共重合体などがあ
げられる。特に直鎖状低密度ポリエチレン、低密度ポリ
エチレン、エチレン−プロピレン共重合体、エチレン−
酢酸ビニル共重合体が実用的に重要である。Examples of the polyolefin resins mentioned above include linear low-density, low-density, and high-density polyethylenes, ionomers, ethylene-propylene copolymers, ethylene-vinyl acetate copolymers, ethylene-acrylic acid ester copolymers, and the like. Especially linear low density polyethylene, low density polyethylene, ethylene-propylene copolymer, ethylene-
Vinyl acetate copolymers are of practical importance.
かかる幹ポリマーにグラフトさせるエチレン性不飽和カ
ルボン酸又はその誘導体とはアクリル酸、メタクリル酸
、クロトン酸、マレイン酸、フマル酸、イタコン酸など
の不飽和カルボン酸或はこれらの無水物、半エステル等
をいう。The ethylenically unsaturated carboxylic acids or derivatives thereof to be grafted onto the backbone polymer include unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, fumaric acid, and itaconic acid, or their anhydrides and half esters. means.
又、ポリアミドはラクタムの重付加やアミノカルボン酸
の重縮合、ジアミンとジカルボン酸の重縮合等、周知の
方法で製造される。Polyamides can also be produced by well-known methods such as polyaddition of lactams, polycondensation of aminocarboxylic acids, and polycondensation of diamines and dicarboxylic acids.
上記ポリアミド原料としては具体的に、ε−カプロラク
タム、エナントラクタム、カプリルラクタム、ラウリル
ラクタム、α−ピロリドン、α−ピペリドンのようなラ
クタム類、6−アミノカプロン酸、7−アミノへブタン
酸、9−アミノノナン酸、11−アミノウンデカン酸の
ようなω−アミノ酸類、アジピン酸、グルタル酸、ピメ
リン酸、スペリン酸、アゼライン酸、セバシン酸、ウン
デカンジオン酸、ドデカジオン酸、ヘキサデカジオン酸
、ヘキサデセンジオン酸、エイコサンジオン酸、エイコ
サジエンジオン酸、ジグリコール酸、2,2.4−トリ
メチルアジピン酸、キシリレンジカルボン酸、1.4−
シクロヘキサンジカルボン酸、テレフタル酸、イソフタ
ル酸のような二塩基酸類、ヘキサメチレンジアミン、テ
トラメチレンジアミン、ノナメチレンジアミン、ウンデ
カメチレンジアミン、Fデカメチレンジアミン、2,2
゜4(又は2,4.4)−)リメチルへキサメチレンジ
アミン、ビス=(4,4°−アミノンクロヘキシル)メ
タン、メタキノリレンジアミンのようなジアミン類など
が挙げられる。又分子量の調節の目的でラウリルアミン
、オレイルアミン等のモノアミンも適宜使用し得る。Specifically, the above-mentioned polyamide raw materials include lactams such as ε-caprolactam, enantholactam, capryllactam, lauryllactam, α-pyrrolidone, and α-piperidone, 6-aminocaproic acid, 7-aminohebutanoic acid, and 9-aminononane. acids, ω-amino acids such as 11-aminoundecanoic acid, adipic acid, glutaric acid, pimelic acid, superic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecadionic acid, hexadecadionic acid, hexadecenedioic acid, eico Sandionic acid, eicosadienedionic acid, diglycolic acid, 2,2.4-trimethyladipic acid, xylylene dicarboxylic acid, 1.4-
Dibasic acids such as cyclohexane dicarboxylic acid, terephthalic acid, isophthalic acid, hexamethylene diamine, tetramethylene diamine, nonamethylene diamine, undecamethylene diamine, F decamethylene diamine, 2,2
Diamines such as ゜4 (or 2,4.4)-)limethylhexamethylene diamine, bis=(4,4゜-aminone chlorohexyl) methane, and metaquinolyl diamine can be mentioned. Furthermore, monoamines such as laurylamine and oleylamine may be used as appropriate for the purpose of controlling the molecular weight.
本発明の組成物において(A)、(B)、(C)の配合
割合は(A)が50〜99.5重量%、好ましくは60
〜95重量%、(B)が0.4〜50重量%、好ましく
は4.5〜35、(C)が0.1〜15重量%、好まし
く ハ0 、5〜10重量%でなければならない。In the composition of the present invention, the blending ratio of (A), (B), and (C) is 50 to 99.5% by weight, preferably 60% by weight.
~95% by weight, (B) 0.4-50% by weight, preferably 4.5-35%, (C) 0.1-15% by weight, preferably 5-10% by weight. .
(A)が50重量%以下あるいは(B)が50重量%以
上では酸素遮断性が低くなり、一方(A)が99.5重
量%以上あるいは(B)が0.4重量%以下では延伸性
、柔軟性に欠け、又膜厚ムラが生じやすくなる。又、(
C)が0゜1重量%以下では(A)と(B)との相溶性
が不良となり、本発明の効果が得難く15重量%以上で
はロングラン威型性が悪くなるので不利である。If (A) is 50% by weight or less or (B) is 50% by weight or more, oxygen barrier properties will be low, while if (A) is 99.5% by weight or more or (B) is 0.4% by weight or less, stretchability will decrease. , lacks flexibility, and tends to cause uneven film thickness. or,(
If C) is less than 0.1% by weight, the compatibility between (A) and (B) will be poor, making it difficult to obtain the effects of the present invention, and if it is more than 15% by weight, long-run stability will be poor, which is disadvantageous.
かくして、かかる組成物は成型物、接着剤、被覆剤等の
広い用途を有しているが、本発明の組成物は成型物の用
途に多用され、溶融混練によりベレット、フィルム、ノ
ート、容器、繊維、棒、管、各種成型品等に成型される
。これらの粉砕品(回収を再使用する時など)やペレッ
トを用いて再び溶融成型に供することも多い。Thus, such compositions have a wide range of uses such as molded products, adhesives, coatings, etc., and the composition of the present invention is widely used in molded products, such as pellets, films, notebooks, containers, etc. by melt-kneading. It is molded into fibers, rods, tubes, and various molded products. These pulverized products (when reusing recovered materials, etc.) and pellets are often used for melt molding again.
溶融成型方法としては、押出成型(T−ダイ押出、イン
フレーション押出、ブロー成型、溶融紡糸、異型押出等
)、射出成型法が主として採用される。溶融成型温度は
170〜270℃の範囲から選ぶことが多い。上記射出
成型法のほか二色成型、インジェクションブロー成型法
などを含み、寸法精度の良好な成型品を得ることができ
る。As the melt molding method, extrusion molding (T-die extrusion, inflation extrusion, blow molding, melt spinning, profile extrusion, etc.) and injection molding are mainly employed. The melt molding temperature is often selected from a range of 170 to 270°C. In addition to the above-mentioned injection molding methods, methods such as two-color molding and injection blow molding can be used to obtain molded products with good dimensional accuracy.
かかる成型時にはエチレン含量やケン化度が種々異なる
エチレン−酢酸ビニル共重合体ケン化物を2種以上併用
することも勿論可能である。又、溶融成型においては可
塑剤(多価アルコールなど)、安定剤、界面活性剤、架
橋性物質(エポキシ化合物、多価金属塩、無機又は有機
の多塩基酸又はその塩など)、充填剤、着色剤、補強材
としての繊維(ガラス繊維、炭素繊維など)、ハイドロ
タルサイト等を適当量配合することができる。又、種々
の他の熱可塑性樹脂を適当量配合することもでき、かか
る他の熱可塑性樹脂としては(B)以外のポリオレフィ
ン又はこれらを不飽和カルホン酸又はその誘導体でグラ
フト変性した変性ポリオレフィン、ポリアミド、ポリ塩
化ビニル、ポリ塩化ビニリデン、ポリエステル、ポリス
チレン、ポリアクリロニトリル、ポリウレタン、ポリア
セタール、ポリカーホネート、溶融成型可能なポリビニ
ルアルコール系樹脂などが挙げられる。During such molding, it is of course possible to use two or more saponified ethylene-vinyl acetate copolymers having various ethylene contents and degrees of saponification. In addition, in melt molding, plasticizers (polyhydric alcohols, etc.), stabilizers, surfactants, crosslinking substances (epoxy compounds, polyvalent metal salts, inorganic or organic polybasic acids or their salts, etc.), fillers, Appropriate amounts of colorants, reinforcing fibers (glass fibers, carbon fibers, etc.), hydrotalcite, etc. can be blended. In addition, various other thermoplastic resins can be blended in appropriate amounts, and examples of such other thermoplastic resins include polyolefins other than (B), modified polyolefins obtained by graft-modifying these with unsaturated carbonic acids or derivatives thereof, and polyamides. , polyvinyl chloride, polyvinylidene chloride, polyester, polystyrene, polyacrylonitrile, polyurethane, polyacetal, polycarbonate, melt-moldable polyvinyl alcohol resin, and the like.
本発明の組成物は上述した如く組成物のみを単層とする
成型物の製造以外に、該組成物を少なくとも一層とする
積層構造物として実用に供せられることが多い。The composition of the present invention is often put to practical use in the form of a laminated structure having at least one layer of the composition, in addition to producing a molded product having only a single layer of the composition as described above.
本発明の積層構造物を製造するに当たっては、本願組成
物の層の片面又は両面に他の基材をラミネートするので
あるがラミネート方法としては例えば、組成物のフィル
ム、シートに熱可塑性樹脂を溶融押出する方法、逆に熱
可塑性樹脂等の基材に本発明の組成物を溶融押出する方
法、本発明の組成物と他の熱可塑性樹脂とを共押出する
方法、更には本発明の組成物のフィルム、シートと他の
基材のフィルム、シートとを有機チタン化合物、イソシ
アネート化合物、ポリエステル系化合物等の公知の接着
剤を用いてラミネートする方法等か挙げられる。In manufacturing the laminated structure of the present invention, other base materials are laminated on one or both sides of the layer of the composition of the present invention. Examples of the lamination method include melting a thermoplastic resin onto a film or sheet of the composition. A method of extrusion, a method of melt-extruding the composition of the present invention onto a base material such as a thermoplastic resin, a method of co-extruding the composition of the present invention with another thermoplastic resin, and a method of co-extruding the composition of the present invention onto a base material such as a thermoplastic resin. Examples include a method of laminating a film or sheet of another base material with a film or sheet of another base material using a known adhesive such as an organic titanium compound, an isocyanate compound, or a polyester compound.
共押出の場合の相手側樹脂としては直鎖状低密度ポリエ
チレン、低密度ポリエチレン、中密度ポリエチレン、高
密度ポリエチレン、エチレン−酢酸ビニル共重合体、ア
イオノマー、エチレン−プロピレン共重合体、エチレン
−アクリル酸エステル共重合体、ポリプロピレン、プロ
ピレン−α−オレフィン(炭素数4〜20のα〜オレフ
ィン)共重合体、ポリブテン、ポリペンテンなどのオレ
フィンの単独又は共重合体、或はこれらのオレフィンの
単独又は共重合体を不飽和カルボン酸又はそのエステル
でグラフト変性したものなどの広義のポリオレフィン系
樹脂、ポリエステル、ポリアミド、共重合ポリアミド、
ポリ塩化ビニル、ポリ塩化ビニリデン、アクリル系樹脂
、スチレン系樹脂、ビニルエステル系樹脂、ポリエステ
ルエラストマー、ポリウレタンエラストマー、塩素化ポ
リエチレン、塩素化ポリプロピレンなどが挙げられる。In the case of coextrusion, partner resins include linear low density polyethylene, low density polyethylene, medium density polyethylene, high density polyethylene, ethylene-vinyl acetate copolymer, ionomer, ethylene-propylene copolymer, ethylene-acrylic acid. Single or copolymers of olefins such as ester copolymers, polypropylene, propylene-α-olefins (α-olefins having 4 to 20 carbon atoms) copolymers, polybutene, polypentene, or single or copolymers of these olefins Broadly defined polyolefin resins such as those obtained by graft-modifying the polymer with unsaturated carboxylic acid or its ester, polyesters, polyamides, copolymerized polyamides,
Examples include polyvinyl chloride, polyvinylidene chloride, acrylic resin, styrene resin, vinyl ester resin, polyester elastomer, polyurethane elastomer, chlorinated polyethylene, and chlorinated polypropylene.
エチレン−酢酸ビニル共重合体ケン化物も共押出可能で
ある。A saponified ethylene-vinyl acetate copolymer can also be coextruded.
更に、本発明の組成物から一層フイルム、シートなどの
成型物を得、これに他の基材を押出コートしたり、他の
基材のフィルム、シートなどを接着剤を用いてラミネー
トする場合、前記の熱可塑性樹脂以外に任意の基材(紙
、金属箔、−軸又は二軸延伸プラスチックフィルム又は
シート、織布、不織布、金属線条、木質面など)が使用
可能である。Furthermore, when a molded product such as a film or sheet is obtained from the composition of the present invention and extrusion coated with another base material or laminated with a film or sheet of another base material using an adhesive, In addition to the above-mentioned thermoplastic resin, any base material (paper, metal foil, -axially or biaxially stretched plastic film or sheet, woven fabric, nonwoven fabric, metal wire, wood surface, etc.) can be used.
積層構造物の層構成は、本発明の組成物の層をA(AI
+ Ah 、 、 )、他の基材、例えば熱可塑性樹脂
層をB(B+、By、、、)とするとき、フィルム、シ
ート、ボトル状であれば、A/Hの二層構造のみならず
、B/A/B%A/B/A、A+/At/B、A/B+
/Bt、B/A/B、By/B、/A/B、/B!など
任意の組合せが可能であり、フィラメント状ではA、B
がバイメタル型、芯(A)−鞘(B)型、芯(B)−鞘
(A)型、或は偏心芯鞘型など任意の組合せが可能であ
る。The layer structure of the laminated structure is such that the layer of the composition of the present invention is A (AI
+Ah, , ), and other base materials, for example, thermoplastic resin layers, are B (B+, By, , ), and if it is in the form of a film, sheet, or bottle, it will not only have a two-layer structure of A/H. , B/A/B%A/B/A, A+/At/B, A/B+
/Bt, B/A/B, By/B, /A/B, /B! Any combination is possible, such as A, B in filament form.
Any combination is possible, such as a bimetal type, a core (A)-sheath (B) type, a core (B)-sheath (A) type, or an eccentric core-sheath type.
又、共押出の場合、AにB、BにAをブレンドしたり、
AやBの少なくとも一方に両層面の密着性を向上させる
樹脂を配合することもある。In addition, in the case of coextrusion, blending A with B, B with A,
At least one of A and B may be blended with a resin that improves the adhesion between both layers.
積層構造物の形状としては任意のものであって良く、フ
ィルム、シート、テープ、ボトル、パイプ、フィラメン
ト、異型断面押出物などが例示される。The shape of the laminated structure may be arbitrary, and examples thereof include films, sheets, tapes, bottles, pipes, filaments, and irregular cross-section extrudates.
又、得られる積層構造物は必要に応じ、熱処理、冷却処
理、圧延処理、印刷処理、トライラミネート処理、溶液
又は溶融コート処理、製袋加工、探しぼり加工、箱加工
、チューブ加工、スプリット加工等を行うことかできる
。In addition, the obtained laminated structure may be subjected to heat treatment, cooling treatment, rolling treatment, printing treatment, tri-laminate treatment, solution or melt coating treatment, bag making treatment, search processing, box processing, tube processing, split processing, etc. as required. Is it possible to do this?
又、本発明の前記成型物や積層構造物は必要に応して延
伸を施し、その物性を改善することも可能である。Further, the molded product or laminated structure of the present invention can be stretched as necessary to improve its physical properties.
本発明においては、組成物を溶融成型して原反となるフ
ィルムを製造する。フィルムの厚みは特に限定はなく、
数μないし数100μに設定することができる。尚、本
発明に言うフィルムとはシート、テープ、管、容器等の
形態を含む広義のフィルムを意味する。In the present invention, a film serving as an original fabric is manufactured by melt-molding the composition. There is no particular limit to the thickness of the film.
It can be set to several μ to several 100 μ. Incidentally, the film referred to in the present invention means a film in a broad sense including forms such as sheets, tapes, tubes, and containers.
かかるフィルムは膜厚が均一であるので、極めて製品価
値が高い、又、かかる膜厚の安定性は成型加工を長期に
わたって続けても保持される。Since such a film has a uniform thickness, it has extremely high product value, and the stability of the film thickness is maintained even if the molding process is continued for a long period of time.
上記の如くして得られたフィルムは必要に応じ、吸湿或
は乾燥等の調湿処理した後延伸に供せられる。The film obtained as described above is subjected to humidity control treatment such as moisture absorption or drying, if necessary, and then subjected to stretching.
延伸は、−軸延伸、二輪延伸のいずれであってもよく、
出来るだけ高倍率の延伸を行った方が本発明の効果が生
かされる。−軸延伸の場合は1.5倍以上、特に2倍以
上とすることか好ましい。二軸延伸の場合は面積倍率で
15倍以上、特に2倍以上、更には4倍以上とすること
が好ましい。The stretching may be either -axial stretching or two-wheel stretching,
The effects of the present invention can be maximized by stretching at as high a magnification as possible. - In the case of axial stretching, it is preferred that the stretching be 1.5 times or more, particularly 2 times or more. In the case of biaxial stretching, the area magnification is preferably 15 times or more, particularly 2 times or more, and even 4 times or more.
本発明は5倍以上、特に7倍以上の高延伸か可能である
点に特徴がある。The present invention is characterized in that high stretching of 5 times or more, especially 7 times or more is possible.
延伸方法としてはロール延伸法、テンター延伸法、チュ
ーブラ−延伸法、延伸ブロー法などの他、深絞成形、真
空成形等のうち延伸倍率の高いものも採用できる。二輪
延伸の場合は同時二軸延伸方式、逐次二軸延伸方式のい
ずれの方式も採用できる。As the stretching method, in addition to a roll stretching method, a tenter stretching method, a tubular stretching method, a stretch blowing method, etc., methods with a high stretching ratio among deep drawing forming, vacuum forming, etc. can be adopted. In the case of two-wheel stretching, either a simultaneous biaxial stretching method or a sequential biaxial stretching method can be employed.
延伸温度は40〜150℃程度の範囲から選ばれる。The stretching temperature is selected from a range of about 40 to 150°C.
かくして延伸が終了した後、次いて熱固定を行う。熱固
定は、周知の手段で実施可能であり、上記延伸フィルム
を緊張状聾に保ちながら50〜160℃、好ましくは8
0〜160℃で2〜600秒間程度熱処理を行う。After the stretching is thus completed, heat setting is then performed. Heat setting can be carried out by a well-known method, and the stretched film is kept under tension at 50 to 160°C, preferably 8°C.
Heat treatment is performed at 0 to 160°C for about 2 to 600 seconds.
又、得られる延伸フィルムは必要に応じ、冷却処理、圧
延処理、印刷処理、ドライラミネート処理、溶液又は溶
融コート処理、製袋加工、探しぼり加工、箱加工、チュ
ーブ加工、スプリット加工等を行うことができる。In addition, the obtained stretched film may be subjected to cooling treatment, rolling treatment, printing treatment, dry lamination treatment, solution or melt coating treatment, bag making treatment, search processing, box processing, tube processing, split processing, etc., as necessary. I can do it.
本発明の組成物から得られるフィルム、シート或は容器
等は食品、医薬品、工業薬品、農薬等各種の包装材とし
て有用である。Films, sheets, containers, etc. obtained from the composition of the present invention are useful as packaging materials for various foods, pharmaceuticals, industrial chemicals, agricultural chemicals, etc.
「作 用1
本発明においては、(A)エチレン−酢酸ビニル共重合
体ケン化物と(B)特定密度のエチレン系共重合体との
組成物に特定の(C)グラフト重合体を配合することに
よって、(A)と(B)との相溶化が顕著に改善され、
該組成物から得られる成型物は酸素遮断性が優れ、又(
A)の欠点である延伸性、膜厚ムラ、柔軟性が著しく向
上する。Effect 1 In the present invention, a specific (C) graft polymer is blended into a composition of (A) a saponified ethylene-vinyl acetate copolymer and (B) an ethylene copolymer having a specific density. The compatibility between (A) and (B) is significantly improved by
The molded product obtained from the composition has excellent oxygen barrier properties and (
The drawbacks of A) such as stretchability, film thickness unevenness, and flexibility are significantly improved.
[実施例]
次に実施例を挙げて本発明の組成物を更に具体的に説試
料の調製
実施例1〜8、対照例1〜6
第1表に示す(A)、(B)、(C)の組合わせからな
る組成物ペレットをヘンンエルミキサーを用いて混合し
、T−ダイを備えた押出機に供給して溶融混練し、T−
ダイから押出して厚み30μのフィルムを製造した。(
但し、延伸性のテストには180μのフィルムを用いた
)押出成型の条件は次の通りである。[Example] Next, Examples will be given to further explain the composition of the present invention. Sample Preparation Examples 1 to 8, Control Examples 1 to 6 The composition pellets consisting of the combination of C) are mixed using a Hennel mixer, and the mixture is fed to an extruder equipped with a T-die and melt-kneaded.
A film with a thickness of 30 μm was produced by extrusion through a die. (
However, a 180μ film was used for the stretchability test) The extrusion molding conditions were as follows.
押出機:40a+m径押出機
スクリュー:先端ダルメージタイプ、L/D=28、C
R=3.0
押出温度=230℃
スクリュー回転数: 40 rpm
得られたフィルムについての結果を第1表に示す。Extruder: 40a+m diameter extruder screw: tip dalmage type, L/D=28, C
R=3.0 Extrusion temperature=230°C Screw rotation speed: 40 rpm The results for the obtained film are shown in Table 1.
実施例9〜13
外 !(1);ナイロン6 [MFR: 49/10分
、(230℃、2160g))
中間層(■);本願の(A)、(B)、(C)組成物接
着層(■)、無水マレイン酸変性エチレン−酢酸ビニル
共重合体
CMFR; 2.5y/10分(190’C1216i
))内 層(■)、酢ビ含量lO%のエチレン−酢酸ビ
ニル共重合体
CMFR: 2y/I 0分(190’C1C1216
O〕上記の各樹脂を用いて層構成及び膜厚(μ)が(1
)/ (II)/(I[I)/ (IV)=20/10
15/20なる4層積層構造物を以下の条件下で製造し
た。(但し延伸テストには80/40/20/80を用
いた)成型条件
押出機
40nm径押出機(内層用)
40mm径押出機(中間層用)
3omm径押出機(接着層用)
40mm径押出機(外層用)
スクリュー 共にL/D=28 圧縮比3.2
スクリユ一回転数
内層用 40rpm
中間層用 2 Orpm
接着層用 2 Orpm
外層用 4 Orpm
ダイ
4層コンパイニングアダプター付Tダイダイ巾 45
0mm
押出温度
内・外・接着用押出機
C,=190℃ Ct=200℃c3=210℃
C,=220℃中間層用押出機
Cr= 180℃ Ct−200℃c3=220
℃ C,= 220℃コンパイニングアダプター
210℃Tダイ 2
10℃結果を第2表に示す。Examples 9-13 Outside! (1); Nylon 6 [MFR: 49/10 minutes, (230°C, 2160 g)] Intermediate layer (■); (A), (B), (C) composition adhesive layer (■) of the present application, anhydrous maleic Acid-modified ethylene-vinyl acetate copolymer CMFR; 2.5y/10min (190'C1216i
)) Inner layer (■), ethylene-vinyl acetate copolymer with vinyl acetate content 1O% CMFR: 2y/I 0 min (190'C1C1216
O] Using each of the above resins, the layer structure and film thickness (μ) are (1
)/(II)/(I[I)/(IV)=20/10
A 15/20 four-layer laminate structure was manufactured under the following conditions. (However, 80/40/20/80 was used for the stretching test) Molding conditions Extruder 40 nm diameter extruder (for inner layer) 40 mm diameter extruder (for middle layer) 3 om diameter extruder (for adhesive layer) 40 mm diameter extruder Machine (for outer layer) Both screws L/D=28 Compression ratio 3.2
Screw 1 rotation speed For inner layer 40 rpm For intermediate layer 2 Orpm For adhesive layer 2 Orpm For outer layer 4 Orpm T die with die 4 layer compiling adapter Die width 45
0mm Extrusion temperature inside/outside/adhesion extruder C, = 190°C Ct = 200°C c3 = 210°C
C,=220℃ Intermediate layer extruder Cr=180℃ Ct-200℃c3=220
℃ C, = 220℃ compinning adapter 210℃ T die 2
The 10°C results are shown in Table 2.
実施例14〜18
内 層(I)、外層(■);低密度ポリエチレン(MF
R; 2.0Iil/10分)
接着層(II)、(IV) ;無水マレイン酸度性直鎖
状低密度ポリエチレン(MFR+ 29710分)中間
層(m);本願の(A)、(B)、(C)の組成物上記
の各樹脂を用いて層構成及び膜厚(μ)が(r)/(I
f)/(I)/(1’V)/(V) −2015/10
15/20なる5層積層構造物を以下の条件下で製造し
た。Examples 14 to 18 Inner layer (I), outer layer (■); Low density polyethylene (MF
R; 2.0Iil/10 minutes) Adhesive layer (II), (IV); Maleic anhydride linear low density polyethylene (MFR+ 29710 minutes) intermediate layer (m); (A), (B) of the present application, Composition (C) Using each of the above resins, the layer structure and film thickness (μ) are (r)/(I
f)/(I)/(1'V)/(V) -2015/10
A 15/20 5-layer laminate structure was manufactured under the following conditions.
(但し延伸性テストは80/20/40/20/80を
使用した。)
押出機
40+am径押出機(内層及び外層用)40sm径押出
機(中間層用)
30im径押出機(接着層用)
スクリュー:共にL/D=2.8 圧縮比3.2
スクリユ一回転数
内層、外層用 65rpm
中間層用 2 Orpm
接着層用 30rpm
ダイ
5層コンパイニングアダプター付Tダイダイ巾 45
0mm
押出温度
内・外・接着用押出機
C,= ] 90℃ Cz−20o℃C,=21
0℃ G、= 220℃中間層用押出機
C,= 180℃ C2=200°CC5=22
0°CC,=220℃
コンパイニングアダプター 210℃Tダイ
210℃結果を第3表に示す。(However, 80/20/40/20/80 was used for the stretchability test.) Extruder 40+am diameter extruder (for inner and outer layers) 40sm diameter extruder (for middle layer) 30im diameter extruder (for adhesive layer) Screw: Both L/D = 2.8 Compression ratio 3.2
Screw 1 rotation speed For inner layer, outer layer 65 rpm For intermediate layer 2 Orpm For adhesive layer 30 rpm T die with die 5 layer compinning adapter Die width 45
0mm Extrusion temperature inside/outside/adhesion extruder C, =] 90℃ Cz-20o℃C, = 21
0°C G, = 220°C Intermediate layer extruder C, = 180°C C2 = 200° CC5 = 22
0°CC, = 220°C Compining adapter 210°C T die
The 210°C results are shown in Table 3.
[効 果コ
本発明の(A)エチレン−酢酸ビニル共重合体ケン化物
、(B)特定密度のエチレン系共重合体、(C)特定の
グラフト共重合体よりなる組成物は優れた酸素遮断性、
延伸性、膜厚精度、柔軟性をもつ成型物を与える。[Effects] The composition of the present invention comprising (A) a saponified ethylene-vinyl acetate copolymer, (B) an ethylene copolymer with a specific density, and (C) a specific graft copolymer has excellent oxygen barrier properties. sex,
Provides molded products with stretchability, film thickness accuracy, and flexibility.
Claims (1)
50〜99.5重量%、 (B)密度0.90〜0.94g/cm^3のエチレン
系共重合体が0.4〜50重量%、 (C)ポリオレフィン系樹脂にエチレン性不飽和カルボ
ン酸またはその誘導体をグラフト反応させ、更にポリア
ミドを反応させてなるグラフト重合体が、0.1〜15
重量% の割合からなる性質の改善されたエチレン−酢酸ビニル
共重合体ケン化物系組成物。 2、特許請求の範囲第1項記載の組成物を溶融成型して
なる成型物。 3、特許請求の範囲第1項記載の組成物を少なくとも一
層とする積層構造物。 4、成型物又は積層構造物が少なくとも一軸方向に延伸
されてなる請求項2記載の成型物又は請求項3記載の積
層構造物。[Claims] 1. (A) saponified ethylene-vinyl acetate copolymer,
50 to 99.5% by weight, (B) 0.4 to 50% by weight of an ethylene copolymer with a density of 0.90 to 0.94 g/cm^3, (C) Ethylenically unsaturated carbon in the polyolefin resin A graft polymer obtained by grafting an acid or its derivative and further reacting a polyamide has a molecular weight of 0.1 to 15
A saponified ethylene-vinyl acetate copolymer composition with improved properties comprising a proportion of % by weight. 2. A molded article obtained by melt-molding the composition according to claim 1. 3. A laminated structure comprising at least one layer of the composition according to claim 1. 4. The molded product according to claim 2 or the laminate structure according to claim 3, wherein the molded product or the laminated structure is stretched in at least one axis.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29307090A JP2892485B2 (en) | 1990-10-29 | 1990-10-29 | Ethylene-vinyl acetate copolymer saponified composition having improved properties and use thereof |
US07/748,144 US5298334A (en) | 1990-02-01 | 1991-08-21 | Saponified ethylene-vinyl acetate copolymer composition and the use thereof |
EP91118271A EP0483695B1 (en) | 1990-10-29 | 1991-10-26 | Resin composition and use thereof |
DE69122469T DE69122469T2 (en) | 1990-10-29 | 1991-10-26 | Resin composition and its use |
US07/876,701 US5310788A (en) | 1990-02-01 | 1992-04-29 | Saponified ethylene-vinyl acetate copolymer composition and the use thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29307090A JP2892485B2 (en) | 1990-10-29 | 1990-10-29 | Ethylene-vinyl acetate copolymer saponified composition having improved properties and use thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04164943A true JPH04164943A (en) | 1992-06-10 |
JP2892485B2 JP2892485B2 (en) | 1999-05-17 |
Family
ID=17790064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29307090A Expired - Fee Related JP2892485B2 (en) | 1990-02-01 | 1990-10-29 | Ethylene-vinyl acetate copolymer saponified composition having improved properties and use thereof |
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Country | Link |
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JP (1) | JP2892485B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016533421A (en) * | 2013-09-24 | 2016-10-27 | アルケマ フランス | Thermoplastic composition, in particular thermoplastic composition for photovoltaic modules |
-
1990
- 1990-10-29 JP JP29307090A patent/JP2892485B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016533421A (en) * | 2013-09-24 | 2016-10-27 | アルケマ フランス | Thermoplastic composition, in particular thermoplastic composition for photovoltaic modules |
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