JPH0416463Y2 - - Google Patents
Info
- Publication number
- JPH0416463Y2 JPH0416463Y2 JP1985166292U JP16629285U JPH0416463Y2 JP H0416463 Y2 JPH0416463 Y2 JP H0416463Y2 JP 1985166292 U JP1985166292 U JP 1985166292U JP 16629285 U JP16629285 U JP 16629285U JP H0416463 Y2 JPH0416463 Y2 JP H0416463Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- convex lens
- emitting element
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985166292U JPH0416463Y2 (US06168655-20010102-C00055.png) | 1985-10-28 | 1985-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985166292U JPH0416463Y2 (US06168655-20010102-C00055.png) | 1985-10-28 | 1985-10-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6273564U JPS6273564U (US06168655-20010102-C00055.png) | 1987-05-11 |
| JPH0416463Y2 true JPH0416463Y2 (US06168655-20010102-C00055.png) | 1992-04-13 |
Family
ID=31097126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985166292U Expired JPH0416463Y2 (US06168655-20010102-C00055.png) | 1985-10-28 | 1985-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0416463Y2 (US06168655-20010102-C00055.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102280566A (zh) * | 2010-06-09 | 2011-12-14 | 北京汇冠新技术股份有限公司 | 一种红外发射管及触摸屏 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5164389A (US06168655-20010102-C00055.png) * | 1974-07-26 | 1976-06-03 | Toyo Electronics Ind Corp |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5124200Y2 (US06168655-20010102-C00055.png) * | 1972-06-06 | 1976-06-21 |
-
1985
- 1985-10-28 JP JP1985166292U patent/JPH0416463Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5164389A (US06168655-20010102-C00055.png) * | 1974-07-26 | 1976-06-03 | Toyo Electronics Ind Corp |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6273564U (US06168655-20010102-C00055.png) | 1987-05-11 |
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