JPH0416377A - Forming method for fine pattern and fine membranous conductor pattern - Google Patents
Forming method for fine pattern and fine membranous conductor patternInfo
- Publication number
- JPH0416377A JPH0416377A JP12024790A JP12024790A JPH0416377A JP H0416377 A JPH0416377 A JP H0416377A JP 12024790 A JP12024790 A JP 12024790A JP 12024790 A JP12024790 A JP 12024790A JP H0416377 A JPH0416377 A JP H0416377A
- Authority
- JP
- Japan
- Prior art keywords
- intaglio
- cylindrical roller
- printing
- fine
- cps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000004020 conductor Substances 0.000 title claims abstract description 17
- 229920001971 elastomer Polymers 0.000 claims abstract description 12
- 239000007787 solid Substances 0.000 claims abstract description 12
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 11
- 239000004945 silicone rubber Substances 0.000 claims abstract description 11
- 239000013013 elastic material Substances 0.000 claims abstract 4
- 238000007639 printing Methods 0.000 claims description 45
- 150000002902 organometallic compounds Chemical class 0.000 claims description 19
- 238000003825 pressing Methods 0.000 claims description 14
- 239000010409 thin film Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 230000004580 weight loss Effects 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000007645 offset printing Methods 0.000 claims description 7
- 238000010304 firing Methods 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 230000001747 exhibiting effect Effects 0.000 claims description 2
- 238000001595 flow curve Methods 0.000 claims description 2
- 230000007261 regionalization Effects 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 1
- 229920003023 plastic Polymers 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 12
- 239000002184 metal Substances 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は凹版オフセット方式の印刷による微細パターン
形成方法並びにこれを利用した微細薄膜導体パターン形
成方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for forming fine patterns by intaglio offset printing and a method for forming fine thin film conductor patterns using the same.
従来の技術
近年、エレクトロニクス製品は軽薄短小の傾向にあり、
それに伴って、配線基板の導体パターンは益々細く、高
密度になってきている。この様な高密度化に対応するた
め、例えば、５０μｍ幅の配線を含むような微細パター
ンの作製や微細薄膜導体の作製には従来フォトリソグラ
フィーが用いられている。第２図（ａ）〜（ｆ）は、従
来のフォトリソグラフィーによる微細パターン形成方法
の一例である。第２図（ａ）は金属膜層形成基板、第２
図（ｂ）はフォトレジスト塗布工程、第２図（Ｃ）は露
光工程、第２図（６）は現像工程、第２図（ｅ）はエツ
チング工程、第２図（ｆ）は微細パターン形成基板をそ
れぞれ示す。Conventional technology In recent years, electronic products have become lighter, thinner, shorter, and smaller.
Along with this, the conductor patterns of wiring boards are becoming thinner and denser. In order to cope with such higher density, photolithography has conventionally been used to fabricate fine patterns including, for example, 50 μm wide wiring and to fabricate fine thin film conductors. FIGS. 2(a) to 2(f) show an example of a conventional method for forming fine patterns using photolithography. FIG. 2(a) shows a metal film layer forming substrate, a second
Figure (b) is the photoresist coating process, Figure 2 (C) is the exposure process, Figure 2 (6) is the development process, Figure 2 (e) is the etching process, and Figure 2 (f) is the fine pattern formation. Each board is shown.
また、１は基板、２は金属膜層、３はフォトレジスト、
４はフォトマスク、５はＵｖ光である。まず、基板１上
に金属膜層２を形成した金属膜形成基板にフォトレジス
ト３を塗布する。次に、フォトマスク４を用いてＵｖ光
５にて露光する。これを有機溶剤等で現像した後、残っ
たフォトレジスト３をマスクとしてエツチング液により
金属膜層２をエツチングして、微細パターン形成基板を
作製することができる。フォトリソグラフィーによる微
細パターンは寸法精度が高く、再現性も良好である。In addition, 1 is a substrate, 2 is a metal film layer, 3 is a photoresist,
4 is a photomask, and 5 is UV light. First, a photoresist 3 is applied to a metal film forming substrate on which a metal film layer 2 is formed on a substrate 1 . Next, exposure is performed with UV light 5 using a photomask 4. After developing this with an organic solvent or the like, the metal film layer 2 is etched with an etching solution using the remaining photoresist 3 as a mask, thereby producing a fine pattern-formed substrate. Fine patterns formed by photolithography have high dimensional accuracy and good reproducibility.
この他、容易なパターン形成方法としては印刷法がある
。In addition, there is a printing method as an easy pattern forming method.
発明が解決しようとする課題
しかしながら、上記に示すようなフォトリソグラフィー
による微細パターン形成方法は、高精度露光装置や大型
エツチング装置等の高価な設備が必要であり、製造工数
が多いため、製品がコスト高になるというい大きな問題
がある。Problems to be Solved by the Invention However, the method of forming fine patterns using photolithography as described above requires expensive equipment such as high-precision exposure equipment and large-scale etching equipment, and requires a large number of manufacturing steps. There is a big problem with getting high.
そのため、最近では、１０μｍ−１００μｍ幅程度の７
ァインラインを印刷により形成する技術が望まれている
。印刷によるパターン形成方法では、スクリーン印刷方
式が主流であるが、スクリーン印刷法では高密度な５０
μｍ幅以下のファインラインを含むような微細パターン
の印刷は容易ではなく、１１００ｕ幅程度のパターンで
ないと安定した印刷が行えないのが現状である。また、
スクリーン印刷法は一般的に１０μｍ程度の厚膜印刷を
目的としており、３０μｍ幅で、かつ最終厚みがｌＩＩ
ｍ以下であるような微細薄膜導体パターンの形成は大変
困難である。Therefore, recently, 7mm width of about 10μm-100μm
A technique for forming fine lines by printing is desired. Screen printing is the mainstream method for forming patterns by printing, but screen printing uses high-density 50%
It is not easy to print fine patterns that include fine lines with a width of less than μm, and currently stable printing cannot be performed unless the pattern is about 1100 μm wide. Also,
The screen printing method is generally aimed at printing a thick film of about 10 μm, with a width of 30 μm and a final thickness of lII.
It is very difficult to form a fine thin film conductor pattern with a thickness of less than m.
課題を解決するための手段
本発明は上記課題を解決するために、凹版オフセット印
刷であって、最表面層がゴム硬度にして３５度以上の比
較的固いシリコンゴム等からなる円筒型ローラと、溝深
さが１０μｍ以上である凹版を使用して、凹版上での円
筒型ローラ押圧力と被印刷体上での円筒型ローラ押圧力
とが同一で、かつ、凹版上での、凹版と円筒型ローラの
と相対移動速度が４０ｍｍ／ｓｅｃ以下と比較的遅いこ
とを特徴とし、並びに凹版が溝形状の均一なガラス凹版
であることやインクが２５℃で３０００ｃｐｓ ＝ １
００００ｃｐｓの比較的低粘度の金属有機化合物ペース
トあるいは１０００００〜１５００００ｃｐｓの非ビン
ガム流動特性を示すペーストであること、また被印刷体
が水溶性樹脂によって被覆されていること等を特徴とす
る１０μｍ〜１００μｍ幅の細線を含む複雑なパターン
の印刷を安価に大変精度良く行えることを目的とした微
細パターン形成方法、並びに微細薄膜導体パターン形成
方法を提供するものである。Means for Solving the Problems In order to solve the above problems, the present invention provides a cylindrical roller for intaglio offset printing, the outermost layer of which is made of relatively hard silicone rubber or the like with a rubber hardness of 35 degrees or more; Using an intaglio plate with a groove depth of 10 μm or more, the pressing force of the cylindrical roller on the intaglio plate is the same as the pressing force of the cylindrical roller on the printing medium, and the intaglio plate and the cylinder on the intaglio plate are It is characterized by a relatively slow relative movement speed of 40 mm/sec or less with respect to the mold roller, and the intaglio is a glass intaglio with a uniform groove shape, and the ink is 3000 cps at 25°C = 1
A metal-organic compound paste with a relatively low viscosity of 0,000 cps or a paste exhibiting non-Bingham fluidity of 100,000 to 150,000 cps, and a width of 10 μm to 100 μm characterized by the fact that the printing material is coated with a water-soluble resin. The present invention provides a method for forming a fine pattern, and a method for forming a fine thin film conductor pattern, with the aim of printing a complex pattern including fine lines at low cost and with high accuracy.
作用
本発明は上記した方法によって、１０１１ｍ〜１００μ
ｍ幅の細線を含む複雑なパターンを低コストで、かつ容
易に、ピンホールや欠けも無く高精度に印刷でき、微細
な薄膜導体パターンを蒸着やエンチング無しに形成でき
るものである。Effect The present invention uses the above-described method to
Complex patterns including m-wide thin lines can be easily printed at low cost and with high precision without pinholes or chips, and fine thin film conductor patterns can be formed without vapor deposition or etching.
実施例
以下、本発明の一実施例について図面を参照しながら説
明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.
実施例１
第１図（ａ）〜（Ｃ）は本発明の一実施例における微細
パターンの形成方法を示す工程説明図である。第１図（
ａ）はインク充填工程、第１図ら）は転写工程、第１図
（Ｃ）は印刷工程である。また、６はスフレイパー、７
はインク、８は凹版、９は転写体ローラ、１０は被印刷
体である。転写体ローラ９にはゴム硬度にして５２度（
ＪＩＳ ＫＳ３０１Ａ形 厚さ１２■の場合）、厚さ２
■のシリコンゴムで最表層を被覆した中空のステンレス
ローラを使用し、インク７には固形分が５０重量％で、
２５℃での粘度が７０００ｃｐｓである無機粉末と有機
ビヒクルとを混練したペーストを、凹版８には深さ１０
μｍ以上、幅５０μｍの溝を有するステンレス製凹版を
使用した。被印刷体１０はセラミック基板である。先ず
、インク２を凹版８上に塗り、溝内にインク２を充填し
ながら、凹版８上の余分なインク２をスフレイパ−６で
掻き取った。次に、転写体ローラ９を一定押圧力、転写
速度２０ｍ／ｓｅｃの条件で凹版８に押し当てつつ回転
させて、インク２を転写体ローラ９上に転写した。Embodiment 1 FIGS. 1(a) to 1(C) are process explanatory diagrams showing a method for forming a fine pattern in an embodiment of the present invention. Figure 1 (
a) shows the ink filling process, FIG. 1 et al.) shows the transfer process, and FIG. 1(C) shows the printing process. Also, 6 is souffler, 7 is
8 is an ink, 8 is an intaglio plate, 9 is a transfer roller, and 10 is a printing medium. The transfer roller 9 has a rubber hardness of 52 degrees (
JIS KS301A type thickness 12), thickness 2
A hollow stainless steel roller whose outermost layer is covered with silicone rubber is used, and ink 7 has a solid content of 50% by weight.
A paste made by kneading an inorganic powder and an organic vehicle with a viscosity of 7000 cps at 25°C is placed in the intaglio plate 8 at a depth of 10 cps.
A stainless steel intaglio plate having grooves with a width of 50 μm or more was used. The printing medium 10 is a ceramic substrate. First, ink 2 was applied onto the intaglio plate 8, and while filling the grooves with the ink 2, the excess ink 2 on the intaglio plate 8 was scraped off with a spray scraper 6. Next, the ink 2 was transferred onto the transfer roller 9 by rotating the transfer roller 9 while pressing it against the intaglio 8 under the conditions of a constant pressing force and a transfer speed of 20 m/sec.
しかる後に、転写時と同一の押圧力、同一の印刷速度で
、インク２の転写した転写体ローラ９を被印刷体１０上
に押し当てつつ回転させて、被印刷体１０上にインク２
を印刷した。Thereafter, the transfer roller 9 on which the ink 2 has been transferred is rotated while pressing it onto the printing medium 10 with the same pressing force and the same printing speed as during the transfer, so that the ink 2 is applied onto the printing medium 10.
was printed.
この印刷方法により、５０μｍ幅のピンホールの無い微
細パターンを、精度良く、かつ凹版８のパターンに忠実
に印刷できた。転写体ローラ９は弾性表面を有するロー
ラであるため、弾性体の歪みはパターンの精度に大きく
影響する。従って、表面の変形をおさえるために、弾性
体の硬度は比較的高めが良く、ゴム硬度にして３５度よ
り大きい方が精度の良い印刷ができた。また、弾性体の
厚みが厚くなると弾性体が変形しやすくなるため、その
厚みは薄い方が良く、特に硬度が６０度以下の弾性体を
使用する場合には、その厚みは２Ｗ以下が良かった。ま
た、転写、印刷時の転写体ローラ９の圧力を同一として
、弾性体の全体的な変形をできるだけ同一にすることに
より、印刷ピッチ精度の良い印刷が可能となった。また
、凹版８がら転写体ローラ９への転写速度が遅い程、イ
ンク２の転写量が多く、ピンホール発生を抑制すること
ができた。インク２の粘度が高すぎる場合には、転写体
ローラ９への転写量が少なくなり、印刷される細線が破
線状になり易かった。また、シリコーンゴム弾性体の下
にポリウレタンの発泡体である圧縮層を有する転写体ロ
ーラを使用した場合には、ムラの少ない更に良い品質の
印刷を行うことができた。By this printing method, a pinhole-free fine pattern with a width of 50 μm could be printed accurately and faithfully to the pattern of the intaglio plate 8. Since the transfer roller 9 is a roller having an elastic surface, distortion of the elastic body greatly affects pattern accuracy. Therefore, in order to suppress surface deformation, it is better to have a relatively high hardness of the elastic body, and a rubber hardness greater than 35 degrees allows for more accurate printing. In addition, the thicker the elastic body, the more easily it deforms, so the thinner it is, the better. Especially when using an elastic body with a hardness of 60 degrees or less, the thickness should be 2W or less. . Furthermore, by making the pressure of the transfer roller 9 the same during transfer and printing and making the overall deformation of the elastic body as uniform as possible, printing with high printing pitch accuracy has become possible. Furthermore, the slower the transfer speed from the intaglio plate 8 to the transfer body roller 9, the larger the amount of ink 2 transferred, and the generation of pinholes could be suppressed. If the viscosity of the ink 2 was too high, the amount of ink transferred to the transfer roller 9 would be small, and the printed thin line would likely become a broken line. Further, when a transfer roller having a compressed layer of polyurethane foam under the silicone rubber elastic body was used, even better quality printing with less unevenness could be achieved.
なお、ゴム硬度３０度以下のシリコーンゴムを使用する
グラビアオフセット印刷方式の厚膜印刷方法として、特
許１０５５２９０があるが、この特許は高粘度で流動性
に乏しく、ぼそぼそしたインクを厚く印刷する印刷手段
であり、印刷膜厚を厚くするために、比較的ゴム硬度の
低い３０度以下のシリコーンゴムを使用している。ゴム
硬度３０以下のシリコーンゴムは転移したインクをつぶ
すことは避けられるが、印刷時にゴムが変形しやすいた
め、寸法精度の良い印刷はできず、特に、数＋μｍオー
ダーの細線を有する複雑な微細パターンを１０μｍ前後
の印刷位置精度で印刷することはできない。Note that there is a patent No. 1055290 as a thick film printing method using a gravure offset printing method that uses silicone rubber with a rubber hardness of 30 degrees or less, but this patent is a printing method that thickly prints a sloppy ink with high viscosity and poor fluidity. In order to increase the thickness of the printed film, silicone rubber with a relatively low rubber hardness of 30 degrees or less is used. Silicone rubber with a rubber hardness of 30 or less can avoid crushing the transferred ink, but the rubber is easily deformed during printing, making it impossible to print with good dimensional accuracy, especially for complex fine patterns with fine lines on the order of several micrometers. cannot be printed with a printing position accuracy of around 10 μm.
以上のような理由から、本発明は特許１０５５２９０と
は目的および解決手段の全く異なるものである。For the above-mentioned reasons, the present invention has a completely different purpose and solution from that of Patent No. 1055290.
実施例２
実施例１と同様の工程手順で、凹版８に３０μｍ幅、深
さ１０μｍ以上の溝を有するガラス製凹版を使用し、イ
ンク２として固形分を７０重量％含み、その粘度が２５
℃で１０００００ｃｐｓであるカーボンペーストを使用
して印刷を行った。このカーボンペーストの粘性は非ビ
ンガム流動特性を示し、その印刷細線の品質は良好であ
った。粘度が１０００００ｃｐｓであって、流動曲線が
擬塑性流動を示すようなインクを使用した場合は粘度が
高すぎて充分な転写ができなかった。Example 2 In the same process procedure as in Example 1, a glass intaglio plate having grooves of 30 μm width and 10 μm or more in depth was used as the intaglio plate 8, and the ink 2 contained 70% by weight of solids and had a viscosity of 2.5 μm.
Printing was carried out using carbon paste that was 100,000 cps at °C. The viscosity of this carbon paste showed non-Bingham flow characteristics and the quality of its printed fine lines was good. When an ink with a viscosity of 100,000 cps and a flow curve showing pseudoplastic flow was used, the viscosity was too high and sufficient transfer could not be achieved.
実施例３
実施例１と同様の工程手段で、凹版８に３０μｍ幅、゛
深さ１０μｍ以上の溝を有するガラス製凹版を使用し、
インク２として２５℃で粘度が５０００ｃｐｓ、溶剤分
が４５重量％であるＡｕの金属有機化合物ペーストを使
用して印刷を行った。微細パターンの細線が３０μｍ程
度に細くなると、印刷細線は凹版８の溝の表面状態や溝
の直線性の影響を大きく受ける。そのため、溝の表面状
態が滑らかで直線性に優れたガラス凹版を用い、並びに
細い溝からインク２を転写体ローラ９に転写さセ、かつ
転写したインク２を確実に被印刷体１０上に印刷するた
めに比較的低粘度で、かつ溶剤分を４５重量％以上含む
Ａｕの金属有機化合物ペーストをインク２として用いた
。これにより、直線性が良く、厚みムラの小さい３０μ
ｍ幅の細線を含む複雑な微細パターンを印刷することが
可能となった。また、Ａｕの金属有機化合物ペーストの
微細パターンを印刷したセラミンク基板を８５０℃、空
気中で焼成することにより、３０膜ｍ幅のＡｕ導体薄膜
細線を有する微細薄膜導体パターンを蒸着法やフォトリ
ングラフイーを用いずに、容易かつ安価に形成すること
ができた。Example 3 Using the same process means as in Example 1, a glass intaglio plate having grooves of 30 μm width and 10 μm or more in depth was used for the intaglio plate 8,
Printing was performed using an Au metal organic compound paste having a viscosity of 5000 cps at 25° C. and a solvent content of 45% by weight as Ink 2. When the fine lines of the fine pattern become as thin as about 30 μm, the printed fine lines are greatly influenced by the surface condition of the grooves of the intaglio plate 8 and the linearity of the grooves. Therefore, a glass intaglio plate with smooth groove surface and excellent linearity is used, and the ink 2 is transferred from the narrow groove to the transfer roller 9, and the transferred ink 2 is reliably printed on the printing medium 10. In order to achieve this, an Au metal organic compound paste having a relatively low viscosity and containing a solvent content of 45% by weight or more was used as ink 2. As a result, the 30μ film has good linearity and small thickness unevenness.
It has become possible to print complex fine patterns including m-wide thin lines. In addition, by firing a ceramic substrate printed with a fine pattern of Au metal-organic compound paste at 850°C in the air, a fine thin film conductor pattern having a thin Au conductor thin line with a width of 30 m was produced using the evaporation method or photolithography method. It could be formed easily and inexpensively without using E.
この薄膜の厚みは、約１５００人であり膜質も良好であ
った。The thickness of this thin film was approximately 1,500 people, and the film quality was also good.
なお、本発明において転写体ローラ９の構造やインク２
の材料の構成等は本実施例に限定するものではない。In addition, in the present invention, the structure of the transfer roller 9 and the ink 2
The structure of the materials and the like are not limited to those in this example.
実施例４
３％のＰＶＡ水溶液をアルミナ基板表面にスピンコード
した後に、これを１１０℃で乾燥して被印刷体１０とし
た。実施例３と同様にして、３０μｍ幅の細線を含むＡ
ｕの金属有機化合物ペーストの微細パターンを印刷した
。次に、この印刷基板を乾燥した後、８５０℃で空気中
焼成してＡｕの微細薄膜導体パターンを得た。この薄膜
の品質は良好であった。Example 4 A 3% PVA aqueous solution was spin-coded onto the surface of an alumina substrate, and then dried at 110° C. to obtain a printing material 10. A containing a thin line of 30 μm width was prepared in the same manner as in Example 3.
A fine pattern of metal-organic compound paste was printed. Next, after drying this printed board, it was fired in air at 850° C. to obtain a fine thin-film conductor pattern of Au. The quality of this thin film was good.
アルミナ基板にＰＶＡに被膜を施すことにより、ＰＶＡ
がいわば接着剤として働き、Ａｕの金属有機化合物ペー
ストの微細線を１００％確実に印刷するごとが可能とな
った。また、接着剤として有機溶剤系のものを使用する
と、金属有機化合物ペースト中の有機溶剤により、接着
剤と有機金属化合物ペーストとが相溶を起こすことがあ
るが、本発明においてＰＶＡは水溶液であるため、相溶
を防ぐことができた。使用したＰＶＡは空気中焼成時に
おいて、その第一次減量開始温度がＡｕの金属有機化合
物ペーストの固形分の第一減量開始温度より遅く、かつ
その減量終了温度がＡｕの金属有機化合物ペーストの固
形分の減量終了温度より遅いものである。空気中焼成時
において、第一次減量開始温度がＡｕの金属有機化合物
ペーストの固形分の第一減量開始温度より早かったり、
その減量終了温度がＡｕの金属有機化合物ペーストの固
形分の減量終了温度より早い樹脂を使用した場合にはＡ
ｕ１７膜が剥離してしまった。By coating PVA on an alumina substrate, PVA
Acts as an adhesive, so to speak, making it possible to print fine lines of Au metal-organic compound paste with 100% certainty. Furthermore, if an organic solvent-based adhesive is used as an adhesive, the organic solvent in the metal-organic compound paste may cause the adhesive and the metal-organic compound paste to become compatible; however, in the present invention, PVA is an aqueous solution. Therefore, compatibility could be prevented. When the PVA used is fired in air, its first weight loss start temperature is later than the first weight loss start temperature of the solid content of the Au metal organic compound paste, and its weight loss end temperature is lower than the solid content of the Au metal organic compound paste. It is later than the end temperature of the weight loss in minutes. During firing in air, the first weight loss start temperature is earlier than the first weight loss start temperature of the solid content of the Au metal organic compound paste,
When using a resin whose weight loss end temperature is earlier than the weight loss end temperature of the solid content of the Au metal-organic compound paste, A
The u17 film has peeled off.
発明の効果
以上のように本発明は、最表面層がゴム硬度（ＪＩＳ
Ｋ６３０１ Ａ形）にして３５度以上の比較的固いシリ
コンゴム等からなる円筒型ローラと、溝深さが１０μｍ
以上である凹版を使用して、凹版上での円筒型ローラ押
圧力と被印刷体上での円筒型ローラ押圧力とが同一で、
かつ、凹版上での、凹版と円筒型ローラのと相対移動速
度が４０ｍｍ／ｓｅｃ以下と比較的遅い条件下で、凹版
オフセット印刷による印刷を行い、並びに凹版として溝
形状の均一なガラス凹版を用いたり、インクに２５℃で
３０００ｃｐｓ〜１００００ｃｐｓの比較的低粘度の金
属有機化合物ペーストあるいは１０００００＝１５００
００ｃｐｓの非ビンガム流動特性を示すペーストを、ま
た更には水溶性樹脂により表面を被覆した被印刷体等を
用いることにより、１０ｔＩｍ−１００μｍ幅の細線を
含む複雑な微細パターンや微細薄膜導体パターンをフォ
トリソグラフィー等の高価な手段によらずに、確実でよ
り安価に、かつ精度良く形成することが可能となった。Effects of the Invention As described above, the present invention has the outermost layer having a rubber hardness (JIS
K6301 A type) with a cylindrical roller made of relatively hard silicone rubber, etc. with an angle of 35 degrees or more, and a groove depth of 10 μm.
Using the above intaglio plate, the cylindrical roller pressing force on the intaglio plate and the cylindrical roller pressing force on the printing medium are the same,
In addition, printing is performed by intaglio offset printing under conditions where the relative movement speed between the intaglio and the cylindrical roller on the intaglio is relatively slow at 40 mm/sec or less, and a glass intaglio with uniform grooves is used as the intaglio. or ink with a relatively low viscosity metal organic compound paste of 3000 cps to 10000 cps at 25°C or 100000 = 1500
By using a paste that exhibits non-Bingham fluidity of 00 cps, or by using a printing material whose surface is coated with a water-soluble resin, it is possible to photograph complex fine patterns including thin lines of 10tIm-100μm width and fine thin film conductor patterns. It has now become possible to form reliably, inexpensively, and with high precision without using expensive means such as lithography.
第１図（ａ）、（ｂ）、（Ｃ）は本発明の一実施例にお
ける微細パターンの形成方法を示す工程説明図、第２図
（ａ）、Φ）、（Ｃ）、（ハ）、（ｅ）、（ｆ）は従来
のフォトリソグラフィーによる微細パターンの形成方法
の一例を示す図である。
１・・・・・・基板、２・・・・・・金属膜層、３・・
・・・・フォトレジスト、４・・・・・・フォトマスク
、５・・・・・・ＵＶ光、６・・・・・・スフレイパー
、７・・・・・・インク、８・・・・・・凹版、９・・
・・・・転写体ローラ、１０・・・・・・被印刷体。
代理人の氏名 弁理士 粟野重孝 はか１名スクレイハ
０
インク
１０−−［ｊＴｌｊし１イ１＼
／−一基板
２ｍｍ・ｆｆ１Ａ膿１
３′−）實（レジスト
４− ）χトマスクFIGS. 1(a), (b), and (C) are process explanatory diagrams showing a method for forming a fine pattern in an embodiment of the present invention, and FIGS. 2(a), Φ), (C), and (c) are , (e), and (f) are diagrams showing an example of a method for forming a fine pattern by conventional photolithography. 1...Substrate, 2...Metal film layer, 3...
... Photoresist, 4 ... Photomask, 5 ... UV light, 6 ... Sprayer, 7 ... Ink, 8 ... ...Intaglio, 9...
...Transfer roller, 10... Printing material. Agent's name: Patent attorney Shigetaka Awano 1 person Screha 0 Ink 10--[jTljshi1i1\/-1 substrate 2mm・ff1Apus1 3'-)Resist (Resist 4-)χ Tomask
Claims (10)
度にして３５度以上であるシリコーンゴム等の離型性を
有する弾性体からなる円筒型ローラと、溝深さが１０ミ
クロン以上である凹版を使用して、凹版上での前記円筒
型ローラ押圧力と被印刷体上での前記円筒型ローラ押圧
力とを同一値とし、かつ、前記凹版上での前記凹版と前
記円筒型ローラとの相対移動速度を４０ｍｍ／ｓｅｃ以
下にして、固形分を２０〜８５重量％含むインクを被印
刷体に印刷することを特徴とする微細パターン形成方法
。(1) Intaglio offset printing, with a cylindrical roller whose outermost surface layer is made of an elastic material with release properties such as silicone rubber with a rubber hardness of 35 degrees or more, and a groove depth of 10 microns or more. Using an intaglio plate, the pressing force of the cylindrical roller on the intaglio plate and the pressing force of the cylindrical roller on the printing medium are the same value, and the intaglio plate and the cylindrical roller on the intaglio plate are A method for forming a fine pattern, comprising printing an ink containing 20 to 85% by weight of solids on a printing material at a relative movement speed of 40 mm/sec or less.
ーラが前記弾性体の下方に圧縮層を有する請求項（１）
記載の微細パターン形成方法。(2) Claim (1) wherein the thickness of the elastic body is 2 mm or less, and the cylindrical roller has a compressed layer below the elastic body.
The described fine pattern formation method.
）のいずれかに記載の微細パターン形成方法。(3) Claim (1) or (2) in which the intaglio is a glass intaglio
) The method for forming a fine pattern according to any one of
が室温で３０００ｃｐｓ〜１００００ｃｐｓである請求
項（２）又は（３）のいずれかに記載の微細パターン形
成方法。(4) The method for forming a fine pattern according to any one of claims (2) and (3), wherein the ink contains 40% by weight or more of solid content and has a viscosity of 3,000 cps to 10,000 cps at room temperature.
が２５℃で１０００００ｃｐｓ〜１５００００ｃｐｓで
あり、かつ、その流動曲線が塑性流動の非ビンガム特性
を示す請求項（２）又は（３）のいずれかに記載の微細
パターン形成方法。(5) The ink contains 60% by weight or more of solids, has a viscosity of 100,000 cps to 150,000 cps at 25°C, and has a flow curve exhibiting non-Bingham characteristics of plastic flow. The fine pattern forming method according to any one of the above.
粘度が２５℃で３０００ｃｐｓ〜１００００ｃｐｓの金
属有機化合物ペーストである請求項（２）又は（３）の
いずれかに記載の微細パターン形成方法。(6) The method for forming a fine pattern according to any one of claims (2) and (3), wherein the ink is a metal-organic compound paste containing 30% by weight or more of a solvent and having a viscosity of 3,000 cps to 10,000 cps at 25°C. .
リコーンゴム等の離型性を有する厚さ２μｍ以下の弾性
体からなる円筒型ローラと、溝深さが１０ミクロン以上
であるガラス凹版と、溶剤分を３０重量％以上含み、そ
の粘度が２５℃で３０００ｃｐｓ〜１００００ｃｐｓで
あるＡｕの金属有機化合物ペーストのインクを使用して
、前記凹版上での前記円筒型ローラ押圧力と被印刷体上
での前記円筒型ローラ押圧力とを同一値とし、かつ、前
記凹版上での前記凹版と前記円筒型ローラのと相対移動
速度を４０ｍｍ／ｓｅｃ以下とした条件下で、微細なパ
ターンを前記被印刷体上に凹版オフセット印刷により印
刷し、しかる後に、前記被印刷体上に印刷された微細な
パターンを前記被印刷体と共に焼成することを特徴とす
る微細薄膜導体パターンの形成方法。(7) A cylindrical roller whose outermost surface layer is made of an elastic material with a thickness of 2 μm or less and having releasability such as silicone rubber with a rubber hardness of 35 degrees or more, and glass with a groove depth of 10 μm or more. Using an intaglio plate and an Au metal-organic compound paste ink containing 30% by weight or more of a solvent and having a viscosity of 3,000 cps to 10,000 cps at 25°C, the pressing force of the cylindrical roller on the intaglio plate and the printing target were determined. A fine pattern is formed under the conditions that the pressing force of the cylindrical roller on the body is the same value, and the relative movement speed of the intaglio plate and the cylindrical roller on the intaglio plate is 40 mm/sec or less. A method for forming a fine thin film conductor pattern, comprising printing on the printing material by intaglio offset printing, and then firing the fine pattern printed on the printing material together with the printing material.
なる水溶性樹脂被膜を有する被印刷体と、最表面層が、
ゴム硬度にして３５度以上であるシリコーンゴム等の離
型性を有する厚さ２μｍ以下の弾性体からなる円筒型ロ
ーラと、溝深さが１０ミクロン以上であるガラス凹版と
、溶剤分を３０重量％以上含み、その粘度が２５℃で３
０００ｃｐｓ〜１００００ｃｐｓであるＡｕの金属有機
化合物ペーストのインクを使用して、前記凹版上での前
記円筒型ローラ押圧力と被印刷体上での前記円筒型ロー
ラ押圧力とを同一値とし、かつ、前記凹版上での前記凹
版と前記円筒型ローラのと相対移動速度を４０ｍｍ／ｓ
ｅｃ以下とした条件下で、微細なパターンを前記被印刷
体上に凹版オフセット印刷により印刷し、しかる後に、
前記被印刷体上に印刷された微細なパターンを前記被印
刷体と共に焼成することを特徴とする微細薄膜導体パタ
ーンの形成方法。(8) A printing material having a water-soluble resin coating formed by coating an aqueous solution of a water-soluble resin and then drying the water, and an outermost surface layer,
A cylindrical roller made of an elastic material with a thickness of 2 μm or less and having releasability such as silicone rubber with a rubber hardness of 35 degrees or more, a glass intaglio with a groove depth of 10 μm or more, and a solvent of 30% by weight. % or more, and its viscosity is 3 at 25°C.
000 cps to 10,000 cps of Au metal organic compound paste ink, the pressing force of the cylindrical roller on the intaglio plate and the pressing force of the cylindrical roller on the printing medium are set to the same value, and, The relative movement speed of the intaglio and the cylindrical roller on the intaglio is 40 mm/s.
A fine pattern is printed on the printing substrate by intaglio offset printing under conditions of ec or less, and then,
A method for forming a fine thin film conductor pattern, comprising firing the fine pattern printed on the printing material together with the printing material.
開始温度がＡｕの金属有機化合物ペーストの固形分の第
一減量開始温度より遅く、かつ、水溶性樹脂の減量終了
温度がＡｕの金属有機化合物ペーストの固形分の減量終
了温度と同じか、あるいは遅いという関係である請求項
（８）記載の微細薄膜導体パターンの形成方法。(9) When firing in air, the first weight loss start temperature of the water-soluble resin is later than the first weight loss start temperature of the solid content of the Au metal-organic compound paste, and the weight loss end temperature of the water-soluble resin is lower than the first weight loss start temperature of the Au metal organic compound paste. 9. The method for forming a fine thin film conductor pattern according to claim 8, wherein the temperature is the same as or later than the solid content reduction end temperature of the metal-organic compound paste.
）である請求項（８）または（９）のいずれかに記載の
微細薄膜導体パターンの形成方法。(10) The water-soluble resin is polyvinyl alcohol (PVA)
) The method for forming a fine thin film conductor pattern according to claim 8 or 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12024790A JP2819770B2 (en) | 1990-05-10 | 1990-05-10 | Fine pattern forming method and fine thin film conductor pattern forming method |
| US07/698,563 US5362513A (en) | 1990-05-10 | 1991-05-10 | Method of manufacturing a pattern of conductive fine-line films and setting ink used for the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12024790A JP2819770B2 (en) | 1990-05-10 | 1990-05-10 | Fine pattern forming method and fine thin film conductor pattern forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0416377A true JPH0416377A (en) | 1992-01-21 |
| JP2819770B2 JP2819770B2 (en) | 1998-11-05 |
Family
ID=14781479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12024790A Expired - Fee Related JP2819770B2 (en) | 1990-05-10 | 1990-05-10 | Fine pattern forming method and fine thin film conductor pattern forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2819770B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100594894B1 (en) * | 2006-05-10 | 2006-06-30 | (주)다인엔지니어링컨설턴트 | Contact apparatus for knife-blade using a common housing |
| KR100990312B1 (en) * | 2003-06-26 | 2010-10-26 | 엘지디스플레이 주식회사 | Forming method of color filter of liquid crystal display device |
-
1990
- 1990-05-10 JP JP12024790A patent/JP2819770B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100990312B1 (en) * | 2003-06-26 | 2010-10-26 | 엘지디스플레이 주식회사 | Forming method of color filter of liquid crystal display device |
| KR100594894B1 (en) * | 2006-05-10 | 2006-06-30 | (주)다인엔지니어링컨설턴트 | Contact apparatus for knife-blade using a common housing |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2819770B2 (en) | 1998-11-05 |
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