JPH04163298A - Temperature control mechanism for electronic device mounted on artificial satellite and spacecraft - Google Patents

Abstract

PURPOSE:To hold the environment temperature of an electronic device, mounted on an artificial satellite, within an allowable temperature range by a method wherein a heat pipe, a container filled with a phase change material, and an electric heater are provided in a component unit containing an electronic part and a secondary battery. CONSTITUTION:A power amplifier for a communication satellite has a relay panel 5 serving as a base plate and a casing 9 installed to the relay panel, and an electronic part circuit base plate 7 on which an electronic part 1 being a heat generating body is mounted through a heat carrier 6 is contained in the casing. A heat pipe 2 is installed in a state to be adhered to the inner surface of the bottom wall of the casing 9. Heat generated by the electronic part 1 is transmitted to the heat pipe 2 through conduction to heat phase change materials 3a and 3b with which containers 4a and 4b are sealed. When the temperature of the phase change material 3a is increased to the melt point thereof, the phase change material 3a is started to melt. During the melt, temperature is kept approximately at a constant value as a melt latent heat is absorbed. The phase change material 3b has a melt point in the vicinity of the lower limit of an allowable temperature range.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a mechanism for controlling the environmental temperature of electronic components of electronic equipment mounted on artificial satellites and spacecraft to be maintained within a permissible range.

[Conventional technology]

Conventionally, thermal control methods for electronic devices mounted on artificial satellites have been described in the 32nd Space Science and Technology Union Conference Lecture Collection (198
8) discussed on pp 125-153. In this method, by incorporating a heat pipe inside the board on which the electronic equipment is mounted, the temperature of the metal plate on which the electronic equipment is mounted is made equal, while the electronic equipment on the board on which the electronic equipment is mounted is A heat dissipation surface is installed on the small side of the electronic equipment that is not installed or is installed, and the heat is radiated into space.

FIG. 4 is a schematic cross-sectional view showing a thermal control mechanism of an electronic device mounted on an artificial satellite or spacecraft in the prior art.

Reference numeral 11 denotes an electronic device, which is a heating element from a thermal perspective, and its calorific value changes.

The aluminum honeycomb 13 is fixed between two aluminum plates 12a and 12b, and the electronic device 11 is mounted on one of the two aluminum plates 12a, and the electronic device 11 is mounted on the other aluminum plate 12b. A coating 14 that reflects sunlight is provided on the outer surface. A heat pipe 2 is embedded in the aluminum honeycomb 13.

A portion of the heat generated by the electronic device 11 is transferred to the aluminum plate 12a, aluminum honeycomb 13. It passes through the aluminum plate 12b and is dissipated into space.

Also, some of the generated heat is transferred to the heat pipe 2 due to thermal conduction.
Due to this heat, the working fluid in the warmed part of the heat pipe is vaporized and diffused to the lower temperature part of the heat pipe. This vaporized working fluid is cooled and liquefied in the lower temperature part of the heat pipe, and returns to the part heated by the heating element in the heat pipe through the reflux path provided inside the heat pipe. go.

By repeating this operation, the entire heat pipe becomes isothermal, and the heat generated at a high heat generation density can be efficiently diffused.

[Problem to be solved by the invention]

As artificial satellite and spacecraft technology advances, the arrangement of components inside the electronic devices installed on these satellites also tends to become more dense. As the internal density of electronic devices increases, thermal conditions also become stricter, resulting in higher heat generation density and increased calorific value.

However, in the above-mentioned known technology (collection of lectures from the Space Science and Technology Alliance Conference), it is assumed that electronic devices that have heat generating elements with high heat density and high heat generation are already thermally controlled. However, no consideration was given to the thermal control of the electronic equipment itself, leaving the problem of how to control the heat of the electronic equipment itself. For this reason, there is a possibility that it will not be applicable to the thermal control of future-type artificial satellites and spacecraft-mounted electronic devices that have high heat generation density and high heat generation heat generating elements.

Furthermore, in the prior art, consideration is given to preventing overheating by dissipating heat generated by electronic devices;
There is no consideration for supercooling. For this reason, if an artificial satellite or spacecraft enters the shadow of a celestial body such as the Earth in February and receives no sunlight while in flight, the environmental temperature of electronic devices may drop rapidly and become overcooled.

Regarding the heating and supercooling described above, there is not only the problem that the temperature must not become too high or too low, but also the problem that the speed of temperature rise and temperature fall must not be too large.

The present invention has been made in view of the above-mentioned circumstances, and is designed to control the environmental temperature of electronic devices with high heat density and large heat output, to maintain the temperature within the permissible temperature range, and to prevent temperature changes over time. The purpose of the present invention is to provide a temperature control mechanism for electronic equipment mounted on artificial satellites and spacecraft that can be kept within an allowable temperature change rate range.

[Means to solve the problem]

In order to achieve the above object, the configuration of the present invention is to consider the electronic equipment to be mounted on an artificial satellite or spacecraft into a compophone unit including electronic parts and a secondary battery, and to include ( A) a heat pipe, (b) a container containing a phase change substance, and (c) an electric heater were installed.

When carrying out the present invention, it is recommended to take into account the allowable temperature range of electronic components constituting the electronic device and configure the phase change material so that the melting point of the phase change material is near the upper limit of the allowable temperature range. Ru.

It is also effective to use a phase change material that has a melting point near the lower limit of the allowable temperature range. Therefore, taking these into consideration, it is desirable to install both a container filled with a phase change substance whose melting point is near the upper limit of the allowable temperature range and a container filled with a phase change substance whose melting point is also near the lower limit. .

Further, it is preferable that electronic components constituting an electronic device are not mounted floating on a circuit board, but are closely attached to the circuit board via a thermal carrier to improve thermal conduction.

In addition, when electronic components are placed in a housing, the housing is made of a good thermal conductor and is fixed in thermal contact with the base member, and the electronic components are placed in a bead 1.
- It is desirable to attach it in close thermal contact with the inner surface of the casing via the pipe and the container.

Although welding means can be used to form the above-mentioned structure for thermally adhering, if welding is not possible, it is convenient to attach using grease with less outgassing in space.

Furthermore, if the electronic components, heat pipe, and phase change material are placed in a container, it is even more convenient to configure them as an integrally connected member, since contact thermal resistance between each component is eliminated.

[Effect]

According to the above configuration, the heat generated in the electronic components is first transferred by the heat pipe.
The temperature distribution is made approximately equal, and the heat flow is conducted at a uniform density, promoting the following effects.

Phase change materials first moderate temperature changes through their own heat capacity.

The temperature rise is moderated and the temperature rises gradually, and when it reaches near the upper limit of the allowable temperature, the above-mentioned phase change material begins to melt and maintains the temperature constant while absorbing the latent heat of fusion.

In addition, if an artificial satellite or spacecraft enters the shadow of a celestial body and no longer receives solar heat, and the load on electronic components decreases and the amount of heat generated decreases, the opposite phenomenon occurs, and the phase change material itself The temperature drop is moderated by the heat capacity of , and when it reaches near the lower limit of the allowable temperature range, the temperature is kept constant while generating latent heat of solidification (corresponding to the latent heat of fusion described above). If this temperature drop prevention effect alone cannot prevent the temperature drop, the temperature can be maintained by energizing the electric heater.

In this case, it is important that heat insulation by an electric heater is used as a supplement.

In other words, when an artificial satellite or spacecraft is in the shadow of a celestial body and its temperature is decreasing, the solar cells installed on this satellite or spacecraft stop functioning, and electrical equipment Power consumption relies exclusively on secondary batteries.

Therefore, it is of great practical significance that the electronic components are kept warm mainly by the latent heat of solidification of the phase change material, and the power consumption of the electric heater is reduced.

〔Example〕

FIG. 1(A) is a sectional view showing one embodiment of the temperature control mechanism according to the present invention. This embodiment is an example in which the present invention is applied to a power amplifier mounted on a communication satellite.

This power amplifier uses the S repeater panel 5 as a base plate, and is installed on this base plate.

Reference numeral 9 denotes a housing made of a good thermal conductor, and its main body 9a is fixed in close contact with the base plate 5. 9b
is the lid.

The electronic component 1, which is a heat generating body, is arranged on an electronic circuit board 7 via a thermal carrier 6 made of a good thermal conductor.

The heat pipe 2 is placed in close contact with the inner surface of the bottom wall of the housing 9.
and a container 4a containing a phase change substance 3a having a melting point near the upper limit of the allowable temperature range of the electronic component 1, and a phase change substance 3b having a melting point near the lower limit of the allowable temperature range of the electronic component 1. The sealed containers 4b are installed in close contact with the inner surface of the bottom wall of the housing 9, respectively.

An electric heater 10 is installed in close contact with the containers 4a and 4b.

The electronic component 1 in this embodiment is a semiconductor component that performs power amplification. The heat generated in the electronic component 1 is transmitted to the heat pipe 2 by conduction via the heat carrier 6 and the electronic circuit board 7, and is diffused in the axial direction of the heat pipe due to the isothermal effect of the heat pipe.

Due to the temperature increase of the entire heat pipe, the container 4a.

4b, and a phase change substance 3a enclosed therein.

Heat is transferred to 3b.

Even at temperatures other than the melting point, these containers and phase change materials have a considerable heat capacity, so electronic components 1
absorbs the heat generated by the system and alleviates the temperature rise.

By relaxing the rate of temperature rise, generation of thermal distortion and thermal stress is prevented.

The temperature of the phase change material 3a gradually rises, and when it is balanced with the amount of heat radiation, the temperature rise stops. However, if the amount of heat dissipated is insufficient and the temperature continues to rise and reaches its melting point, the phase change material 3a begins to melt.

During the melting, the phase change material 3a maintains a substantially constant temperature while absorbing the latent heat of melting.

In the embodiments of the present invention, when the components are brought into close contact with each other, it is necessary not only to bring them into close contact mechanically, but also to bring them into close contact thermally, that is, to bring them into close contact with each other with little heat transfer resistance. Although welding can be used for this purpose, there are many cases where welding is not allowed. In such a case, a grease with little outgassing is sandwiched in space, and an appropriate known means such as screwing is used in combination.

When carrying out the present invention, it is advantageous to construct these components as an integral member, rather than constructing them separately and welding them or bringing them into contact through grease, since there is no contact thermal resistance. It is.

FIG. 1(B) is a sectional view of an embodiment constructed based on this idea. This example has a configuration in which the containers 4a and 4b in the example of FIG. 1(A) are integrally connected to the heat pipe 2.

In addition, if the temperature of the entire device tends to decrease due to a decrease in the amount of heat generated by the electronic components 1 or an increase in the amount of heat radiated from the base plate 5, which is a repeater panel, to outer space, the containers 4a, 4b
, and the heat capacity of the phase change materials 3a and 3b, the temperature drop rate is moderated.

When the temperature gradually decreases in this manner and reaches near the lower limit of the allowable temperature range, the phase change material 3b begins to solidify and maintains a substantially constant temperature while generating latent heat of solidification.

When the latent heat of solidification is not sufficient to prevent the temperature from dropping, power is supplied from a secondary battery (not shown) to the electric heater 10 to assist in keeping it warm.

Heat pipe 2, containers 4a, 4b shown in FIG. 1(A)
FIG. 2 shows an exploded perspective view of the electric heater 10.

FIG. 3 shows an embodiment different from the above, and is a perspective view corresponding to FIG. 2 of the embodiment.

In the example (FIG. 2), there are two containers 4a.

4b, one heat pipe 2 was sandwiched between the heat pipes 2 and 4b, but in this example (Fig. 3), three containers 4 and two heat pipes 2 were arranged, one each. They are arranged alternately. The melting points of the phase change substances sealed in these three containers 4 can be arbitrarily selected.

Moreover, the number of these components installed can be set arbitrarily, such as arranging three heat pipes 2 and two containers 4 alternately. In this case, if emphasis is placed on uniformity of temperature distribution (and therefore uniformity of heat flow density), the number of installed heat pipes 2 may be increased, and when emphasis is placed on suppression of temperature changes, the number of installed containers 4 may be increased.

In either case, the heat pipe 2 and the container 4 are brought into close thermal contact. In the embodiments shown in FIGS. 2 and 3, they were pressed against each other through a layer of grease with little outgassing in space, and were fastened with screws (screws not shown) to thermally adhere to each other.

When the temperature control mechanisms shown in these embodiments (Figs. 1 to 3) are applied to electronic equipment for artificial satellites and spacecraft, the electronic components constituting the electronic equipment have a high heat generation density. ,
Even if the change in the amount of heat generated is large, the rate of change in the environmental temperature of the electronic component can be suppressed and the environmental temperature can be maintained within an allowable range.

In addition, an artificial satellite or spacecraft equipped with electronic equipment equipped with the temperature control mechanism of these embodiments can be used even if the amount of heat radiated from this artificial satellite or spacecraft to outer space changes significantly. It is possible to easily control the temperature of the mounted electronic device while saving power consumption of the secondary battery, keeping the electronic device within the permissible temperature range, and suppressing the rate of temperature change.

〔Effect of the invention〕

As explained above, when the temperature control mechanism of the present invention is applied, it is possible to control the environmental temperature of electronic equipment mounted on artificial satellites and space equipment to keep it within the permissible temperature range, and to suppress the rate of temperature change. I can do it.

[Brief explanation of drawings]

FIG. 11(A) is a sectional view showing one embodiment of the temperature control mechanism according to the present invention, and FIG. 1(B) is a sectional view of an embodiment different from the above. FIG. 2 is an exploded perspective view depicting the main parts of the embodiment shown in FIG. 1(A). FIG. 3 is a perspective view depicting the main parts of an embodiment different from the above. FIG. 4 is an explanatory diagram of the prior art. 1... Electronic component, '2... Heat pipe, 3a, 3b... Phase change material, 4, '4a, 4b... Container, 5... Base plate,
6... Heat carrier, 7... Electronic circuit board,
9... Housing, 9a... Main body of the housing,
9b...Lid of the housing, 10...Electric heater.

Claims (1)

[Claims] 1. In a mechanism for controlling the temperature of electronic equipment mounted on an artificial satellite or spacecraft, a container in which a heat pipe and a phase change substance are sealed in a component unit including an electronic component and a secondary battery. A temperature control mechanism for electronic equipment mounted on an artificial satellite or spacecraft, characterized by comprising: and an electric heater. 2. The above phase change material is characterized in that it has a melting point near the upper limit of the temperature range within which the environmental temperature of the electronic component is permissible. A temperature control mechanism for an electronic device mounted on an artificial satellite or spacecraft according to claim 1. 3. The electronic device for use in an artificial satellite or spacecraft according to claim 1, wherein the phase change material has a melting point near the lower limit of a temperature range within which the environmental temperature of the electronic component is permissible. Equipment temperature control mechanism. 4. The phase change material has a melting point near the upper limit of the temperature range allowable for the environmental temperature of the electronic component;
Claim 1, characterized in that the electronic component comprises at least two types of phase change substances, a phase change substance having a melting point near the lower limit of a temperature range within which the environmental temperature of the electronic component is permissible, and each of the phase change substances is sealed in a container. Temperature control mechanism for electronic equipment mounted on artificial satellites and spacecraft described in . 5. The electronic component described above is mounted on an electronic circuit component via a heat carrier made of a good thermal conductor, and the electronic component circuit is in close contact with a heat pipe and a container containing a phase change material. A temperature control mechanism for an electronic device mounted on an artificial satellite or spacecraft according to claim 1. 6. The electronic component is housed in a casing made of a good thermal conductor, and the electronic component is tightly attached to the casing via a heat pipe and a container containing a phase change material. Claim 1, characterized in that the housing is at least supported, and the housing is attached in close contact with a base member of an artificial satellite/space device.
Temperature control mechanism for electronic equipment mounted on artificial satellites and spacecraft described in . 7. The heat pipe and the container enclosing the phase change substance are each attached to the electronic component circuit by sandwiching grease with little outgassing in space. Temperature control mechanism for electronic equipment mounted on artificial satellites and spacecraft. 8. The heat pipe and the container enclosing the phase change substance are continuous integral members,
A temperature control mechanism for an electronic device mounted on an artificial satellite or spacecraft according to claim 5. 9. The artificial satellite according to claim 3, wherein the electric heater is energized when the phase change material starts solidifying or completes solidifying.
Temperature control mechanism for spacecraft electronic equipment. 10. An electronic device mounted on an artificial satellite or spacecraft, comprising the temperature control mechanism for the electronic device mounted on an artificial satellite or spacecraft according to claim 1. 11. An artificial satellite or spacecraft, characterized in that it is equipped with an electronic device equipped with a temperature control mechanism for the electronic device mounted on an artificial satellite or spacecraft according to claim 1.