JPH0415896U - - Google Patents
Info
- Publication number
- JPH0415896U JPH0415896U JP5781690U JP5781690U JPH0415896U JP H0415896 U JPH0415896 U JP H0415896U JP 5781690 U JP5781690 U JP 5781690U JP 5781690 U JP5781690 U JP 5781690U JP H0415896 U JPH0415896 U JP H0415896U
- Authority
- JP
- Japan
- Prior art keywords
- ground
- circuit board
- piece
- case body
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5781690U JPH0415896U (it) | 1990-05-31 | 1990-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5781690U JPH0415896U (it) | 1990-05-31 | 1990-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415896U true JPH0415896U (it) | 1992-02-07 |
Family
ID=31582868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5781690U Pending JPH0415896U (it) | 1990-05-31 | 1990-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415896U (it) |
-
1990
- 1990-05-31 JP JP5781690U patent/JPH0415896U/ja active Pending