JPH04155896A - Electronic device cooling structure - Google Patents

Abstract

PURPOSE:To obtain an electronic device cooling structure which is prevented from sucking exhaust of high temperature again so as to efficiently cool an electronic equipment unit inside a case with cooling air by a method wherein a panel cavity is made to serve as an air flow path which enables the second vent holes of an inner wall and an end wall to communicate with each other. CONSTITUTION:When a front door 4 is closed and a forced exhaust fan 14 provided to an exhaust chamber 13 is driven, outside air is sucked in through intake vents 10 corresponding to electronic equipment units 3 housed in a case 1 from the front door 4 to cool down the electronic equipment units 3, air after cooling is made to flow into an exhaust chamber 13 passing through an airflow path 12 provided to the cavity of a panel via exhaust vents 11 correspondent to empty spaces 2 of the electronic equipment units 3 and exhausted toward the underside of the case 1 through an exhaust section 15. As mentioned above, the exhaust section 15 is provided distant from the intake vents 10, so that exhaust of high temperature discharged outside from the case 1 is prevented from being sucked again in the case 1. As a result the electronic equipment units 3 provided inside the case 1 can be efficiently cooled down by cooling air.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling structure for various electronic devices that cools an electronic device unit built into a housing by drawing in outside air.

Various electronic devices to which the present invention is applied include communication devices, information processing devices, control devices, measurement devices, etc., and include a single electronic device unit or a mixture of many electronic device units of the same type or different types. It is built-in.

[Prior Art] Generally, highly integrated, high-density, and miniaturized electronic devices are configured by housing a plurality of electronic device units in a housing. Some of these electronic equipment units generate a high amount of heat, and some are sensitive to heat.
Many electronic devices are equipped with ventilation cooling means that sucks outside air into the housing, circulates the air inside the housing, and exhausts the air.

Conventional cooling means of this type have the intake port for outside air located at the bottom of the case and the exhaust port located at the bottom of the case in order to prevent the high-temperature air exhausted outside the case from being re-inhaled directly from the intake port. Some have an intake port on the top surface, and others have an intake port on one side and an exhaust port on the other side.Furthermore, due to constraints on the arrangement of multiple housings in parallel or stacked, there are There is also known a device in which an intake port and an exhaust port are provided (see Japanese Patent Laid-Open No. 117894/1989).

[Problems to be Solved by the Invention] In the device described in the above-mentioned Japanese Patent Laid-Open No. 117894/1989, air intake and exhaust are performed on the same surface of the housing, so it is difficult to arrange multiple housings. This is advantageous, but in the case of small devices, the intake and exhaust ports are close together and open all over, so there is a phenomenon that the high temperature air exhausted from the housing is re-inhaled from the intake port. Therefore, there is a possibility that the ventilation cooling effect of the electronic equipment unit inside the housing may be impaired.

Therefore, in view of the problems of the conventional ones, the present invention has been made to
Even if air is taken in and exhausted from one side surrounding the housing that houses the electronic equipment unit, the panel that makes up that side has a hollow double-wall structure, and the hollow part is used as the ventilation path, making it possible to In contrast, the exhaust position can be installed at a distance, thereby preventing high-temperature exhaust gas discharged to the outside from being re-inhaled directly from the intake area, and efficiently cooling the electronic equipment unit inside the case. The object of the present invention is to provide a cooling structure for an electronic device that can perform the following steps.

[Means for Solving the Problems] The present invention is configured as follows as a technical means for achieving the above object. In other words, the first method is to construct one side surrounding the electronic device unit built into the housing by a panel whose inner wall, outer wall, and peripheral end wall are integrally blow-molded from the same thermoplastic resin, and where the inner wall and outer wall are made of the same panel. A hollow double-walled structure is formed in which a hollow part is formed inside by separating the panels from each other, and the opposing wall surfaces of the panels are brought close to each other and the periphery is welded to each other to form a first ventilation hole that communicates with the inside and outside. A cooling structure for an electronic device, characterized in that each of the end walls is provided with a second vent, and the hollow part of the panel is used as a ventilation path that communicates the inner wall with the second vent in the end wall, Part 2 consists of a panel that surrounds the electronic device unit built into the housing by integrally blow-molding the inner wall, outer wall, and peripheral end wall using the same thermoplastic resin, and the panel is made up of a panel that is made of the same thermoplastic resin and has an inner wall and an outer wall that are separate from each other. As a hollow double-walled structure in which a hollow space is formed inside the panel, a first vent hole and a second vent hole are formed in the inner wall of the panel, respectively, opening only inwardly, and each opening outwardly. forming a first opening and a second opening, and a first ventilation passage leading from the first opening to the first ventilation hole and a second ventilation path from the second ventilation opening to the hollow part of the panel; This cooling structure for an electronic device is characterized in that a second ventilation path communicating with the opening is formed.

[Function] According to the configuration 1 of the present invention, the first vent hole and the second vent hole are provided on one side of the casing for ventilating the electronic device unit built into the casing. , intake and exhaust are performed on one side of the housing.

The one-sided panel in which the first vent hole and the second vent hole are formed has a hollow double wall structure, and a vent passage communicating with the second vent hole is formed in the hollow part. Intake air through a first vent and exhaust air through a second vent, or
In both cases where air is taken in through the second vent and exhausted through the first passageway, the intake and exhaust parts can be separated, allowing the high temperature exhaust to be discharged from the inside of the housing to the outside. There is no phenomenon of being inhaled into the housing,
The electronic equipment unit inside the housing is efficiently ventilated and cooled.

Further, according to the second configuration of the present invention, the first vent and the second vent can be provided on the inner surface of one side of the housing, and the first opening leading to the first vent can be provided. and a second opening that passes through the second vent can be provided separately from each other, thereby more reliably preventing the phenomenon that high-temperature exhaust discharged from the inside of the housing to the outside is sucked into the housing as it is. I can do it.

[Embodiment] Regarding the embodiment of the present invention, the first vent port is the intake port, the second vent port is the
A description will be given with reference to drawings showing an example of a configuration in which the ventilation port is an exhaust port.

In FIGS. 1 to 3, l is a housing of an electronic device, and inside this housing l, built-in parts 2 of three stages of upper and lower electronic equipment units are formed, and each built-in part 2 has an electronic device unit. An equipment unit 3 is built-in. Each electronic device unit 3 is configured such that circuit boards constituting it are arranged upright at intervals in the left and right direction, and have a ventilation path in the front and back direction, and an inner surface between the electronic device unit 3 and the housing 1. There is also a ventilation path between them.

The front door 4 of the casing 1 is provided with a hinge 5 so as to be openable and closable, and the front door 4 is constructed of a panel made of an inner wall 6, an outer wall 7, and a peripheral end wall 8 that are integrally blow-molded from the same thermoplastic resin. and the inner wall of the panel 6
It has a hollow double wall structure in which a hollow part 9 is formed inside the panel by separating the panel and the outer wall 7 independently. In the panel constituting the front door 4, an intake port IO is formed, corresponding to the built-in part 2 of each electronic device unit, by making the inner and outer wall surfaces 6, 7 close to each other and welding the peripheries to each other and communicating between the inside and outside. In addition, exhaust ports 11 are provided in the inner wall 6 at a portion corresponding to the built-in portion 2 of each electronic device unit and in the lower end wall, and each exhaust port 11 is connected to the hollow portion 9 of the panel. A ventilation passage 12 is formed therethrough. At the lower end of the housing l,
An exhaust chamber 13 is formed, and this exhaust chamber! An exhaust section 15 equipped with a forced exhaust fan 14 is configured on the lower surface of the exhaust chamber 3, and the front opening of the exhaust chamber 13 communicates with the exhaust port 11 at the lower end of the exhaust chamber 13 when the front door 4 is closed. ing. A louver 16 is fitted in each intake port lO that communicates with the inside and outside.

Note that the number of intake ports 10 provided on the front surface 114 and the number of exhaust ports 11 provided on the inner wall of the front surface 114 is not plural, but only one each may be formed.
1 may be formed not on the front door 4 of the housing l, but on the side, top, back, bottom, etc. corresponding to the built-in part 2 of the electronic device unit. In addition, the exhaust chamber 13 can be cooled by natural ventilation without having to be equipped with a forced exhaust system (7).Furthermore, in order to enhance the ventilation cooling effect, cooling can be performed using a heat pump method or by evaporation of liquid. It is also possible to provide means.

The blow-molded panel constituting the front door 4 is AB
Blow-moldable thermoplastic resins such as S resin, modified polyphenylene oxide resin, polycarbonate resin, polyamide resin, and polypropylene resin are extruded in a plasticized state into a pipe or sheet shape and expanded in a split-type blow molding mold. By molding it into the shape of the mold cavity, a hollow double wall structure is formed in which the inner wall 6, the outer wall 7, and the peripheral end wall 8 are integrated as described above, and the air intake port 10 and the exhaust port 11 is formed by any suitable means such as cutting out part of its wall.

In the structure configured as described above, if the front door 4 is closed and the forced exhaust fan 14 of the exhaust chamber 13 is driven, the electronic equipment unit 3 built in the housing 1 can be accessed from the front surface 314. Outside air is taken in through each intake port 10, and each electronic device unit 3 is ventilated and cooled. After cooling, the exhaust gas flows into the exhaust chamber 13 with each electron, and flows from the exhaust part 15 toward the bottom surface of the housing 1. be discharged. In this way, since the exhaust part 15 is separated from each intake port 10 by a large distance, there is no possibility that the high-temperature exhaust gas discharged from the inside of the housing l is re-inhaled into the housing l. , the electronic device unit 3 inside the housing 1 can be efficiently cooled by ventilation.

Figure 4 and! FIG. 5 shows another embodiment of the above embodiment. Note that the configurations indicated by the same reference numerals are the same as the former one.

In this other embodiment, each intake port 10' is formed on the inner wall 6 of the panel constituting the front door 4, corresponding to the built-in part 2 of each electronic device unit, and on both sides of each intake port lO''. An exhaust port 11' is formed.

In the hollow part 9 of the panel, a welding rib 17 is formed integrally from the inner wall 6 side to the outer wall 7 side during blow molding, and each intake port 10' is a first opening at the upper end surface of the panel.
An intake passage 19 is formed as a first ventilation passage for communicating with the intake part 18, which is an opening of the air outlet. An exhaust passage 20, which is a second ventilation passage, is formed into sections.

In this embodiment, the intake air to the casing 1 is sucked through the intake part 18 formed on the upper end surface of the front door 3, and the exhaust gas that has circulated inside the casing 1 is discharged from the bottom surface of the casing 1. By separating the intake and exhaust areas widely, it is possible to more reliably prevent the phenomenon that high-temperature exhaust gas is re-inhaled as intake air, and the ventilation cooling effect within the housing 1 can be further improved.

[Effects of the Invention] Since the present invention is configured as in Parts 1 and 2 above, it provides the following effects.

Even if air intake and exhaust are performed on one side surrounding the housing containing the electronic device unit, the panel that makes up that side has a hollow double wall structure, and the hollow part is used as a ventilation path for exhaust or intake. As a result, the exhaust part can be placed apart from the intake part, which prevents high-temperature exhaust gas exhausted to the outside from being re-inhaled directly from the intake part, and prevents the electronic equipment unit inside the housing from being re-inhaled. can be efficiently cooled by ventilation.

In particular, according to the second configuration, the intake and exhaust positions are separated by a large distance, and a more significant effect can be achieved than the first configuration.

[Brief explanation of the drawing]

1 to 3 show an embodiment of the present invention, in which FIG. 1 is an overall perspective view of an electronic device, FIG. 2 is an overall perspective view of the electronic device with the front door of the casing opened, and FIG. A- in Figure 1
It is an A-line sectional view. 4 and 5 show other embodiments of the present invention, and FIG.
The figure is an overall perspective view of the electronic device housing with the front door open, and Figure 5 is B-B in Figure 4 with the front door closed.
FIG. l... Housing of electronic device, 2... 1M part of electronic device unit, 3... Electronic W unit, 4... Front door, 6... Inner wall, 7... Outer wall, 8 ...Peripheral wall, 9.
...Hollow part, lO...Intake port, 11...Exhaust port, 1
2... Ventilation path, 13... Exhaust chamber, 14... Forced exhaust fan, 15... Exhaust section, 10'... Intake port, I
I'...Exhaust port, 17...Welding rib, 18...Intake part, 19...Intake passage, 20...Exhaust passage

Claims (2)

[Claims] (1) One side surrounding the electronic device unit built into the housing,
A hollow double-walled structure consisting of a panel whose inner wall, outer wall, and peripheral end wall are integrally blow-molded from the same thermoplastic resin, and where the inner wall and outer wall are separated independently and a hollow part is formed inside. , the opposing wall surfaces of the panel are brought close together and the peripheries are welded to each other to form a first vent leading to the inside and outside, and second vents are provided in the inner wall and the end wall, respectively, to open the hollow part of the panel. A cooling structure for an electronic device, characterized in that the inner wall and the second vent hole in the end wall are formed into a ventilation path that communicates with each other. (2) One side surrounding the electronic device unit built into the housing,
A hollow double-walled structure consisting of a panel whose inner wall, outer wall, and peripheral end wall are integrally blow-molded from the same thermoplastic resin, and where the inner wall and outer wall are separated independently and a hollow part is formed inside. , a first vent hole and a second vent hole each opening only inwardly are formed in the inner wall of the panel, and a first opening portion and a second opening portion respectively opening outwardly are formed, and the panel The above-mentioned first
1. A cooling structure for an electronic device, characterized in that a first air passage leading from an opening to a first air vent and a second air passage leading from a second air opening to a second opening are formed.