JPH0415243U - - Google Patents
Info
- Publication number
- JPH0415243U JPH0415243U JP5635990U JP5635990U JPH0415243U JP H0415243 U JPH0415243 U JP H0415243U JP 5635990 U JP5635990 U JP 5635990U JP 5635990 U JP5635990 U JP 5635990U JP H0415243 U JPH0415243 U JP H0415243U
- Authority
- JP
- Japan
- Prior art keywords
- hollow package
- lid
- joint surface
- electronic component
- component device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5635990U JPH0415243U (fr) | 1990-05-28 | 1990-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5635990U JPH0415243U (fr) | 1990-05-28 | 1990-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415243U true JPH0415243U (fr) | 1992-02-06 |
Family
ID=31580115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5635990U Pending JPH0415243U (fr) | 1990-05-28 | 1990-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415243U (fr) |
-
1990
- 1990-05-28 JP JP5635990U patent/JPH0415243U/ja active Pending