JPH0415242U - - Google Patents

Info

Publication number

JPH0415242U

JPH0415242U JP5507790U JP5507790U JPH0415242U JP H0415242 U JPH0415242 U JP H0415242U JP 5507790 U JP5507790 U JP 5507790U JP 5507790 U JP5507790 U JP 5507790U JP H0415242 U JPH0415242 U JP H0415242U

Authority

JP

Japan

Prior art keywords

resin material

insulating resin

frame

semiconductor chip

substrate

Prior art date

1990-05-25

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
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• 239000004065 semiconductor Substances 0.000 claims description 10
• 239000000463 material Substances 0.000 claims description 9
• 239000011347 resin Substances 0.000 claims description 8
• 229920005989 resin Polymers 0.000 claims description 8
• 239000000758 substrate Substances 0.000 claims description 3
• 238000010521 absorption reaction Methods 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1