JPH0415230U - - Google Patents
Info
- Publication number
- JPH0415230U JPH0415230U JP5480890U JP5480890U JPH0415230U JP H0415230 U JPH0415230 U JP H0415230U JP 5480890 U JP5480890 U JP 5480890U JP 5480890 U JP5480890 U JP 5480890U JP H0415230 U JPH0415230 U JP H0415230U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- electrode
- holder
- claw
- claws
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Description
第１図ａは本考案の実施例のウエーハのチヤツ
キング機構を適用したウエーハ処理装置の概要説
明図、第１図ｂは第１図ａのＡ−Ａ断面図、第２
図ａ乃至第２図ｃは本考案の実施例のウエーハの
チヤツキング機構の要部作動説明図、第３図は本
考案のウエーハのチヤツキング機構の別の実施態
様の説明上面図、第４図乃至第６図は従来のメカ
ニカルチヤツキング機構を採用したウエーハ処理
装置の概要説明図、第７図ａおよび第７図ｂは従
来のメカニカルチヤツキング機構の要部作動説明
図である。
１……処理室、２……電極、３……ウエーハ押
え、４……脚、５……支持リング、６……押え爪
、７……ウエーハ受け爪、８……支持板、９……
シリンダ、１０……溝。
FIG. 1a is a schematic explanatory diagram of a wafer processing apparatus to which a wafer chucking mechanism according to an embodiment of the present invention is applied, FIG. 1b is a sectional view taken along line A-A in FIG.
Figures a to 2c are explanatory views of the main parts of the wafer chucking mechanism according to the embodiment of the present invention, Figure 3 is an explanatory top view of another embodiment of the wafer chucking mechanism of the present invention, and Figures 4 to 2c are FIG. 6 is a schematic explanatory diagram of a wafer processing apparatus employing a conventional mechanical chucking mechanism, and FIGS. 7a and 7b are diagrams illustrating the operation of essential parts of the conventional mechanical chucking mechanism. DESCRIPTION OF SYMBOLS 1...Processing chamber, 2...Electrode, 3...Wafer holder, 4...Legs, 5...Support ring, 6...Press claw, 7...Wafer receiving claw, 8...Support plate, 9...
Cylinder, 10...groove.
Claims (1)
れた爪部と電極側方に配された脚部とからなるウ
エーハ押えとを備えてなり、ウエーハ押えを上下
動させることで、該ウエーハ押えの爪部で電極上
に載置されたウエーハを該電極上面に押し付けて
拘持するウエーハのチヤツキング機構において、
前記ウエーハ押えの爪部下方の脚部に、電極方向
に突出し、その上部にウエーハを保持可能な少な
くとも三つのウエーハ受け爪を突設する一方、前
記電極のウエーハ受け爪の突設位置に対応する側
面に、ウエーハ受け爪と係合する溝を設けてなる
ことを特徴とするウエーハのチヤツキング機構。 It is equipped with an electrode on which a wafer is placed, and a wafer holder consisting of a claw part arranged above the electrode and a leg part arranged on the side of the electrode.By moving the wafer holder up and down, the wafer holder can be In a wafer chuck mechanism that presses and holds a wafer placed on an electrode against the upper surface of the electrode with a claw portion of the wafer,
At least three wafer receiving claws that protrude toward the electrode and can hold a wafer are provided on the leg portions below the claws of the wafer holder, while corresponding to the protruding positions of the wafer receiving claws of the electrode. A wafer chucking mechanism characterized by having a groove on a side surface that engages with a wafer receiving claw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5480890U JPH0415230U (en) | 1990-05-25 | 1990-05-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5480890U JPH0415230U (en) | 1990-05-25 | 1990-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415230U true JPH0415230U (en) | 1992-02-06 |
Family
ID=31577202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5480890U Pending JPH0415230U (en) | 1990-05-25 | 1990-05-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415230U (en) |
-
1990
- 1990-05-25 JP JP5480890U patent/JPH0415230U/ja active Pending