JPH04151812A - Resin molding method - Google Patents
Resin molding methodInfo
- Publication number
- JPH04151812A JPH04151812A JP27731490A JP27731490A JPH04151812A JP H04151812 A JPH04151812 A JP H04151812A JP 27731490 A JP27731490 A JP 27731490A JP 27731490 A JP27731490 A JP 27731490A JP H04151812 A JPH04151812 A JP H04151812A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- temperature
- mold
- heating furnace
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 65
- 239000011347 resin Substances 0.000 title claims abstract description 65
- 238000000465 moulding Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 41
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 238000001723 curing Methods 0.000 description 25
- 238000001514 detection method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Insulating Of Coils (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の目的コ
(産業上の利用分野)
本発明は被モールド物を熱硬化性の樹脂によりモールド
する樹脂モールド方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention (Field of Industrial Application) The present invention relates to a resin molding method for molding a molded object with a thermosetting resin.
(従来の技術)
被モールド物例えばコイルを樹脂によりモールドするモ
ールドコイルを製造する場合、モールド樹脂としては一
般にエポキシ樹脂に代表される熱硬化性の樹脂が用いら
れる。(Prior Art) When manufacturing a molded coil in which a molded object, such as a coil, is molded with a resin, a thermosetting resin such as an epoxy resin is generally used as the molding resin.
このような熱硬化性の樹脂を用いてモールドコイルを製
造する場合、一般には次のようにして行われる。まず、
被モールド物であるコイルを成形型内に収納し、この成
形型を加熱炉内に収納する。When manufacturing a molded coil using such a thermosetting resin, it is generally performed as follows. first,
A coil to be molded is placed in a mold, and this mold is placed in a heating furnace.
そして、成形型内に熱硬化性の樹脂を注入し、その成形
型を加熱炉内のヒータにより加熱することによってモー
ルド樹脂を加熱硬化させる。このとき、モールド樹脂の
加熱硬化は、−次硬化(セミキュア)と二次硬化(アフ
ターキュア)とに分けて行われる。−次硬化は成形型を
組み付けた状態で行われ、二次硬化は成形型を取り外し
た状態(離型した状態)で行われる。Then, a thermosetting resin is injected into the mold, and the mold is heated by a heater in a heating furnace to heat and harden the mold resin. At this time, the heat curing of the mold resin is performed separately into secondary curing (semi-curing) and secondary curing (after-curing). - Secondary curing is performed with the mold assembled, and secondary curing is performed with the mold removed (released).
(発明が解決しようとする課B)
ところで、上記したような方法でモールドコイルを製造
する場合、どの時点で離型を行うか、即ち離型するタイ
ミングの設定は極めて重要である。仮に、離型のタイミ
ングが早すぎる場合には、樹脂の硬化か不十分で成形物
か変形したり、強度や接着力不足により内部で剥離や割
れ等が生じる虞かあり、逆に離型のタイミングが遅すぎ
る場合こは、加熱のためのエネルギーが無駄となるばか
りでなく、成形物における樹脂中に残留応力が残り、耐
クラツク性を低下させる虞がある。(Problem B to be Solved by the Invention) By the way, when manufacturing a molded coil using the method described above, it is extremely important to determine when to release the mold, that is, to set the timing for releasing the mold. If the timing of mold release is too early, there is a risk that the molded product may be deformed due to insufficient curing of the resin, or internal peeling or cracking may occur due to insufficient strength or adhesive strength. If the timing is too late, not only will energy for heating be wasted, but residual stress will remain in the resin of the molded product, which may reduce crack resistance.
従来、離型するタイミングは、一般には樹脂の特性、成
形物の大きさや重量等を考慮して予め設定された時間管
理で行われていた。しかしながら、多種多様な製品の成
形を行う場合、被モールド物の種類や大きさ、形状、ま
た、モールド樹脂の種類や厚さ等によって熱容量や放熱
特性、硬化発熱1等が変化するため、現実的には各製品
に最適なタイミングの設定を行うことはできないもので
あった。従って、従来の方法においては、離型するタイ
ミングが必ずしも最適とはいえず、少なからず上述した
ような問題点があった。Conventionally, the timing of mold release has generally been controlled by a preset time that takes into consideration the characteristics of the resin, the size and weight of the molded product, and the like. However, when molding a wide variety of products, the heat capacity, heat dissipation characteristics, curing heat generation 1, etc. change depending on the type, size, and shape of the molded object, as well as the type and thickness of the molding resin. However, it was not possible to set the optimal timing for each product. Therefore, in the conventional method, the timing of mold release is not necessarily optimal, and there are many problems as described above.
そこで、本発明の目的は、離型するタイミングを最適に
設定できて、品質の良い成形物を効率良く製造すること
ができる樹脂モールド方法を提供するにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a resin molding method that can optimally set the timing of mold release and efficiently produce molded products of good quality.
[発明の構成コ
(課題を解決するための手段)
本発明は成形型内に被モールド物を収納すると共に熱硬
化性の樹脂を注入し、その樹脂を加熱手段により加熱し
て硬化させることによって前記被モールド物をモールド
する方法において、前記樹脂の加熱硬化時にモールド樹
脂の温度及び前記加熱手段による加熱温度を測定し、そ
れらの温度変化に括づいて前記樹脂の硬化状態を判定す
るようにしたところに特徴を有する。[Structure of the Invention (Means for Solving the Problems)] The present invention accommodates a molded object in a mold, injects a thermosetting resin, and heats and hardens the resin with a heating means. In the method of molding the object to be molded, the temperature of the molding resin and the heating temperature by the heating means are measured when the resin is heated and cured, and the cured state of the resin is determined based on the temperature change. It has some characteristics.
(作用)
樹脂の加熱硬化時において、その樹脂の温度は、硬化反
応の開始に伴う反応熱により加熱手段による加熱温度よ
りも高くなってゆき、反応のピーク付近で最も高い値と
なり、この後、次第に下降して加熱手段による加熱温度
と等しくなる傾向がある。従って、このときの樹脂の温
度と加熱手段による加熱温度とを測定し、それらの温度
差を比較することに基づき、樹脂の硬化状態の完了を判
定でき、即ち離型する最適のタイミングを設定すること
ができる。(Function) When the resin is heated and cured, the temperature of the resin becomes higher than the heating temperature by the heating means due to the reaction heat accompanying the start of the curing reaction, reaches the highest value near the peak of the reaction, and then, There is a tendency for the temperature to gradually decrease and become equal to the heating temperature by the heating means. Therefore, by measuring the temperature of the resin at this time and the heating temperature by the heating means and comparing the temperature difference between them, it is possible to determine whether the resin has completely cured, that is, to set the optimal timing for releasing from the mold. be able to.
(実施例)
以下、本発明をモールドコイルの製造方法に適用した第
1実施例について第1図及び第2図を参照して説明する
。(Example) Hereinafter, a first example in which the present invention is applied to a method for manufacturing a molded coil will be described with reference to FIGS. 1 and 2.
まず第1図は、成形型1内に、被モールド物だるコイル
2を収納すると共にエポキシ樹脂等の熱硬化性の樹脂3
を注入した状態が示されている。First of all, FIG. 1 shows a mold 1 in which a dull coil 2 to be molded is housed and a thermosetting resin 3 such as an epoxy resin.
The injection state is shown.
成形型]は加熱炉4内に出入れ可能に収納され、この加
熱炉4内は加熱手段たるヒータ5により加熱されるよう
になっている。成形型1の外面には温度センサ6が密着
して取り付けられ、また、加熱炉4内にも温度センサ7
が取り付けられており、これら両温度センサ6.7はマ
イクロコンピュータを備えた制御装置8に接続されてい
る。制御装置8は、電源9を介して上記ヒータ5を制御
することによって加熱炉4内の温度制御を行うと共に、
両温度センサ6.7からの検出信号に基づいて後述する
ように樹脂3の硬化状態を判定する機能を有しており、
樹脂3の一次硬化が完了したと判定した場合に表示ラン
プ]0を点灯させるようになっている。The mold] is housed in a heating furnace 4 so as to be removable therein, and the inside of this heating furnace 4 is heated by a heater 5 serving as a heating means. A temperature sensor 6 is closely attached to the outer surface of the mold 1, and a temperature sensor 7 is also installed inside the heating furnace 4.
are installed, and both temperature sensors 6.7 are connected to a control device 8 comprising a microcomputer. The control device 8 controls the temperature inside the heating furnace 4 by controlling the heater 5 via the power source 9, and
It has a function of determining the hardening state of the resin 3 based on the detection signals from both temperature sensors 6 and 7, as described later.
When it is determined that the primary curing of the resin 3 has been completed, the display lamp ]0 is turned on.
而して、上記構成においてモールドコイルを製造する場
合には、まずコイル2を収納した成形型1を加熱炉4内
に収納し、この状態で成形型1内に樹脂3を注入する。When manufacturing a molded coil with the above configuration, the mold 1 containing the coil 2 is first placed in the heating furnace 4, and the resin 3 is injected into the mold 1 in this state.
そして、樹脂3を硬化させるために、ヒータ5により加
熱炉4内を加熱することによって成形型]内の樹脂3を
加熱する。このとき、温度センサ6により成形型]を介
して樹脂3の温度t1が検出されると共に、温度センサ
7により加熱炉4内の温度t2が検出される。加熱炉4
内の温度は、樹脂3を硬化させるのに必要な硬化温度t
sとなるように制御される。Then, in order to harden the resin 3, the heater 5 heats the inside of the heating furnace 4, thereby heating the resin 3 inside the mold. At this time, the temperature t1 of the resin 3 is detected by the temperature sensor 6 via the mold, and the temperature t2 inside the heating furnace 4 is detected by the temperature sensor 7. Heating furnace 4
The temperature within is the curing temperature t necessary to cure the resin 3.
s.
この場合、樹脂3の加熱硬化時における樹脂3の温度t
1及び加熱炉4内の温度t2は第2図に示すように変化
する。即ち、まず加熱炉4内の温度t2か硬化温度ts
に達し、しばらくして樹脂3の温度t1が加熱炉4内の
温度t2と略等しくなり(tl =t2 )、従って樹
脂3の温度t1も硬化温度tsに達するようになる。こ
の状態がしばらく保たれた後、樹脂3の硬化反応に伴う
発熱により樹脂3の温度t1は加熱炉4内の温度t2よ
りも次第に高くなる(1+ >12)。ここで、樹脂3
の温度t、と加熱炉4内の温度t2との差をΔtとする
と、このΔtは、樹脂3の硬化反応の進行に伴って大き
くなり、そして反応のピーク付近で最大となり、その後
次第に小さくなり、やがて0に近づく。樹脂3の一次硬
化の完了は硬化反応に伴う発熱が終了した時点であるか
ら、発熱がなくなったこと(Δt=0)をもって−次硬
化が完了したと判定することができる。従ってこの場合
、制御装置8により、上記Δtの変化に基づいて樹脂3
の一次硬化の完了時点を判定し、−次硬化の完了時点て
表示ランプ10を点灯する。作業者はその表示ランプ1
0が点灯されることにより樹脂3の一次硬化が完了した
ことを知ることができるから、その表示ランプ10の点
灯に基づき成形型1を取り外す離型を行い、この後樹脂
3の二次硬化を行う。これによって、離型のタイミング
を最適な状態で行うことができ、品質の良い成形物を効
率良く製造することができる。In this case, the temperature t of the resin 3 during heat curing of the resin 3
1 and the temperature t2 in the heating furnace 4 change as shown in FIG. That is, first, the temperature t2 in the heating furnace 4 or the curing temperature ts
After a while, the temperature t1 of the resin 3 becomes approximately equal to the temperature t2 in the heating furnace 4 (tl = t2), and therefore the temperature t1 of the resin 3 also reaches the curing temperature ts. After this state is maintained for a while, the temperature t1 of the resin 3 gradually becomes higher than the temperature t2 in the heating furnace 4 (1+>12) due to the heat generated by the curing reaction of the resin 3. Here, resin 3
If the difference between the temperature t in the heating furnace 4 and the temperature t2 in the heating furnace 4 is Δt, this Δt increases as the curing reaction of the resin 3 progresses, reaches a maximum near the peak of the reaction, and then gradually decreases. , eventually approaches 0. Since the primary curing of the resin 3 is completed when the heat generation associated with the curing reaction ends, it can be determined that the secondary curing is completed when the heat generation ceases (Δt=0). Therefore, in this case, the control device 8 controls the resin 3 based on the change in Δt.
It is determined when the primary curing is completed, and the indicator lamp 10 is turned on when the secondary curing is completed. The worker turns on the indicator lamp 1.
0 is lit, it can be known that the primary curing of the resin 3 has been completed. Based on the lighting of the indicator lamp 10, the mold 1 is removed and released, and then the secondary curing of the resin 3 is performed. conduct. Thereby, the timing of mold release can be optimized, and a molded product of good quality can be efficiently produced.
第3図は本発明の第2実施例を示したものであり、上記
した第1実施例とは特に樹脂3側の温度を検出する検出
手段か異なっている。即ち、被モールド物がコイル2の
ように導体の場合、そのコイル2の両端子間の抵抗を測
定することに基づきコイル2の温度、ひいては樹脂3の
温度を算出することかできるから、この方法を用いてコ
イル温度検出装置1]によりコイル2の温度を検出する
ようにしている。この場合、コイル温度検出装置11に
よる検出温度が第1実施例における温度センサ6による
検出温度(樹脂3の温度1+)に相当している。従って
、コイル温度検出装置]]ににる検出温度と、加熱炉4
内の温度を検出する温度センサ7の検出温度とに基づい
て第1実施例と同様に、制御装置8により樹脂3の一次
硬化の完了時点を判定することができる。FIG. 3 shows a second embodiment of the present invention, which is different from the first embodiment described above, particularly in the detection means for detecting the temperature on the resin 3 side. That is, when the object to be molded is a conductor like the coil 2, the temperature of the coil 2 and, by extension, the temperature of the resin 3 can be calculated based on measuring the resistance between both terminals of the coil 2, so this method The temperature of the coil 2 is detected using the coil temperature detection device 1]. In this case, the temperature detected by the coil temperature detection device 11 corresponds to the temperature detected by the temperature sensor 6 (temperature 1+ of the resin 3) in the first embodiment. Therefore, the temperature detected by the coil temperature detection device] and the temperature detected by the heating furnace 4
Similarly to the first embodiment, the control device 8 can determine the point in time when the primary curing of the resin 3 is completed based on the temperature detected by the temperature sensor 7 that detects the temperature inside.
このような第2実施例によれば、コイル温度検出装置1
1によってコイル2の温度を検出するようにしているの
で、成形型1の外面に取り付けた温度センサ6による検
出に比べて、樹脂3そのものの温度に近い温度を測定で
き、ひいては樹脂3の一次硬化の完了時点の判定を一層
正確に行うことができる。According to such a second embodiment, the coil temperature detection device 1
1 to detect the temperature of the coil 2, it is possible to measure a temperature closer to the temperature of the resin 3 itself, compared to detection by the temperature sensor 6 attached to the outer surface of the mold 1, and as a result, the primary curing of the resin 3 The completion point can be determined more accurately.
[発明の効果コ
以上の記述にて明らかなように、本発明によれば、樹脂
の硬化完了時点を正確に判定できるから、離型するタイ
ミングを最適に設定でき、品質の良い成形物を効率良く
製造することができるという優れた効果を奏する。[Effects of the Invention] As is clear from the above description, according to the present invention, the point at which curing of the resin is completed can be accurately determined, so the timing of mold release can be set optimally, and high-quality molded products can be produced efficiently. It has the excellent effect of being easily manufactured.
第1図及び第2図は本発明の第1実施例を示し、第1図
は樹脂を加熱硬化させる状態の概略的構成図、第2図は
樹脂の温度及び加熱炉内の温度の変化を示した特性図で
ある。また、第3図は本発明の第2実施例を示した第1
図相当図である。
図面中、1は成形型、2はコイル(被モールド物)、3
は樹脂、4は加熱炉、5はヒータ(加熱手段)、6.7
は温度センサ、8は制御装置、11はコイル温度検出装
置を示す。Figures 1 and 2 show a first embodiment of the present invention, Figure 1 is a schematic diagram of the state in which the resin is heated and hardened, and Figure 2 shows changes in the temperature of the resin and the temperature in the heating furnace. FIG. Further, FIG. 3 shows the first embodiment showing the second embodiment of the present invention.
It is a figure equivalent figure. In the drawing, 1 is a mold, 2 is a coil (molded object), and 3 is a mold.
is a resin, 4 is a heating furnace, 5 is a heater (heating means), 6.7
8 is a temperature sensor, 8 is a control device, and 11 is a coil temperature detection device.
Claims (1)
の樹脂を注入し、その樹脂を加熱手段により加熱して硬
化させることによって前記被モールド物をモールドする
方法において、前記樹脂の加熱硬化時にモールド樹脂の
温度及び前記加熱手段による加熱温度を測定し、それら
の温度変化に基づいて前記樹脂の硬化状態を判定するよ
うにしたことを特徴とする樹脂モールド方法。1. In a method of molding an object to be molded by storing an object to be molded in a mold and injecting a thermosetting resin, and heating and hardening the resin with a heating means, the mold is A resin molding method characterized in that the temperature of the resin and the heating temperature by the heating means are measured, and the cured state of the resin is determined based on the temperature change.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27731490A JPH04151812A (en) | 1990-10-15 | 1990-10-15 | Resin molding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27731490A JPH04151812A (en) | 1990-10-15 | 1990-10-15 | Resin molding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04151812A true JPH04151812A (en) | 1992-05-25 |
Family
ID=17581815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27731490A Pending JPH04151812A (en) | 1990-10-15 | 1990-10-15 | Resin molding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04151812A (en) |
-
1990
- 1990-10-15 JP JP27731490A patent/JPH04151812A/en active Pending
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