JPH04147541A - Color image receiving tube - Google Patents

Color image receiving tube

Info

Publication number
JPH04147541A
JPH04147541A JP26984990A JP26984990A JPH04147541A JP H04147541 A JPH04147541 A JP H04147541A JP 26984990 A JP26984990 A JP 26984990A JP 26984990 A JP26984990 A JP 26984990A JP H04147541 A JPH04147541 A JP H04147541A
Authority
JP
Japan
Prior art keywords
etching
shadow mask
area
per unit
unit area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26984990A
Other languages
Japanese (ja)
Inventor
Nobumitsu Aihara
伸光 相原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP26984990A priority Critical patent/JPH04147541A/en
Publication of JPH04147541A publication Critical patent/JPH04147541A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To change equivalent plate thickness of shadow mask, and enable the change of deformation strength by performing half etching to a holeless area arranged in the periphery of a holed area so that etching quantity per unit area is different partially. CONSTITUTION:A shadow mask open hole made of a slot or a dot, which transmits electron beams, is drilled in a holed area 1, and half etching is performed to a holeless area 2 so that etching quantity per unit area is different. In this case, when a pitch of the half etching is made fine and a hole diameter is enlarged, etching quantity per unit area can be changed remarkably. Consequently, a pitch of the half etching part near a part to be deformed easily is made small, and a hole diameter is enlarged to reduce a difference of deformation strength between an open hole part and the half etching part to reduce deformation of the open hole to the degree without practical problem.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はカラー受像管に間し、特にシャドウマスク型カ
ラー受像管に間する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to color picture tubes, and particularly to shadow mask type color picture tubes.

〔従来の技術〕[Conventional technology]

シャドウマスク型カラー受像管は、色選別電極であるシ
ャドウマスクが15〜20%の透過率しか持たないため
、電子銃から発射された電子ビームの射突により熱膨張
をおこす。そのため、シャドウマスクの位置が変化し、
スロットもしくはドツトからなるシャドウマスク開孔を
通過した電子ビームが所定の蛍光体上にランディングし
なくなり、色純度が劣化する。陽極電流を多く流した時
や画面がフラットなカラー受像管においては、この現象
は顕著となる。
In the shadow mask type color picture tube, since the shadow mask, which is a color selection electrode, has a transmittance of only 15 to 20%, thermal expansion occurs due to the impact of the electron beam emitted from the electron gun. Therefore, the position of the shadow mask changes,
The electron beam that passes through the shadow mask apertures consisting of slots or dots no longer lands on a predetermined phosphor, resulting in deterioration of color purity. This phenomenon becomes noticeable when a large amount of anode current is applied or in color picture tubes with flat screens.

そこで、アンバー材(36%Ni−Fe合金)などの低
熱膨張材をシャドウマスク材として用い、シャドウマス
クの熱膨張による色純度の劣化を抑えている。
Therefore, a low thermal expansion material such as an invar material (36% Ni-Fe alloy) is used as a shadow mask material to suppress deterioration of color purity due to thermal expansion of the shadow mask.

シャドウマスクは、プレス成形により所定の曲面形状を
得ているが、アンバー材は、純鉄材に比ベ高耐力であり
伸びが少ない。そのためプレス成形に際しては、シャド
ウマスクの無孔領域よりも変形し易いシャドウマスクの
有孔領域が引張られ、周縁部のシャドウマスクの開孔の
形状が変形してしまう。このシャドウマスク開孔変形を
防ぐために、前述のシャドウマスクの無孔領域の表面も
しくは裏面のいずれかの面に均一にハーフエツチングを
施していた。
The shadow mask has a predetermined curved shape through press molding, but the amber material has higher yield strength and less elongation than pure iron material. Therefore, during press molding, the perforated region of the shadow mask, which is more easily deformed than the non-porous region of the shadow mask, is stretched, and the shape of the aperture of the shadow mask in the peripheral portion is deformed. In order to prevent this shadow mask hole deformation, half-etching is uniformly applied to either the front or back surface of the non-porous area of the shadow mask.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

シャドウマスクのプレス成形は、シャドウマスク板の無
孔領域を引張った状態で所定の曲面となるようにプレス
の金型で加圧した後、無孔領域をしぼり加工し曲面成形
を行っている。
Press molding of a shadow mask involves applying pressure with a press mold to form a predetermined curved surface while the non-porous area of the shadow mask plate is stretched, and then squeezing the non-porous area to form a curved surface.

この曲面成形時のしぼり加工において、強い応力がかか
るシャドウマスク有孔域側縁部での開孔の変形が著しく
、その開孔が楕円形状となったり、隣接シャドウマスク
開孔とつながる等の不具合いが生じる。
During the drawing process during curved surface forming, the holes are significantly deformed at the side edges of the shadow mask perforated area where strong stress is applied, resulting in problems such as the holes becoming elliptical or connecting with adjacent shadow mask holes. Irritation occurs.

従来のシャドウマスク板では、これを防ぐため、無孔領
域における機械的強度を弱めるように均一なハーフエツ
チングが表面もしくは裏面に施されている。
In order to prevent this, conventional shadow mask plates have uniform half-etching applied to the front or back surface to weaken the mechanical strength in non-porous areas.

しかしながら、前述のしぼり加工では、通常、ハーフエ
ツチングを施した無孔領域に対して均等な引張り応力が
加わらないため、従来のハーフエツチングのパターンで
は、引張り応力に対する伸びの量に過不足が生じる。
However, in the above-mentioned drawing process, an even tensile stress is not normally applied to the half-etched non-porous region, so in the conventional half-etching pattern, the amount of elongation is too large or too small for the tensile stress.

従って、場所によってシャドウマスクの伸び方や開孔の
変形具合に差が生じ、所定のシャドウマスク曲面形状や
有効画面形状が得られないという欠点がある。
Therefore, there are differences in the way the shadow mask stretches and the deformation of the apertures depending on the location, and there is a drawback that a predetermined shadow mask curved surface shape and effective screen shape cannot be obtained.

本発明の目的は、伸び方や開孔の変形具合が均一で、所
定の曲面形状や有効画面形状のシャドウマスクを有する
カラー受像管を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a color picture tube having a shadow mask with a uniform elongation and aperture deformation and a predetermined curved surface shape or effective screen shape.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、電子ビーム透過孔が形成された有孔領域と、
該有孔領域の外周部に配置された無孔領域とを有するシ
ャドウマスクを備えたカラー受像管において、前記無孔
領域に単位面積当りのエツチング量が部分的に異るよう
にハーフエツチングが施されている。
The present invention includes a perforated region in which an electron beam transmission hole is formed;
In a color picture tube equipped with a shadow mask having a non-porous area disposed on the outer periphery of the perforated area, half-etching is performed on the non-porous area so that the amount of etching per unit area is partially different. has been done.

〔実施例〕〔Example〕

次に、本発明の実施例について図面を参照して説明する
Next, embodiments of the present invention will be described with reference to the drawings.

第1図は本発明の一実施例のシャドウマスクの斜視図、
第2図は第1図の無孔領域におけるハーフエツチングの
ピッチと単位面積当りのエツチング量の比の関係を示す
特性図である。
FIG. 1 is a perspective view of a shadow mask according to an embodiment of the present invention;
FIG. 2 is a characteristic diagram showing the relationship between the pitch of half etching in the non-porous region of FIG. 1 and the ratio of the amount of etching per unit area.

第1図に示すように、有孔領域1には、電子ビームを透
過するスロットもしくはドツトから成るシャドウマスク
開孔が穿孔され、無孔領域には、単位面積当りのエツチ
ング量が異るようハーフエツチングが施されている。
As shown in FIG. 1, a shadow mask aperture consisting of a slot or dot that transmits the electron beam is perforated in the perforated region 1, and half holes are formed in the non-perforated region so that the amount of etching per unit area is different. Etched.

第2図に示すように、孔径を一定とした場合、孔のピッ
チと単位面積当りのエツチング量は二次関数の関係にあ
る。例へば、ピッチを0.40w+mから0.36i+
mへと10%細かくした場合、単位面積当りのエツチン
グ量は約23%多くなる。従って、シャドウマスクの等
価板厚が減少し、その箇所の変形強度が低下するため、
変形し易くなる。
As shown in FIG. 2, when the hole diameter is constant, the hole pitch and the amount of etching per unit area are in a quadratic function relationship. For example, change the pitch from 0.40w+m to 0.36i+
When the etching is made finer by 10% to m, the amount of etching per unit area increases by about 23%. Therefore, the equivalent plate thickness of the shadow mask decreases, and the deformation strength at that point decreases.
It becomes easier to deform.

第3図は第1図の無孔領域におけるエツチングの孔径と
単位面積当りのエツチング量の比の関係を示す特性図で
ある。
FIG. 3 is a characteristic diagram showing the relationship between the etching pore diameter and the etching amount ratio per unit area in the non-porous area shown in FIG.

第3図に示すように、ピッチを一定とした場合、孔径と
単位面積当りのエツチング量はほぼ比例関係にある。例
えば、孔径を0.14n+から0.154mmへと10
%大きくした場合、単位面積当りのエツチング量は約2
1%多くなる。
As shown in FIG. 3, when the pitch is constant, the hole diameter and the amount of etching per unit area are approximately proportional. For example, change the hole diameter from 0.14n+ to 0.154mm by 10
%, the etching amount per unit area is approximately 2
1% more.

上記の例は、ピッチならびに孔径をそれぞれ単独に変え
た場合のエツチング量の変化の関係であるが、ハーフエ
ツチングのピッチを細かくし、かつ、孔径を大きくして
やれば、単位当りのエツチング量を大幅に変えることが
できる。
The above example shows the relationship between the change in the amount of etching when the pitch and hole diameter are changed individually, but if the pitch of half etching is made finer and the hole diameter is made larger, the amount of etching per unit can be greatly increased. It can be changed.

第4図(a)、(b)は無孔領域におけるハーフエツチ
ングの単位面積当りのエツチング量の変化を説明する特
性図である。
FIGS. 4(a) and 4(b) are characteristic diagrams illustrating changes in the amount of etching per unit area of half etching in a non-porous region.

単位面積当りのエツチング量の変化のさせ方としては、
第4図(a)に示すように、水平、垂直軸に比べて対角
軸のエツチング量を20%増やし、それぞれの軸間は水
平軸となす角θについて、2次の三角関数の組合せとし
て変化させることにより、対角軸コーナ部の開孔の変形
を小さくすることができた。
To change the amount of etching per unit area,
As shown in Figure 4(a), the amount of etching on the diagonal axis is increased by 20% compared to the horizontal and vertical axes, and the angle between each axis is a combination of quadratic trigonometric functions with respect to the angle θ formed with the horizontal axis. By changing the diameter, it was possible to reduce the deformation of the opening at the corner of the diagonal axis.

別の例としては、第4図(b)に示すように、無孔領域
内でのハーフエツチングをラジアル方向に対して有孔領
域と無孔領域の境界からの距離rの関数として無孔領域
端でのエツチング量に比べて有効領域と無孔領域でのエ
ツチング量を20%増やすことにより、有効領域付近で
の開孔の変形を減らすことができた。
As another example, as shown in FIG. 4(b), half-etching in the non-porous area is expressed as a function of the distance r from the boundary between the perforated area and the non-porous area in the radial direction. By increasing the amount of etching in the effective area and non-porous area by 20% compared to the amount of etching at the edge, deformation of the openings near the effective area could be reduced.

このように、従来の均一ピッチ、均一開孔のハーフエツ
チングのシャドウマスクでは、開孔形状がプレスにより
変形する場合でも、変形し易い付近のハーフエツチング
部のピッチを小さくし、孔径を大きくして開孔部とハー
フエツチング部の変形強度の差を部分的に小さくするこ
とにより、開孔の変形を実用上問題ない程度まで減らす
ことができた。
In this way, in conventional half-etched shadow masks with uniform pitch and uniform openings, even if the shape of the openings is deformed by pressing, the pitch of the half-etched parts in the vicinity where deformation is likely to be reduced is reduced, and the hole diameter is increased. By partially reducing the difference in deformation strength between the aperture and the half-etched part, the deformation of the aperture could be reduced to a level that poses no practical problem.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、シャドウマスクの無孔領
域におけるハーフエツチングにおいて、孔のピッチなら
びに孔径を変化させることにより、ハーフエツチングの
シャドウマスクの等価板厚を変え、その場所での変形強
度を変化させることができる。従って、シャドウマスク
のプレス成形時に応力が集中する場所の近傍で、ハーフ
エツチングによる変形強度を低下させることにより、ハ
ーフエツチングの領域を伸び易くさせ、シャドウマスク
の有孔領域の開孔の変形を抑制する効果がある。
As explained above, the present invention changes the pitch and diameter of the holes during half-etching in the non-porous area of the shadow mask, thereby changing the equivalent plate thickness of the half-etching shadow mask and increasing the deformation strength at that location. It can be changed. Therefore, by lowering the deformation strength caused by half etching near the places where stress is concentrated during press molding of the shadow mask, the half etching region can be easily stretched, and the deformation of the holes in the perforated region of the shadow mask can be suppressed. It has the effect of

また、プレス成形時に有孔領域が不均一に伸びることに
よる有効画面形状の変形を抑える効果もある。
It also has the effect of suppressing deformation of the effective screen shape due to uneven stretching of the perforated region during press molding.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例のシャドウマスクの斜視図、
第2図は第1図の無孔領域におけるハーフエツチングの
ピッチと単位面積当りのエツチング量の比の関係を示す
特性図、第3図は第1図の無孔領域におけるエツチング
孔径と単位面積当りのエツチング量の比の関係を示す特
性図、第4図(a>、(b)は無孔領域におけるハーフ
エツチングの単位面積当りの変化を説明する特性図であ
る。 1・・・有孔領域、2・・・無孔領域。
FIG. 1 is a perspective view of a shadow mask according to an embodiment of the present invention;
Figure 2 is a characteristic diagram showing the relationship between the pitch of half etching in the non-porous area of Figure 1 and the etching amount per unit area, and Figure 3 is a characteristic diagram showing the relationship between the etching pore diameter and the etching amount per unit area in the non-porous area of Figure 1. FIG. 4 (a>, (b) is a characteristic diagram illustrating the change in half etching per unit area in a non-porous region. 1... Porous region , 2... non-porous area.

Claims (1)

【特許請求の範囲】 1、電子ビーム透過孔が形成された有孔領域と、該有孔
領域の外周部に配置された無孔領域とを有するシャドウ
マスクを備えたカラー受像管において、前記無孔領域に
単位面積当りのエッチング量が部分的に異るようにハー
フエッチングが施されたことを特徴とするカラー受像管
。 2、前記無孔領域がハーフエッチングのピッチを変える
ことにより形成されたことを特徴とする請求項1記載の
カラー受像管。 3、前記無孔領域がハーフエッチングの孔の大きさを変
えることにより形成されたことを特徴とする請求項1記
載のカラー受像管。
[Scope of Claims] 1. In a color picture tube equipped with a shadow mask having a perforated region in which an electron beam transmission hole is formed and a non-porous region disposed on the outer periphery of the perforated region, A color picture tube characterized in that a hole region is half-etched so that the amount of etching per unit area is partially different. 2. The color picture tube according to claim 1, wherein the non-porous region is formed by changing the pitch of half etching. 3. The color picture tube according to claim 1, wherein the non-porous region is formed by changing the size of a half-etched hole.
JP26984990A 1990-10-08 1990-10-08 Color image receiving tube Pending JPH04147541A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26984990A JPH04147541A (en) 1990-10-08 1990-10-08 Color image receiving tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26984990A JPH04147541A (en) 1990-10-08 1990-10-08 Color image receiving tube

Publications (1)

Publication Number Publication Date
JPH04147541A true JPH04147541A (en) 1992-05-21

Family

ID=17478053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26984990A Pending JPH04147541A (en) 1990-10-08 1990-10-08 Color image receiving tube

Country Status (1)

Country Link
JP (1) JPH04147541A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980051545A (en) * 1996-12-23 1998-09-15 구자홍 Shadow mask of flat CRT

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980051545A (en) * 1996-12-23 1998-09-15 구자홍 Shadow mask of flat CRT

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