JPH0414629U - - Google Patents
Info
- Publication number
- JPH0414629U JPH0414629U JP5640690U JP5640690U JPH0414629U JP H0414629 U JPH0414629 U JP H0414629U JP 5640690 U JP5640690 U JP 5640690U JP 5640690 U JP5640690 U JP 5640690U JP H0414629 U JPH0414629 U JP H0414629U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic plate
- fitting
- enclosure
- view
- outer periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 description 1
Description
第１図乃至第６図は本考案の第１実施例を示す
もので、第１図はＰＣ板の製造方法を説明するた
めの断面図、第２図はコンクリート打設前におけ
るセラミツクス板の裏面図、第３図は支持部材の
斜視図、第４図は取付具の側面図、第５図は包囲
体近傍を示す斜視図、第６図は取付具の別例を示
す側面図である。第７図乃至第１１図は本考案の
第２実施例を示すもので、第７図はコンクリート
打設前におけるセラミツクス板の一部側面図、第
８図は同セラミツクス板の裏面図、第９図は支持
部材の斜視図、第１０図は取付具を示す側面図、
第１１図は取付具の別例を示す側面図である。第
１２図は本考案の第３実施例を示す要部の側断面
図である。第１３図は成形されたＰＣ板の一部側
面図である。第１４図は支持部材を他の目的に共
用した場合の断面図である。
３……セラミツクス板、３ａ……表面、３ｂ…
…裏面、４……支持部材、４ｂ，４ｂ……取付孔
、５……取付具、６……包囲体、７……コンクリ
ート、８……絶縁部材。
Figures 1 to 6 show the first embodiment of the present invention. Figure 1 is a cross-sectional view for explaining the method of manufacturing a PC board, and Figure 2 is the back side of a ceramic board before concrete pouring. 3 is a perspective view of the support member, FIG. 4 is a side view of the fixture, FIG. 5 is a perspective view showing the vicinity of the enclosure, and FIG. 6 is a side view showing another example of the fixture. 7 to 11 show a second embodiment of the present invention, in which FIG. 7 is a partial side view of the ceramic board before concrete placement, FIG. 8 is a back view of the same ceramic board, and FIG. The figure is a perspective view of the support member, FIG. 10 is a side view showing the fixture,
FIG. 11 is a side view showing another example of the fixture. FIG. 12 is a side sectional view of the main parts showing a third embodiment of the present invention. FIG. 13 is a partial side view of the molded PC board. FIG. 14 is a sectional view when the support member is used for other purposes. 3...Ceramics plate, 3a...Surface, 3b...
...Back surface, 4...Supporting member, 4b, 4b...Mounting hole, 5...Mounting tool, 6...Envelope, 7...Concrete, 8...Insulating member.
Claims (1)
間隔で複数固着し、該支持部材４には、これに形
成した取付孔４ｂ，４ｄに係止して弾性部材から
なる取付具５を突出的に取付け、前記支持部材４
と取付具５の外周には、取付具５の一部を突出さ
せて包囲体６を被覆設置し、更に前記セラミツク
ス板３の裏面にはシート状の絶縁部材８を付設し
、更に前記絶縁部材８、包囲体６ならびに取付具
５の突出部を埋設するようにセラミツクス板３の
裏面側にコンクリート７を打設してセラミツクス
板３とコンクリート７とを一体化したことを特徴
とするセラミツクス製ＰＣ板。 A plurality of supporting members 4 are fixed to the back side of the ceramic plate 3 at appropriate intervals, and a mounting tool 5 made of an elastic member is protrudingly attached to the supporting member 4 by being engaged with mounting holes 4b and 4d formed in the supporting member 4. Attachment, the support member 4
A part of the fitting 5 protrudes from the outer periphery of the fitting 5, and an enclosure 6 is installed to cover the outer periphery of the fitting 5. Furthermore, a sheet-like insulating member 8 is attached to the back surface of the ceramic plate 3, and the insulating member 8. A ceramic PC characterized in that the ceramic plate 3 and the concrete 7 are integrated by pouring concrete 7 on the back side of the ceramic plate 3 so as to bury the protruding parts of the enclosure 6 and the fixture 5. Board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5640690U JP2505597Y2 (en) | 1990-05-29 | 1990-05-29 | PC board made of ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5640690U JP2505597Y2 (en) | 1990-05-29 | 1990-05-29 | PC board made of ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0414629U true JPH0414629U (en) | 1992-02-05 |
| JP2505597Y2 JP2505597Y2 (en) | 1996-07-31 |
Family
ID=31580202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5640690U Expired - Fee Related JP2505597Y2 (en) | 1990-05-29 | 1990-05-29 | PC board made of ceramics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2505597Y2 (en) |
-
1990
- 1990-05-29 JP JP5640690U patent/JP2505597Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2505597Y2 (en) | 1996-07-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |