JPH04146083A - Vacuum pincette - Google Patents

Vacuum pincette

Info

Publication number
JPH04146083A
JPH04146083A JP2268800A JP26880090A JPH04146083A JP H04146083 A JPH04146083 A JP H04146083A JP 2268800 A JP2268800 A JP 2268800A JP 26880090 A JP26880090 A JP 26880090A JP H04146083 A JPH04146083 A JP H04146083A
Authority
JP
Japan
Prior art keywords
suction
vacuum
wafer
section
attraction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2268800A
Other languages
Japanese (ja)
Inventor
Toshiyuki Nakamura
敏之 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2268800A priority Critical patent/JPH04146083A/en
Publication of JPH04146083A publication Critical patent/JPH04146083A/en
Pending legal-status Critical Current

Links

Landscapes

  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To make the vacuum-attractedly holding of a wafer possible even in a place having no vacuum piping facilities by operating a vacuum operation section to turn an attracting section into a vacuum state. CONSTITUTION:When an attraction operating section 2 is grasped to reduce its volume, air in the attraction operating section 2 and the inside of a holder 4 is discharged. When an attracting section 1 is put on the back of a wafer in this state, and the grasp of the attraction operating section 2 is loosened, the returning force of an air drawing rubber turns the inside of the attraction operating section 2 and the holder 4 into a vacuum state, and the wafer is thereby attracted to the attracting section 1. In order to release the attraction of the wafer, the attraction operating section 2 is grasped again to turn the internal pressure of the attracting rubber into positive pressure.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、ウェハ製造プロ老スでウェハの保持に使用
する真空ビンセットに関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a vacuum bin set used for holding wafers in wafer manufacturing processes.

〔従来の技術〕[Conventional technology]

第2図は、従来の真空ビンセットを示す外観図であり、
図において(1)はウェハを吸着する吸着部で、ウェハ
裏面C図示せず)を吸着する。(5)は吸着部(1)の
真空のON 、 OFFの操作を行う吸着スイッチ、+
61は真空配管であり、ナイロンチューブよりなるカー
ルコードになっている。
FIG. 2 is an external view showing a conventional vacuum bottle set,
In the figure, (1) is a suction unit for suctioning a wafer, which suctions the back surface C of the wafer (not shown). (5) is a suction switch that turns on and off the vacuum of the suction part (1); +
61 is a vacuum pipe, which is a curled cord made of a nylon tube.

次に動作I【ついて説明する。Next, operation I will be explained.

吸着スイッチ15)をON操作することによって、真空
配管131からの真空が働き、吸着部(1)は吸着可能
状態となり、吸着部(1)をウェハ裏面に付けると、ウ
ェハが吸着部(1)に吸着されろ。ウェハの吸着解除は
、吸着スイッチ籠2)をOFF操作することによって行
なわれろ。
By turning on the suction switch 15), the vacuum from the vacuum pipe 131 is activated, and the suction part (1) becomes ready for suction. When the suction part (1) is attached to the back side of the wafer, the wafer is attached to the suction part (1). Be absorbed by. The wafer suction is released by turning off the suction switch basket 2).

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の真空ビンセットは、以上のように構成されている
ので、真空配管のとどく範囲でしか使用できず、使用価
値が低いなどの問題点があった。
Since the conventional vacuum bottle set is configured as described above, it can only be used within the reach of the vacuum piping, and there are problems such as low usability.

この発明は上記のような問題点を解消するためになさね
たもので、持ち運び自在な真空ビンセットを得ることを
目的とする。
This invention was made to solve the above-mentioned problems, and an object thereof is to obtain a vacuum bottle set that is easily portable.

〔課題を解決するための手段〕[Means to solve the problem]

本発明に係る真空ビンセットは、真空操作部を操作して
吸着部を真空状態にするようにしたものである。
In the vacuum bottle set according to the present invention, the suction section is brought into a vacuum state by operating the vacuum operation section.

〔作用〕[Effect]

この発明における真空ビンセットは、真空操作部を操作
して吸着部を真空状態にし、吸着部でウェハを吸着する
In the vacuum bin set according to the present invention, the suction section is brought into a vacuum state by operating the vacuum operation section, and the wafer is suctioned by the suction section.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。第1
図において、(1)は吸着部で吸着面Iとストッパー@
を備えウェハ裏面を吸着できるように構成されている。
An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (1) is the suction part with the suction surface I and the stopper @
It is configured to be able to adsorb the back side of the wafer.

(2)は吸引ゴムからなる吸着操作部で、手動で圧縮で
きるように構成されている。
(2) is a suction operation part made of suction rubber, and is configured to be able to compress manually.

+4)は吸着部(1)と吸着操作部(2)をつなぐホル
ダーである。
+4) is a holder that connects the suction section (1) and the suction operation section (2).

次に6作について説明でる。第1図(mlの状態におい
て、吸着操作部(2)を握り縮小させると、吸着操作部
(2)とホルダ(4)内部の空気が排出される。この状
態で吸着部(1)をウェハ裏面に付け、吸着操作部(2
)の握りをゆるめると吸引ゴムの復帰力により内部が負
圧になりつエバは吸着部(1)に吸着される。
Next, I will explain about the 6 works. Fig. 1 (In the ml state, when the suction operation part (2) is squeezed and retracted, the air inside the suction operation part (2) and the holder (4) is exhausted. In this state, the suction part (1) is attached to the wafer. Attached to the back side, the suction operation part (2
) When the grip of the suction rubber is loosened, a negative pressure is created inside due to the return force of the suction rubber, and the evaporator is suctioned by the suction part (1).

ウェハの吸着解除は、再度吸着操作部(2)を握り吸引
ゴムの内圧を正圧にして行う。
The suction of the wafer is released by gripping the suction operation part (2) again and making the internal pressure of the suction rubber positive.

なお、吸着操作部(2)は、内部にリブ(3)を設けた
「ヒョウタン」形で復帰力の強いつぶれない構造lζな
っている。
The suction operation part (2) has a "gourd" shape with ribs (3) provided inside and has a structure lζ that has a strong return force and does not collapse.

〔発明の効果〕〔Effect of the invention〕

以上のように本発明によれば、吸着操作部を操作でろこ
とによって吸着部でウェハの吸着、または解放ができる
ので、真空配管設備のない場所でもウェハの真空吸着保
持が得らねる効果がある。
As described above, according to the present invention, the wafer can be sucked or released by the suction section by operating the suction operation section, so that the wafer can be held by vacuum suction even in places without vacuum piping equipment. .

【図面の簡単な説明】[Brief explanation of drawings]

m1図(11はこの考案の実施例による真空ビンセット
を示す断面図、第1図(blは吸着部の正面図、第2図
は従来の真空ビンセットの外観図である。 図において、(1)は吸着部、叩は吸着面、鰺はストッ
パー、【2)は吸着操作部−+3)はリブ、(4)はホ
ルダである。 なお、図中、同一符号は同一、又は相当部分を示す。
Figure m1 (11 is a sectional view showing a vacuum bottle set according to an embodiment of this invention, Figure 1 (bl is a front view of the suction part, and Figure 2 is an external view of a conventional vacuum bottle set. 1) is the suction part, the tap is the suction surface, the mackerel is the stopper, [2) is the suction operation part-+3) is the rib, and (4) is the holder. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims]  ウエハを吸着できる吸着面とウエハストツパーを有す
る吸着部、操作によつて上記吸着部に吸引力または排出
力を供給するように構成され内部にリブをもつ吸着操作
部、上記吸着部と上記吸着操作部とを接続したホルダよ
り成る真空ピンセツト。
A suction unit having a suction surface capable of suctioning a wafer and a wafer stopper, a suction operation unit configured to supply suction force or ejection force to the suction unit by operation and having ribs inside, the suction unit and the suction operation unit. Vacuum tweezers consisting of a holder connected to.
JP2268800A 1990-10-05 1990-10-05 Vacuum pincette Pending JPH04146083A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2268800A JPH04146083A (en) 1990-10-05 1990-10-05 Vacuum pincette

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2268800A JPH04146083A (en) 1990-10-05 1990-10-05 Vacuum pincette

Publications (1)

Publication Number Publication Date
JPH04146083A true JPH04146083A (en) 1992-05-20

Family

ID=17463446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2268800A Pending JPH04146083A (en) 1990-10-05 1990-10-05 Vacuum pincette

Country Status (1)

Country Link
JP (1) JPH04146083A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014054701A (en) * 2012-09-13 2014-03-27 Asahi Glass Co Ltd Suction tool and method for producing glass substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014054701A (en) * 2012-09-13 2014-03-27 Asahi Glass Co Ltd Suction tool and method for producing glass substrate

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