JPH0414422A - Method for controlling warpage quantity of resin molded product - Google Patents

Method for controlling warpage quantity of resin molded product

Info

Publication number
JPH0414422A
JPH0414422A JP11908290A JP11908290A JPH0414422A JP H0414422 A JPH0414422 A JP H0414422A JP 11908290 A JP11908290 A JP 11908290A JP 11908290 A JP11908290 A JP 11908290A JP H0414422 A JPH0414422 A JP H0414422A
Authority
JP
Japan
Prior art keywords
warpage
correlation
molded
relation
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11908290A
Other languages
Japanese (ja)
Inventor
Toshihiro Kondo
Hiroya Fujinawa
Original Assignee
Sekisui Chem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chem Co Ltd filed Critical Sekisui Chem Co Ltd
Priority to JP11908290A priority Critical patent/JPH0414422A/en
Publication of JPH0414422A publication Critical patent/JPH0414422A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To stabilize the warpage quantity of a molded product with high accuracy and to enhance yield by preliminarily calculating the relation between the warpage quantity and wt. of the molded product as the first correlation and the relation between the warpage quantity and the holding pressure of a molding machine as the second correlation and calculating the control quantity of the holding pressure of the succeeding molded product on the basis of the first and second correlations.
CONSTITUTION: The relation between the warpage quantity as the specific quantity of a substrate 11 and the wt. thereof immediately after taken out of a molding machine 10 is preliminarily calculated as the first correlation to be stored in a data operation part 13. The relation between the warpage quantity of the substrate 11 and the holding pressure as the specific operating condition of the molding machine 10 is preliminarily calculated as the second correlation to be stored in the data operation part 13. At the molding time of the product substrate 11, the wt. of the substrate 11 is detected by a wt. measuring device 16. The data operation part 13 collates the wt. detection result with the first correlation to estimate the warpage quantity of the molded product of this time. Next, the data operation part 13 collates the measured result of the warpage quantity with the second correlation to calculate the control quantity of the holding pressure of the molding machine necessary for receiving the warpage quantity of the succeeding molded product in an objective value.
COPYRIGHT: (C)1992,JPO&Japio
JP11908290A 1990-05-08 1990-05-08 Method for controlling warpage quantity of resin molded product Pending JPH0414422A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11908290A JPH0414422A (en) 1990-05-08 1990-05-08 Method for controlling warpage quantity of resin molded product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11908290A JPH0414422A (en) 1990-05-08 1990-05-08 Method for controlling warpage quantity of resin molded product

Publications (1)

Publication Number Publication Date
JPH0414422A true JPH0414422A (en) 1992-01-20

Family

ID=14752437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11908290A Pending JPH0414422A (en) 1990-05-08 1990-05-08 Method for controlling warpage quantity of resin molded product

Country Status (1)

Country Link
JP (1) JPH0414422A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7379404B2 (en) 1999-06-25 2008-05-27 Samsung Electronics Co., Ltd. Apparatus and method of compensating for tilt and/or defocus of a disc during recording

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7379404B2 (en) 1999-06-25 2008-05-27 Samsung Electronics Co., Ltd. Apparatus and method of compensating for tilt and/or defocus of a disc during recording

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