JPH0414422A - Method for controlling warpage quantity of resin molded product - Google Patents
Method for controlling warpage quantity of resin molded productInfo
- Publication number
- JPH0414422A JPH0414422A JP11908290A JP11908290A JPH0414422A JP H0414422 A JPH0414422 A JP H0414422A JP 11908290 A JP11908290 A JP 11908290A JP 11908290 A JP11908290 A JP 11908290A JP H0414422 A JPH0414422 A JP H0414422A
- Authority
- JP
- Japan
- Prior art keywords
- molded product
- warpage
- correlation
- amount
- molding machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 10
- 239000011347 resin Substances 0.000 title claims description 8
- 229920005989 resin Polymers 0.000 title claims description 8
- 238000000465 moulding Methods 0.000 claims abstract description 41
- 238000001514 detection method Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 17
- 238000004364 calculation method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000003908 quality control method Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、樹脂成形品の反り量制御方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for controlling the amount of warpage of a resin molded product.
従来、樹脂製品の射出成形ラインにおいては、例えば、
光デイスク用基板等、成形製品に極めて高い平坦度精度
が要求される場合には、その品質管理上、樹脂成形品の
反り量と成形機の特定した運転条件との相関を予め測定
しておき、成形された１１詣成形品の上記反り量を検査
し、この検査結果が品質不良として判定された場合は、
この品質値の判定結果を上記予め定めである相関に照合
して、後続成形品の上記品質値を目標値内に納めるのに
必要な成形機の上記特定運転条件の調整量を求める。そ
して、後続成形品の成形時に、この成形機の上記特定運
転条件をこの調整量に従って調整するようにしていた。Conventionally, in injection molding lines for resin products, for example,
When extremely high flatness precision is required for molded products such as substrates for optical disks, it is necessary to measure the correlation between the amount of warpage of the resin molded product and the specified operating conditions of the molding machine in advance for quality control purposes. , Inspect the amount of warpage of the molded product, and if the inspection result is determined to be poor quality,
The determination result of the quality value is compared with the predetermined correlation, and the adjustment amount of the specific operating condition of the molding machine required to keep the quality value of the subsequent molded product within the target value is determined. Then, when molding a subsequent molded product, the specific operating conditions of the molding machine are adjusted in accordance with this adjustment amount.
しかしながら、この種の成形品において管理すべき反り
量は、成形後の常温環境条件下に放置されて吸水や残留
応力が平衡に達した段階でなければ、本来、安定した反
り量を示さない。However, the amount of warpage that must be controlled in this type of molded product does not inherently show a stable amount of warpage unless it is left under room temperature environmental conditions after molding and water absorption and residual stress have reached equilibrium.
このため、上述のような従来の品質制御方法を実施する
に当りでは、今回成形品の反り量検出のために、成形後
長時間を必要とする。すなわち、今回成形品の成形後、
この成形品の反り量検出までの時間遅れ（タイムラグ）
が比較的大きく、このタイムラグの間に成形される後続
成形品が不良であるにも拘らず、そのまま維続して多量
に生産されてしまうことかあり、成形品の歩留りを悪化
させる可能性があった。Therefore, when implementing the conventional quality control method as described above, a long time is required after molding to detect the amount of warpage of the molded product. In other words, after molding the molded product this time,
Time delay until the amount of warpage of this molded product is detected (time lag)
is relatively large, and even though subsequent molded products molded during this time lag are defective, they may continue to be produced in large quantities, which may worsen the yield of molded products. there were.
なお、今回成形品の良否判別を、成形品の品質に影響を
与える成形機の圧力、速度等の物理量によって監視する
方法が、例えば、特開昭６３−４９２５号公報に開示提
案されている。これによれば、今回成形品の成形後に、
大きなタイムラグなく、成形品の品質を監視し、このモ
ニタリング結果を後続成形品のための品質制御動作に利
用しようとするものである。しかしながら、このような
良否判別監視は、今回成形品そのものの物理量に基づく
ものではないため、この種の監視方法としては来貢的に
不完全であり、実質的に直ちに後続する成形品の品質を
安定化する方法として不十分である。A method of monitoring the quality of a molded product using physical quantities such as pressure and speed of a molding machine that affect the quality of the molded product has been proposed, for example, in Japanese Patent Application Laid-Open No. 63-4925. According to this, after molding the molded product,
The aim is to monitor the quality of molded products without a large time lag and use the monitoring results for quality control operations for subsequent molded products. However, this kind of quality determination monitoring is not based on the physical quantities of the molded product itself, so it is incomplete as a monitoring method of this type, and the quality of subsequent molded products can be virtually immediately evaluated. This is insufficient as a stabilizing method.
本発明は、この種の樹脂成形品の反り量を高蹟度で安定
化し、歩留りを同士することを目的としている。The object of the present invention is to stabilize the amount of warpage of this type of resin molded product at a high degree and to equalize the yield.
（［！を解決するための手段）
本発明は、成形品の反り量と該成形品の重量との関係を
第１の相関として予め求めるとともに、この成形品の前
記反り量と成形機の保持圧力との関係を第２の相関とし
て予め求めておき、この成形機による該成形品の成形時
に、今回成形品の成形機からの取出し直後の重量を検出
し、この重量の検出結果を前記第１の相関に照合して今
回成形品の前記反り量を推定し、この反り量の推定結果
を前記第２の相関に照合して、後続成形品の前記反り量
を目標値内に納めるに必要なこの成形機の前記保持圧力
の調整量を求め、後続成形品の成形時に、この成形機の
前記保持圧力をこの調整量に従って調整するようｉｌＪ
御する方法を採用することにより、前記目的を達成しよ
うとするものである。(Means for Solving [!]) The present invention obtains the relationship between the amount of warpage of a molded product and the weight of the molded product in advance as a first correlation, and also calculates the amount of warpage of the molded product and the holding of the molding machine. The relationship with pressure is determined in advance as a second correlation, and when the molded product is molded by this molding machine, the weight of the molded product immediately after being taken out from the molding machine is detected, and the detection result of this weight is used as the second correlation. The amount of warpage of the current molded product is estimated by comparing it with the first correlation, and the estimation result of this amount of warpage is checked with the second correlation, which is necessary to keep the amount of warpage of the subsequent molded product within the target value. The adjustment amount of the holding pressure of this molding machine is determined, and the holding pressure of this molding machine is adjusted according to this adjustment amount when molding subsequent molded products.
The aim is to achieve the above objective by adopting a method of controlling
ｒ作用〕
以上のような本発明方法により、まず、今回成形品の成
形機からの取出し直後の重量を検出し、この重量の検出
結果と前記第１の相関に基ついて、その反り量を推定し
、さらに、この反り量の推定結果と前記第２の相関に基
づいて、後続成形品の前記反り量を目標値内に納めるの
に必要な成形機保持圧力の調整量を求める。r effect] According to the method of the present invention as described above, first, the weight of the molded product immediately after being taken out from the molding machine is detected, and the amount of warpage is estimated based on the detection result of this weight and the first correlation. Furthermore, based on the estimation result of the amount of warpage and the second correlation, the adjustment amount of the molding machine holding pressure necessary to keep the amount of warpage of the subsequent molded product within the target value is determined.
そして、後続成形品の成形時に、成形機の前記運転条件
を上記調整量に従フて調整するようにＡ制御することに
より、後続成形品の反り量を、時間遅れを生ずることな
く、所定の目標値内に納めることができ、結果として製
品歩留りを向上し待る。Then, when molding a subsequent molded product, the operating conditions of the molding machine are controlled according to the adjustment amount, thereby controlling the amount of warpage of the subsequent molded product to a predetermined value without causing a time delay. This can be achieved within the target value, resulting in improved product yield.
（実施例〕 以下に本発明を実施例に基づいて説明する。(Example〕 The present invention will be explained below based on examples.
第１図は、本発明を適用した射出成形システムの一例を
示す模式図、１ＩＪ２図は、射出成形製品としての光デ
イスク用基板の重量と反り量の関係（第１の相関）を示
す特性線図、第３図は、保持圧力と反り量との関係（第
２の相関）を示す特性線図である。Fig. 1 is a schematic diagram showing an example of an injection molding system to which the present invention is applied, and Fig. 1IJ2 is a characteristic line showing the relationship (first correlation) between the weight and amount of warpage of an optical disk substrate as an injection molded product. 3 are characteristic diagrams showing the relationship (second correlation) between the holding pressure and the amount of warpage.
（Ｊｌｌｉ成／方法）
区側の成形機１０は、製品として、極めて高い平坦度蹟
度を要求されるポリカーホネト製光ティスク用基板１１
を射出成形するものであり、固定側金型１２Ａと移動側
金型１２Ｂとを備えている。また、成形機１０は、デー
タ演算部１３制御部１４及び各金型温調器１５Ａ、１５
Ｂを備えている。１６は成形品の垂ｔ？１ｌＩＩ定番を
示す。(Jlli production/method) The molding machine 10 on the ward side is used to manufacture optical disc substrates 11 made of polycarbonate, which require extremely high flatness and roughness as a product.
The mold is injection molded and includes a stationary mold 12A and a movable mold 12B. The molding machine 10 also includes a data calculation section 13 control section 14 and mold temperature controllers 15A and 15.
It has B. 16 is the height of the molded product? 1lII standard is shown.
然るに、基板１１の特定品質としての反り曙と、基板１
１の成形ａＩＯがらの取出し直接の重量との間には、第
２図に示すような関係が成立する。本発明においては、
この関係を第１の相関として予め求め、データ演算部１
３に格納／記憶させである。However, the warpage as a specific quality of the board 11 and the board 1
The relationship shown in FIG. 2 is established between the weight of the molded aIO pieces in No. 1 and the weight of the molded aIO pieces directly taken out. In the present invention,
This relationship is determined in advance as the first correlation, and the data calculation unit 1
3 to be stored/memorized.
また、基板１１の反り量と、成形Ｊｌｔｏの特定運転条
件としての保持圧力との間には、基板１１において、第
３図に示すような関係が成立する。Furthermore, a relationship as shown in FIG. 3 is established in the substrate 11 between the amount of warpage of the substrate 11 and the holding pressure as a specific operating condition for molding Jlto.
本発明においては、この関係を第２の相関として予め求
め、データ演算部１３に格納／記憶させである。In the present invention, this relationship is determined in advance as a second correlation and stored/stored in the data calculation unit 13.
成形機１０は、重量測定器１６を備えており、成形機１
０により製品基板１１の成形時に、重量測定器１６によ
り基板１１の重量を検出する。The molding machine 10 is equipped with a weight measuring device 16, and the molding machine 1
0, when the product substrate 11 is molded, the weight of the substrate 11 is detected by the weight measuring device 16.
データ演算部１３は、この重量測定器！６の検出結果を
読取る。データ演算部１３によりこの重量の読取りタイ
ミングは、成形終了後、不図示の取出し装置によって基
板１１が重量測定ｌ＃１６上に取出され、後続の基板が
取出されるまでの間である。The data calculation unit 13 is this weight measuring device! Read the detection result of 6. The timing at which this weight is read by the data calculation unit 13 is after the completion of molding, when the substrate 11 is taken out onto the weight measurement l#16 by an unillustrated take-out device, and until the subsequent substrate is taken out.
然して、データ演算部１３は、重量測定器１６による重
量検出結果を前記第１の相関に照合して今回成形品の反
り量を推定する。次に、データ演算部１３は、この反り
量の測定結果を前記第２の相関に照合して、後続形成品
の反り量を目標優に納めるのに必要な成形機１０の保持
圧力の調整量を求める。例えば、反り量を５０μｍ以内
に納めたい場合、保持圧力は（６７０±２０ ） Ｋｇ
ｆ／ｃａｒ２以内に調整すればよい。The data calculation unit 13 compares the weight detection result by the weight measuring device 16 with the first correlation to estimate the amount of warpage of the molded product. Next, the data calculation unit 13 compares the measurement result of the amount of warpage with the second correlation, and adjusts the holding pressure of the molding machine 10 necessary to keep the amount of warp of the subsequent formed product well within the target value. seek. For example, if you want to keep the amount of warpage within 50μm, the holding pressure is (670±20) Kg.
It is sufficient to adjust it to within f/car2.
そして、データ演算部１３は、後続形成品の成形時に、
成形機１０の保持圧力を上記調整量にしたがって調整す
る。Then, the data calculation unit 13 performs the following operations during molding of the subsequent formed product:
The holding pressure of the molding machine 10 is adjusted according to the above adjustment amount.
（作用／効果）
この発明の実施例によれば、つぎのような作用／効果が
得られる。(Actions/Effects) According to the embodiments of the present invention, the following actions/effects can be obtained.
１）第１の相関に基づき、成形品としての製品基板１１
の成形機１０からの取出し直後の重量を検出することに
より、成形品１１の反り量を推定できる。従って、今回
成形品の成形後に、大きな時間遅れを生ずることなく、
成形品１１の反り量を推定でき、従来例のように、これ
らの成形品１１を常温環境下に放置して品質検査を行う
まで不良品を出し続けることなく、即時にフィードバッ
ク制御ができる。1) Based on the first correlation, the product substrate 11 as a molded product
By detecting the weight of the molded product 11 immediately after it is taken out from the molding machine 10, the amount of warpage of the molded product 11 can be estimated. Therefore, after molding the molded product, there will be no large time delay.
The amount of warpage of the molded products 11 can be estimated, and immediate feedback control can be performed without leaving these molded products 11 in a room temperature environment and continuing to produce defective products until quality inspection is performed, as in the conventional example.
２） この実施例方法においては、成形品の反り量を、
今回製品そのものの物理量であるそれ自身の重量に基づ
いて推定しているため、その推定結反の向上により、こ
の推定結果に基づいて成形品１１の反り量制御精度を向
上できる。2) In this example method, the amount of warpage of the molded product is
Since this time the estimation is based on the weight of the product itself, which is a physical quantity of the product itself, the estimated warpage is improved, and the accuracy of controlling the amount of warpage of the molded article 11 can be improved based on this estimation result.
従って、前記１）、２）により、成形品としての製品基
板１１の反り量を高精度で安定化し、製品の歩留りを向
上できる。Therefore, according to 1) and 2) above, the amount of warpage of the product substrate 11 as a molded product can be stabilized with high precision, and the yield of the product can be improved.
以上、説明したように、本発明によれば、樹脂成形品の
形状精度品質を高精度で安定化し、製品の歩留りを向上
できる。As described above, according to the present invention, the shape precision quality of a resin molded product can be stabilized with high precision, and the yield of products can be improved.
第１図は、本発明に係る射出成形システムの一例を示す
模式図、第２図は、製品基板重量と反り量との関係（第
１の相関）を示す特性線図の一例、第３図は、保持圧力
と反り量との関係（第２の相関）を示す特性線図の一例
である。
１０−一成形機
１ｌ−−−−（製品）基板（樹脂成形品）１３−−−−
データ演算部
１４−−−−−制御部
１５Ａ＝−同定側金型温調器
１５Ｂ−−−−移動側金型温調器
１６−−−−−重量測定器FIG. 1 is a schematic diagram showing an example of an injection molding system according to the present invention, FIG. 2 is an example of a characteristic diagram showing the relationship between the product substrate weight and the amount of warpage (first correlation), and FIG. is an example of a characteristic diagram showing the relationship (second correlation) between the holding pressure and the amount of warpage. 10-1 Molding machine 1l---(Product) Substrate (resin molded product) 13------
Data calculation unit 14 ---- Control unit 15A = - Identification side mold temperature regulator 15B ---- Moving side mold temperature regulator 16 ---- Weight measuring device
Claims (1)
関として予め求めるとともに、この成形品の前記反り量
と成形機の保持圧力との関係を第２の相関として予め求
めておき、この成形機における今回成形品の重量を検出
し、この重量の検出結果を前記第１の相関に照合して今
回成形品の前記反り量を推定し、この反り量の推定結果
を前記第２の相関に照合して、後続成形品の前記反り量
を目標値内に納めるのに必要なこの成形機の前記保持圧
力の調整量を求め、後続成形品の成形時に、この成形機
の前記保持圧力をこの調整量に従って調整するよう制御
することを特徴とする樹脂成形品の反り量制御方法。The relationship between the amount of warpage of the molded product and the weight of this molded product is determined in advance as a first correlation, and the relationship between the amount of warpage of this molded product and the holding pressure of the molding machine is determined in advance as a second correlation. , detect the weight of the current molded product in this molding machine, compare this weight detection result with the first correlation to estimate the amount of warpage of the current molded product, and use the estimated result of the warp amount as the second correlation. The amount of adjustment of the holding pressure of this molding machine necessary to keep the warpage amount of the subsequent molded product within the target value is determined by comparing the correlation with the holding pressure of this molding machine when molding the subsequent molded product. A method for controlling the amount of warpage of a resin molded product, comprising controlling the pressure to be adjusted according to the amount of adjustment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11908290A JPH0414422A (en) | 1990-05-08 | 1990-05-08 | Method for controlling warpage quantity of resin molded product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11908290A JPH0414422A (en) | 1990-05-08 | 1990-05-08 | Method for controlling warpage quantity of resin molded product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0414422A true JPH0414422A (en) | 1992-01-20 |
Family
ID=14752437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11908290A Pending JPH0414422A (en) | 1990-05-08 | 1990-05-08 | Method for controlling warpage quantity of resin molded product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414422A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7379404B2 (en) | 1999-06-25 | 2008-05-27 | Samsung Electronics Co., Ltd. | Apparatus and method of compensating for tilt and/or defocus of a disc during recording |
-
1990
- 1990-05-08 JP JP11908290A patent/JPH0414422A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7379404B2 (en) | 1999-06-25 | 2008-05-27 | Samsung Electronics Co., Ltd. | Apparatus and method of compensating for tilt and/or defocus of a disc during recording |
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