JPH0413938A - Electronic thermometer - Google Patents

Electronic thermometer

Info

Publication number
JPH0413938A
JPH0413938A JP2118439A JP11843990A JPH0413938A JP H0413938 A JPH0413938 A JP H0413938A JP 2118439 A JP2118439 A JP 2118439A JP 11843990 A JP11843990 A JP 11843990A JP H0413938 A JPH0413938 A JP H0413938A
Authority
JP
Japan
Prior art keywords
packing
switch
case
thermometer
electronic thermometer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2118439A
Other languages
Japanese (ja)
Inventor
Osamu Yamada
修 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2118439A priority Critical patent/JPH0413938A/en
Publication of JPH0413938A publication Critical patent/JPH0413938A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To reduce the number of parts and cost of mold and parts by molding packing together with a case and switch in two colors. CONSTITUTION:The waterproof structure of an electronic thermometer is formed by fixing a packing 2 together during the molding of a case 1 of the thermometer in two colors. A hard material is used for the case 1 and a soft material is used for the packing 2. And a packing 4 is molded on a switch 3 in two colors. A hard material is used for this switch 3 and a soft material is used for the packing 4. In both cases, different materials are molded with a single metal mold in two colors.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、電子体温計の防水構造に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a waterproof structure for an electronic thermometer.

[発明の概要] 本発明は、パツキンを用いて防水構造を取っている電子
体温計において、パツキンをケース及びスイッチと一諸
に二色成形することにより、部品費、加工費の削減及び
、防水性向上を計ったもの[従来の技術] 従来のパツキンを用いた電子体温計の防水構造は、パツ
キンをケースヘセットし、ケースどうしで押え込み、防
水構造としたり、スイッチへパツキンを挿入し、防水構
造とするものであった。
[Summary of the Invention] The present invention provides an electronic thermometer that has a waterproof structure using a gasket, and by molding the gasket together with the case and switch in two colors, the cost of parts and processing can be reduced, and waterproofness can be improved. Improvements [Conventional technology] Conventional waterproof structures for electronic thermometers using gaskets include placing the gaskets in a case and pressing them together to create a waterproof structure, or inserting gaskets into a switch to create a waterproof structure. It was something to do.

[発明が解決しようとする課題] しかし、前述の従来技術では、ケース及びスイッチに合
わせたパツキンを、金型を作り対応した部品として用意
しなければならず、型費用9部品費用がかかってしまう
という問題点を有する。
[Problems to be Solved by the Invention] However, with the above-mentioned conventional technology, a mold must be made and a mold must be prepared for the packing to match the case and the switch, resulting in a mold cost of 9 parts. There is a problem.

又、加工作業においてもパツキンセント工程を設けなけ
ればならず、加工費用もかかってしまうという問題点を
有する。
Further, there is a problem in that a packing process must be provided in the processing operation, which increases processing costs.

又、加工作業中において、パツキンのセットミスによる
防水不良や、ゴミ、ケバ付着の確率が高(なることによ
り、防水不良の留歩りが低下するという問題点を有する
Furthermore, during processing, there is a high probability of waterproofing failure due to incorrect setting of the seal, and of dirt and fluff adhering (thereby, there is a problem that the retention rate of waterproofing failure is reduced).

又、パツキンをセットした場合、パツキンの上下どちら
からでも水の入る可能性がある為、上下両方のケース状
態、パツキン状態を管理しなげれば、確実な防水構造が
確保出来ないという間順点を有する。
Also, when the gasket is set, there is a possibility that water may enter from either the top or bottom of the gasket, so if you do not manage the condition of both the upper and lower cases and the gasket, a reliable waterproof structure cannot be ensured. has.

そこで本発明はこのような間頴点を解決するもので、そ
の目的とするところは、容易に、低価格で確実な防水構
造が取れる電子体温計を提供するところにある。
SUMMARY OF THE INVENTION The present invention aims to solve these drawbacks, and its purpose is to provide an electronic thermometer that can easily have a reliable waterproof structure at a low cost.

[課題を解決する為の手段] 本発明の電子体温計の防水構造は、体温計のケース及び
スイッチの成形時に、パツキンを一諸に付けて二色成形
することを特徴とする。
[Means for Solving the Problems] The waterproof structure of the electronic thermometer of the present invention is characterized in that, when molding the case and switch of the thermometer, a gasket is attached to one piece and two-color molding is performed.

[実施例] 巣1図は、本発明の実施例におけるケースの断面図であ
って、体温計本体ケース1に、ノζツキン2が二色成形
されているものである。
[Example] Figure 1 is a sectional view of a case in an example of the present invention, in which a thermometer main body case 1 has a two-color molded sleeve 2.

10ケースには硬質の材料を使用し、2の、にツキンに
は軟質の材料を使用したものである。
A hard material is used for the 10th case, and a soft material is used for the 2nd case.

第2図は、本発明の実施例におけるスイッチの断面図で
あって、スイッチ3にパツキン4が二色成形されている
ものである。3のスイッチには硬質の材料を使用し、4
のパツキンには軟質の材料を使用したものである。いづ
れも、異なった材料を金型を一つで二色成形したもので
ある。
FIG. 2 is a cross-sectional view of a switch according to an embodiment of the present invention, in which a gasket 4 is molded on the switch 3 in two colors. Use a hard material for switch 3,
The packing is made of soft material. All of them are two-color molds made of different materials using a single mold.

[発明の効果] 以上述べたように本発明によれば、パツキンをケース及
びスイッチと一諸に二色成形する事により、部品点数を
減らす事が出来、型費用2部品費用を削減出来るという
効果を有する。
[Effects of the Invention] As described above, according to the present invention, by molding the packing together with the case and the switch in two colors, the number of parts can be reduced, and the mold cost and the cost of two parts can be reduced. has.

又、加工作業において、パツキンセットをする必要がな
い為、作業が簡素化され、加工費用を削減出来るという
効果を有する。
Furthermore, since there is no need to set the packing during processing, the work is simplified and processing costs can be reduced.

又、加工作業中のパツキンセットミスやゴミ。Also, packing mistakes and dust during processing.

ケバの付着等の確率が非常に減り、防水不良の歩続りが
向上して、より低価格で確実な防水構造が出来るという
効果を有する。
This has the effect that the probability of fluff adhesion is greatly reduced, the yield rate of waterproofing defects is improved, and a reliable waterproof structure can be achieved at a lower cost.

又、パツキンの片側はプラスチックの中へ入って成形さ
れている為、完全防水であり、反対側のパツキン、ケー
ス状態を管理してい(だげで防水保証をする事が出来、
従来より信頼度の高い確実な防水製品が出来るという効
果を有する。
In addition, because one side of the packing is molded inside the plastic, it is completely waterproof, and the packing on the other side controls the condition of the case (we can guarantee waterproofing by just doing so).
This has the effect of producing reliable waterproof products that are more reliable than conventional products.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の一実施例の構造を示す電子体温計本
体ケースの断面図。 第2図は、本発明の一実施例の構“造を示す電子体温計
スイッチの断面図。 第6図(a)は、従来の構造を示す電子体温計本体ケー
スの正面図。 第6図(b)は、従来の*造を示す電子体温計本体ケー
スの側面図。 第3図(C)は、従来の構造を示す電子体温計本体ケー
スA−Aの断面図。 第4図(a)は、従来の4G4造を示す電子体温計スイ
ッチの正面図。 第4図Cb)は、従来の134造を示す電子体温計スイ
ッチの断面図。 1・・・・・・・・・本発明の体温計本体ケース2・・
・・・・・・・本発明の体温計本体ケース用パツキン ・・・・・・・・・本発明の体温計スイッチ・・・・−
・・・・本発明の体温計スイッチ用パツキン・・・・・
・・従来技術の体温計本体ケース・・・・・・・・・従
来技術の体温計本体ケース用パツキン 15・・・・・・・・・キャノフ 26・・−・・・・・・従来技鈷の体温計スイッチ24
・・・・・・・・・従来技術の体温計スイッチ用パツキ
ン 1  ] 以上 出願人  セイコーエプソン株式会社 代理人 弁理士 玲木喜三部(他1名)第1図 第2図 第3図(a) 第3図(b) 第3図(C)
FIG. 1 is a sectional view of an electronic thermometer body case showing the structure of an embodiment of the present invention. Fig. 2 is a sectional view of an electronic thermometer switch showing the structure of an embodiment of the present invention. Fig. 6(a) is a front view of the electronic thermometer body case showing the conventional structure. Fig. 6(b) ) is a side view of the electronic thermometer main body case showing the conventional structure. Fig. 3 (C) is a sectional view of the electronic thermometer main body case A-A showing the conventional structure. Fig. 4 (a) is the conventional A front view of an electronic thermometer switch showing a 4G4 structure. Fig. 4Cb) is a cross-sectional view of an electronic thermometer switch showing a conventional 134 structure. 1. Thermometer body case of the present invention 2.・
・・・・・・Putskin for thermometer body case of the present invention ・・・・・・Thermometer switch of the present invention ・・・−
...Packskin for thermometer switch of the present invention...
・・Prior art thermometer body case ・・・Packskin 15 for thermometer body case of conventional technology ・・・Canoff 26 ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ Previous technology thermometer switch 24
......Prior art thermometer switch gasket 1] Applicant: Seiko Epson Co., Ltd. Agent Patent attorney: Yoshizo Reiki (and one other person) Figure 1 Figure 2 Figure 3 (a ) Figure 3 (b) Figure 3 (C)

Claims (1)

【特許請求の範囲】[Claims] パッキンを用いて防水構造を取っている電子体温計にお
いて、パッキンがケース及びスイッチと一諸に二色成形
されていることを特徴とする電子体温計。
An electronic thermometer having a waterproof structure using packing, characterized in that the packing is molded in two colors together with a case and a switch.
JP2118439A 1990-05-08 1990-05-08 Electronic thermometer Pending JPH0413938A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2118439A JPH0413938A (en) 1990-05-08 1990-05-08 Electronic thermometer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2118439A JPH0413938A (en) 1990-05-08 1990-05-08 Electronic thermometer

Publications (1)

Publication Number Publication Date
JPH0413938A true JPH0413938A (en) 1992-01-17

Family

ID=14736667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2118439A Pending JPH0413938A (en) 1990-05-08 1990-05-08 Electronic thermometer

Country Status (1)

Country Link
JP (1) JPH0413938A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102254937A (en) * 2011-08-08 2011-11-23 深圳深爱半导体股份有限公司 Vertical double-diffused metal-oxide-semiconductor field effect transistor device and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102254937A (en) * 2011-08-08 2011-11-23 深圳深爱半导体股份有限公司 Vertical double-diffused metal-oxide-semiconductor field effect transistor device and manufacturing method thereof

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