JPH0413893A - Method for electroplating fine metal powder - Google Patents
Method for electroplating fine metal powderInfo
- Publication number
- JPH0413893A JPH0413893A JP11663890A JP11663890A JPH0413893A JP H0413893 A JPH0413893 A JP H0413893A JP 11663890 A JP11663890 A JP 11663890A JP 11663890 A JP11663890 A JP 11663890A JP H0413893 A JPH0413893 A JP H0413893A
- Authority
- JP
- Japan
- Prior art keywords
- fine metal
- metal powder
- cathode
- electroplating
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 28
- 229910001111 Fine metal Inorganic materials 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims description 15
- 238000009713 electroplating Methods 0.000 title claims description 14
- 238000003756 stirring Methods 0.000 claims abstract description 11
- 239000008151 electrolyte solution Substances 0.000 claims description 4
- 239000002923 metal particle Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 238000007747 plating Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000004584 weight gain Effects 0.000 description 1
- 235000019786 weight gain Nutrition 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は金属微粉末の電気メッキ方法に関し、詳しくは
金属微粉末を攪拌下で分散させながら電気メッキを行う
際に、陰極面をワイピングする方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for electroplating fine metal powder, and more specifically, when performing electroplating while dispersing fine metal powder under stirring, the cathode surface is wiped. Regarding the method.
本発明方法で得られる電気メッキ金属微粉末は、導電性
フィラー、触媒、粉末冶金、焼結促進剤などの用途に適
用される。The electroplated metal fine powder obtained by the method of the present invention is applied to uses such as conductive fillers, catalysts, powder metallurgy, and sintering accelerators.
〔従来の技術］
金属微粉末に対する他金属のメッキ方法としては、無電
解メッキを利用する方法が知られている。[Prior Art] As a method of plating fine metal powder with other metals, a method using electroless plating is known.
しかしこの方法では無電解メッキ液を使用するためコス
トが高くなり、またメッキされる金属とメッキ金属との
組み合わせが限定されるとともに、置換メッキしかでき
ないなとの制約を受ける。However, this method uses an electroless plating solution, which increases the cost, limits the combinations of metals to be plated, and restricts the ability to perform only displacement plating.
しかしながら、現時的では無電解メッキによらない電気
メッキを利用する方法は、実用上知られていない。However, at present, there is no practically known method using electroplating that does not involve electroless plating.
（発明が解決しようとする課題〕
金属微粉末に金属メッキする方法として、流動層あるい
は流動状態に近似した攪拌分散下で金属微粉末を電気メ
ッキする方法は知られている（表面技術、ｖｏｌ、４１
、Ｎｏ、 ２、Ｐ６１〜１７−１９９０） 。(Problems to be Solved by the Invention) As a method of metal plating fine metal powder, a method of electroplating fine metal powder in a fluidized bed or under stirring and dispersion that approximates a fluidized state is known (Surface Technology, vol. 41
, No. 2, P61-17-1990).
本発明者らは鋭意研究した結果、分散下でも金属微粉末
は電気メンキされることを見出し、すでに出願している
。As a result of intensive research, the inventors of the present invention discovered that fine metal powder can be electroplated even under dispersion, and have already filed an application for this invention.
本発明者等は上記方法を改良すべくさらに研究した結果
、陰極面をワイピングすることにより、陰極面への金属
微粒子の付着がなく、金属微粉末は均一かつ効率よく電
気メッキされることを見出して、本発明に至ったもので
ある。As a result of further research to improve the above method, the inventors of the present invention discovered that by wiping the cathode surface, metal fine particles do not adhere to the cathode surface and the metal fine powder can be electroplated uniformly and efficiently. This led to the present invention.
本発明における金属微粉末の電気メッキ方法は、陽極お
よび陰極を有する電解液中において、金属微粉末を攪拌
下で分散させながら、電気メッキを行う際に、陰極面を
連続的または間欠的にワイピングすることを特徴とする
。The method of electroplating fine metal powder in the present invention involves dispersing fine metal powder under stirring in an electrolytic solution having an anode and a cathode, and wiping the cathode surface continuously or intermittently during electroplating. It is characterized by
本発明における金属微粉末、メッキ金属および電解液の
組成については、すでに電気メッキ等においてしられて
いるものの中から適宜選択して利用でき、特に限定され
るものではない。また陽極と陰極の形状および位置関係
、攪拌条件などについても、特に限定されるものではな
い。The compositions of the metal fine powder, plating metal, and electrolytic solution in the present invention are not particularly limited, and can be appropriately selected from those already known in electroplating and the like. Further, the shape and positional relationship between the anode and the cathode, stirring conditions, etc. are not particularly limited.
陰極面のワイピングは、連続的または間欠的に行うこと
ができる。ワイピング手段としては、例えばメッキ槽底
面に陰極を有する場合には、攪拌翼の下部に柔軟な材料
を取り付けて攪拌と同時に陰極面をワイピングしてもよ
い。またメッキ槽側面に陰極を有する場合には、攪拌機
とは別に柔軟な材料で陰極面を連続的または間欠的にワ
イピングしてもよい。材料およびその形状については、
特に限定されない。Wiping of the cathode surface can be performed continuously or intermittently. As a wiping means, for example, when the plating tank has a cathode on the bottom surface, a flexible material may be attached to the lower part of the stirring blade to wipe the cathode surface at the same time as stirring. Further, when a cathode is provided on the side surface of the plating tank, the cathode surface may be continuously or intermittently wiped with a flexible material in addition to the stirrer. Regarding materials and their shapes,
Not particularly limited.
本発明の電気メッキ方法におけるメカニズムについては
不明であるが、金属微粉末は電解液中において分散され
、陰極面をワイピングすることにより均一かつ効率よく
電気メッキされる。なおこのようにして得られた金属微
粉末は、メッキされない金属微粉末とメッキされた金属
微粉末およびメッキ金属の微粉末の混合物と推定される
。Although the mechanism of the electroplating method of the present invention is unknown, fine metal powder is dispersed in an electrolytic solution and electroplated uniformly and efficiently by wiping the cathode surface. The metal fine powder thus obtained is estimated to be a mixture of unplated metal fine powder, plated metal fine powder, and plated metal fine powder.
以下に実施例を示して、本発明を説明する。The present invention will be explained below with reference to Examples.
実施例
攪拌機を備えた内径７０ｍｍの円筒形ビーカー底部に、
直径６０ｍｍの陰極銅板を設置した。このビーカーの中
に、希塩酸で前処理した電解銅粉（福田金属箔粉工業■
製、ＣＥ −２０） １５ ｇとニッケル電解液３００
ｄ （硫酸ニッケルＮ・１ＳＯ４・７Ｈ２０，２４０ｇ
／ Ｅ、塩化ニッケルＮ ｉ Ｃｌ ２・６Ｈ２０，
４５ｇ／ｌ！およびほう酸３５ｇ／４２）を入れた。Example At the bottom of a 70 mm inner diameter cylindrical beaker equipped with a stirrer,
A cathode copper plate with a diameter of 60 mm was installed. In this beaker, place electrolytic copper powder (Fukuda Metal Foil Powder Kogyo Co., Ltd.) pretreated with dilute hydrochloric acid.
CE-20) 15 g and nickel electrolyte 300
d (Nickel sulfate N・1SO4・7H20,240g
/ E, nickel chloride N i Cl 2.6H20,
45g/l! and boric acid (35 g/42).
陽極に直径１２ｍｍのニッケル棒を使用し、電流０．７
６Ａになるように電圧を調整して、下部にシリコーンゴ
ムを取り付けた攪拌翼で攪拌しながら連続的に６０分間
通電して電気メッキを行った七ころ、下記の如く陰極面
への金属微粉末の付着が減少したため、陰極における重
量増加は著しく減少した。A nickel rod with a diameter of 12 mm was used as the anode, and the current was 0.7.
Electroplating was carried out by adjusting the voltage to 6A and applying electricity continuously for 60 minutes while stirring with a stirring blade with silicone rubber attached to the bottom. Fine metal powder was deposited on the cathode surface as shown below. The weight gain at the cathode was significantly reduced due to the reduced deposition of .
なお比較例として、上記ワイピング手段を採用しない以
外は同一条件で電気メッキを行った。As a comparative example, electroplating was performed under the same conditions except that the above-mentioned wiping means was not employed.
得られた金属微粉末はいずれも黒灰赤色を示し、磁石に
吸着された。All of the obtained metal fine powders exhibited a blackish-gray red color and were attracted to the magnet.
本発明の金属微粉末の電気メッキ方法において、分散下
で陰極面をワイピイングすることにより、金属微粉末は
均一かつ効率よく電気メッキされる。In the method for electroplating fine metal powder of the present invention, the fine metal powder is uniformly and efficiently electroplated by wiping the cathode surface under dispersion.
特許出願人 冨士高分子株式会社Patent applicant: Fuji Polymer Co., Ltd.
Claims (1)
末を攪拌下で分散させながら電気メッキを行う際に、陰
極面を連続的または間欠的にワイピングすることを特徴
とする金属微粉末の電気メッキ方法。A method for electroplating fine metal powder, which comprises wiping the cathode surface continuously or intermittently during electroplating while dispersing fine metal powder under stirring in an electrolytic solution having an anode and a cathode. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11663890A JPH0413893A (en) | 1990-05-02 | 1990-05-02 | Method for electroplating fine metal powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11663890A JPH0413893A (en) | 1990-05-02 | 1990-05-02 | Method for electroplating fine metal powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0413893A true JPH0413893A (en) | 1992-01-17 |
Family
ID=14692160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11663890A Pending JPH0413893A (en) | 1990-05-02 | 1990-05-02 | Method for electroplating fine metal powder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0413893A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014514969A (en) * | 2011-04-01 | 2014-06-26 | イグス ゲゼルシャフト ミット ベシュレンクター ハフトゥング | Supply line guide system and robot equipped with the guide system |
-
1990
- 1990-05-02 JP JP11663890A patent/JPH0413893A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014514969A (en) * | 2011-04-01 | 2014-06-26 | イグス ゲゼルシャフト ミット ベシュレンクター ハフトゥング | Supply line guide system and robot equipped with the guide system |
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