JPH0413661A - Bisimide - Google Patents
BisimideInfo
- Publication number
- JPH0413661A JPH0413661A JP11165690A JP11165690A JPH0413661A JP H0413661 A JPH0413661 A JP H0413661A JP 11165690 A JP11165690 A JP 11165690A JP 11165690 A JP11165690 A JP 11165690A JP H0413661 A JPH0413661 A JP H0413661A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- solvent
- bisimide
- hydrocarbon solvent
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 3
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 3
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 abstract description 13
- 239000000463 material Substances 0.000 abstract description 9
- 150000001875 compounds Chemical class 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 150000004945 aromatic hydrocarbons Chemical class 0.000 abstract description 4
- 150000004985 diamines Chemical class 0.000 abstract description 4
- 239000002253 acid Substances 0.000 abstract description 3
- 150000008282 halocarbons Chemical class 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 239000002798 polar solvent Substances 0.000 abstract description 3
- 239000003054 catalyst Substances 0.000 abstract description 2
- 239000003733 fiber-reinforced composite Substances 0.000 abstract description 2
- 239000012778 molding material Substances 0.000 abstract description 2
- 238000007363 ring formation reaction Methods 0.000 abstract description 2
- 239000000565 sealant Substances 0.000 abstract description 2
- 230000002378 acidificating effect Effects 0.000 abstract 1
- 239000002519 antifouling agent Substances 0.000 abstract 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 abstract 1
- LMBFAGIMSUYTBN-MPZNNTNKSA-N teixobactin Chemical compound C([C@H](C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CO)C(=O)N[C@H](CCC(N)=O)C(=O)N[C@H]([C@@H](C)CC)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CO)C(=O)N[C@H]1C(N[C@@H](C)C(=O)N[C@@H](C[C@@H]2NC(=N)NC2)C(=O)N[C@H](C(=O)O[C@H]1C)[C@@H](C)CC)=O)NC)C1=CC=CC=C1 LMBFAGIMSUYTBN-MPZNNTNKSA-N 0.000 abstract 1
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 10
- 229920003192 poly(bis maleimide) Polymers 0.000 description 10
- -1 imide compound Chemical class 0.000 description 8
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 7
- 239000000047 product Substances 0.000 description 5
- 238000007259 addition reaction Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 150000003949 imides Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LPVHVQFTYXQKAP-YFKPBYRVSA-N (4r)-3-formyl-2,2-dimethyl-1,3-thiazolidine-4-carboxylic acid Chemical compound CC1(C)SC[C@@H](C(O)=O)N1C=O LPVHVQFTYXQKAP-YFKPBYRVSA-N 0.000 description 2
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 2
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 238000005698 Diels-Alder reaction Methods 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000004643 cyanate ester Substances 0.000 description 2
- 150000001913 cyanates Chemical class 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- AGULWIQIYWWFBJ-UHFFFAOYSA-N 3,4-dichlorofuran-2,5-dione Chemical compound ClC1=C(Cl)C(=O)OC1=O AGULWIQIYWWFBJ-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- IIXNKBBKGWBNKX-UHFFFAOYSA-N 4-amino-2-[10-(5-amino-2-carboxyphenyl)decyl]benzoic acid Chemical compound NC(C=C1)=CC(CCCCCCCCCCC(C=C(C=C2)N)=C2C(O)=O)=C1C(O)=O IIXNKBBKGWBNKX-UHFFFAOYSA-N 0.000 description 1
- DLWIMUOEHZSOKS-UHFFFAOYSA-N 4-amino-2-[2-(5-amino-2-carboxyphenyl)ethyl]benzoic acid Chemical compound C1=CC(=C(C=C1N)CCC2=C(C=CC(=C2)N)C(=O)O)C(=O)O DLWIMUOEHZSOKS-UHFFFAOYSA-N 0.000 description 1
- OQZAVTUROJCAQX-UHFFFAOYSA-N 4-amino-2-[6-(5-amino-2-carboxyphenyl)hexyl]benzoic acid Chemical compound NC(C=C1)=CC(CCCCCCC(C=C(C=C2)N)=C2C(O)=O)=C1C(O)=O OQZAVTUROJCAQX-UHFFFAOYSA-N 0.000 description 1
- NHFKECPTBZZFBC-UHFFFAOYSA-N 4-amino-3-methylbenzoic acid Chemical compound CC1=CC(C(O)=O)=CC=C1N NHFKECPTBZZFBC-UHFFFAOYSA-N 0.000 description 1
- 229940086681 4-aminobenzoate Drugs 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 229940064734 aminobenzoate Drugs 0.000 description 1
- 239000000010 aprotic solvent Substances 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- SOXAGEOHPCXXIO-DVOMOZLQSA-N menthyl anthranilate Chemical compound CC(C)[C@@H]1CC[C@@H](C)C[C@H]1OC(=O)C1=CC=CC=C1N SOXAGEOHPCXXIO-DVOMOZLQSA-N 0.000 description 1
- 229960002248 meradimate Drugs 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229930006978 terpinene Natural products 0.000 description 1
- 150000003507 terpinene derivatives Chemical class 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Pyrrole Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Epoxy Resins (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、積層板、繊維強化複合材料、摺動材料、成形
材料、電子部品封止剤および保護塗料、レジスト材、導
電ペースト等用の樹脂材料とじて有用な可視性に優れた
、新規なビスイミド化合物を提供するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is applicable to laminates, fiber-reinforced composite materials, sliding materials, molding materials, electronic component sealants and protective coatings, resist materials, conductive pastes, etc. The present invention provides a novel bisimide compound with excellent visibility that is useful as a resin material.
従来、成形が容易である付加重合型のビスイミドとして
、4.4′−ジアミノジフェニルメタンと無水マレイン
酸から得られるビスマレイミドが使用されている。しか
し、このビスマレイミドは、般に耐熱性の点では優れて
いるが、成形品は脆く、成形用樹脂としての目的には実
用的でない。Bismaleimide obtained from 4,4'-diaminodiphenylmethane and maleic anhydride has conventionally been used as an addition polymerization type bisimide that is easy to mold. However, although this bismaleimide is generally excellent in terms of heat resistance, the molded product is brittle and is not practical as a molding resin.
さらに、汎用溶剤に溶解しにくいため、作業性に劣るな
どの欠点がある。また近年、可撓性を改良した種々のビ
スマレイミドが提案されている(特開昭62−1677
60号、同62−167777号公報)。Furthermore, it has drawbacks such as poor workability because it is difficult to dissolve in general-purpose solvents. In addition, in recent years, various bismaleimides with improved flexibility have been proposed (Japanese Patent Application Laid-Open No. 1677-1989
No. 60, No. 62-167777).
しかしながら、前記ビスマレイミド類は可視性は改良さ
れるが、溶剤に対する溶解性は従来のビスマレイミドと
変わらないので、その利用はおのずから限定されていた
。However, although the visibility of the bismaleimides is improved, their solubility in solvents is the same as that of conventional bismaleimides, so their use has naturally been limited.
本発明は、これらの問題点を解決するためになされたも
のであり、可撓性および溶剤に対する溶解性を改良しよ
うとするものである。The present invention was made to solve these problems, and aims to improve flexibility and solubility in solvents.
本発明者らは、上記目的を達成するため鋭意検討を行っ
た結果、次の新規なイミド化合物が従来のビスマレイミ
ドと比敦して、可撓性および溶剤に対する溶解性を改良
するのに好ましい樹脂用原料であることを見いだした。As a result of intensive studies to achieve the above object, the present inventors found that the following new imide compound is preferable for improving flexibility and solvent solubility compared to conventional bismaleimide. It was discovered that it is a raw material for resin.
すなわち本発明は、下記一般式(1)で示されるビスイ
ミド化合物を提供するものである。That is, the present invention provides a bisimide compound represented by the following general formula (1).
〔式中、Dは重合可能な不飽和二重結合を少なくとも1
個有する炭素数2〜24のアルキレン基であり、Rは水
素原子、ハロゲン原子または炭素数1〜4のアルキル基
もしくはアルコキシ基を示す。[In the formula, D has at least one polymerizable unsaturated double bond
It is an alkylene group having 2 to 24 carbon atoms, and R represents a hydrogen atom, a halogen atom, or an alkyl group or an alkoxy group having 1 to 4 carbon atoms.
nは2〜15の整数である〕 以下、本発明をさらに詳細に説明する。n is an integer from 2 to 15] The present invention will be explained in more detail below.
本発明は、上記の一般式(I)で表されるビスイミドを
提供するものであるが、これは、例えば下記一般式(I
f)
〔式中、Rおよびnは前記に同じ〕
で示されるジアミンと下記一般式(III)δ
〔式中、Dは前記に同じ〕
で示される不飽和ジカルボン酸無水物を有機溶媒中で付
加反応させて、下記一般式(IV)〔式中、R,Dおよ
びnは前記に同じ〕で示されるビスアミド酸を得、この
ビスアミド酸を脱水閉環することにより、前記一般式(
1)で示されるビスイミド化合物を得ることができる。The present invention provides a bisimide represented by the above general formula (I).
f) [In the formula, R and n are the same as above] A diamine represented by the following general formula (III) δ [In the formula, D is the same as above] A diamine represented by the following general formula (III) δ [In the formula, D is the same as above] An addition reaction is carried out to obtain a bisamic acid represented by the following general formula (IV) [wherein R, D and n are the same as above], and this bisamic acid is dehydrated and ring-closed to obtain the general formula (IV).
The bisimide compound shown in 1) can be obtained.
(ジアミン)
本発明のビスイミド化合物に用いられる、前記一般式(
It)で示されるジアミン化合物としては、例えば、ジ
メチレン−ビス(4−アミノベンゾアート)、トリメチ
レン−ビス(4−アミノベンゾアート)、ヘキサメチレ
ン−ビス(4−アミノベンゾアート)、デカメチレン−
ビス(4−アミノベンゾアート)、テトラメチレン(3
〜アミノベンゾアート)、テトラメチレン(2−アミノ
ベンゾアート)、テトラメチレン(3−メチル−4−ア
ミノベンゾアート)等が挙げられる。(Diamine) Used in the bisimide compound of the present invention, the general formula (
Examples of the diamine compound represented by It) include dimethylene-bis(4-aminobenzoate), trimethylene-bis(4-aminobenzoate), hexamethylene-bis(4-aminobenzoate), and decamethylene-bis(4-aminobenzoate).
Bis(4-aminobenzoate), tetramethylene(3
~aminobenzoate), tetramethylene (2-aminobenzoate), tetramethylene (3-methyl-4-aminobenzoate), and the like.
(不飽和ジカルボン酸無水物)
前記一般式(1)で示される不飽和ジカルボン酸無水物
は、無水マレイン酸、無水イタコン酸、無水ピロシコン
酸、無水シトラコン酸、無水ジクロロマレイン酸および
これら不飽和カルボン酸無水物とジエン類のディールズ
・アルダ−反応生成物、例えば、シクロペンタジェン、
フラン、アロオシメンおよびテルピネンと無水マレイン
酸とのディールズ・アルダ−反応生水物等である。(Unsaturated dicarboxylic anhydride) The unsaturated dicarboxylic anhydride represented by the general formula (1) includes maleic anhydride, itaconic anhydride, pyrosiconic anhydride, citraconic anhydride, dichloromaleic anhydride, and these unsaturated carboxylic anhydrides. Diels-Alder reaction products of acid anhydrides and dienes, such as cyclopentadiene,
These include Diels-Alder reaction product hydrates of furan, allocimene, and terpinene with maleic anhydride.
(イミドの生成)
本発明のビスイミド化合物は、従来の無水酢酸等の脱水
剤を用いてイミド化する公知の方法で製造することが可
能であるが、特開平1−211563号公報記載の方法
が好ましい。(Production of imide) The bisimide compound of the present invention can be produced by a known method of imidization using a conventional dehydrating agent such as acetic anhydride, but the method described in JP-A-1-211563 is preferable.
具体的には、芳香族ジアミン化合物1モルに対し、不飽
和ジカルボン酸無水物を2〜2.6モル用い、芳香族炭
化水素溶媒と非プロトン性極性溶媒の混合溶媒中で付加
反応させ、酸性触媒の存在下、80〜200℃の温度範
囲で0.5〜10時間脱水閉環反応を行う。Specifically, 2 to 2.6 moles of unsaturated dicarboxylic acid anhydride are used for 1 mole of an aromatic diamine compound, and an addition reaction is carried out in a mixed solvent of an aromatic hydrocarbon solvent and an aprotic polar solvent. The dehydration ring-closing reaction is carried out in the presence of a catalyst at a temperature range of 80 to 200°C for 0.5 to 10 hours.
芳香族炭化水素溶媒としては、例えばベンゼン、トルエ
ン、キシレン等が用いられ、ハロゲン化炭化水素溶媒と
しては、例えばクロロホルム、1,2−ジクロロエタン
、クロルベンゼン等が用いられる。非プロトン性極性溶
媒としては、N、N−ジメチルホルムアミド、N、N−
ジメチルアセトアミド、ジメチルスルオキシド、N−メ
チル−2−とロリドン等が使用できる。混合溶媒中、芳
香族炭化水素溶媒またはハロゲン化炭化水素溶媒と非プ
ロトン性溶媒との混合は、50 : 50〜99コ1程
度である。この混合溶媒は通常、原料に対して1〜10
重量倍で使用される。As the aromatic hydrocarbon solvent, for example, benzene, toluene, xylene, etc. are used, and as the halogenated hydrocarbon solvent, for example, chloroform, 1,2-dichloroethane, chlorobenzene, etc. are used. As the aprotic polar solvent, N,N-dimethylformamide, N,N-
Dimethylacetamide, dimethyl sulfoxide, N-methyl-2- and lolidone, etc. can be used. In the mixed solvent, the aromatic hydrocarbon solvent or halogenated hydrocarbon solvent and the aprotic solvent are mixed at a ratio of about 50:50 to 99:1. This mixed solvent is usually 1 to 10%
Used in double weight.
反応終了後、貧溶剤を反応生成物中に加えてビスイミド
を析出させ、次いでr別、洗浄、乾燥させることにより
製品が得られる。After the reaction is completed, a poor solvent is added to the reaction product to precipitate bisimide, followed by separation, washing, and drying to obtain a product.
本発明の実施により得られるビスイミドは、単独で加熱
溶融することにより強靭な硬化物を与える。また、架橋
反応を促進する目的で、種々の重合開始剤および触媒を
添加することも可能である。The bisimide obtained by carrying out the present invention gives a tough cured product by heating and melting it alone. Furthermore, various polymerization initiators and catalysts can be added for the purpose of promoting the crosslinking reaction.
また、公知のマレイミドと併用することも可能であり、
アミン類およびアリルフェノール類との付加反応による
硬化やエポキシ樹脂、ビニル化合物、アクリレート、シ
アン酸エステル等との配合により、目的に応じた変成を
行うことも可能であり、広範な用途で利用されることが
できる。It can also be used in combination with known maleimides,
It can be modified according to the purpose by curing through addition reactions with amines and allylphenols, or by blending with epoxy resins, vinyl compounds, acrylates, cyanate esters, etc., and is used in a wide range of applications. be able to.
以下、実施例により本発明を具体的に説明する。 Hereinafter, the present invention will be specifically explained with reference to Examples.
叉1」L」2
滴下ロート、温度計、撹拌機および水分離器の付いた5
00e+lの四ツロフラスコに、トリメチレン−ビス(
4−アミノベンゾアート)44g(0,14モル)およ
びクロルベンゼン260gを仕込み、撹拌した。1"L"2 5 with dropping funnel, thermometer, stirrer and water separator
Add trimethylene-bis(
4-aminobenzoate) and 260 g of chlorobenzene were charged and stirred.
一方、無水マレイン酸30.2y(0,308モル)を
クロルベンゼン50gおよびN−メチル−2−ピロリド
ン11gに溶解し、前記四ツロフラスコ内に20〜40
℃の温度範囲で30分間かけて滴下した。On the other hand, 30.2 y (0,308 mol) of maleic anhydride was dissolved in 50 g of chlorobenzene and 11 g of N-methyl-2-pyrrolidone, and 20 to 40
The mixture was added dropwise over a period of 30 minutes at a temperature range of .degree.
滴下終了後、パラトルエンスルホン酸2゜7gを添加し
た後昇温し、温度132℃に保ち4時間反応を遂行した
。この間に生成した水はクロルベンゼンと共に系外に留
去した。After the dropwise addition was completed, 2.7 g of para-toluenesulfonic acid was added, and the temperature was raised, and the reaction was carried out for 4 hours while maintaining the temperature at 132°C. The water produced during this time was distilled out of the system together with chlorobenzene.
このあと、クロルベンゼンを減圧下40〜80℃の温度
範囲で留去した。析出したビスマレイミドにメタノール
400gを入れ、スラリーとして取り出し枦別、水洗、
乾燥し、黄褐色のビスマレイミド62.を得た。収率9
3.4%、融点127〜131℃であった。Thereafter, chlorobenzene was distilled off under reduced pressure in a temperature range of 40 to 80°C. Add 400 g of methanol to the precipitated bismaleimide, take out the slurry, separate, wash with water,
Dry, yellow-brown bismaleimide62. I got it. Yield 9
3.4%, melting point 127-131°C.
この化合物の赤外吸収スペクトルを第1図に示し、同じ
く核磁気共鳴スペクトルを第2図に示す。The infrared absorption spectrum of this compound is shown in FIG. 1, and the nuclear magnetic resonance spectrum is shown in FIG. 2.
第1図においては、1710cw−’にイミド環に由来
する吸収がある。In FIG. 1, there is an absorption derived from the imide ring at 1710 cw-'.
δ
第2図においては、6.8p9−にイミド環のビニルプ
ロトンに由来するスペクトルがある。δ In Figure 2, there is a spectrum derived from the vinyl proton of the imide ring at 6.8p9-.
ビス ≧ド ム の
実施例1で得られたビスマレイミド23.79および4
.4′−ジアミノジフェニルメタン4.0gを温度14
0℃で均一になるまで撹拌した。Bismaleimide 23.79 and 4 obtained in Example 1 with bis≧dom
.. 4.0 g of 4'-diaminodiphenylmethane at a temperature of 14
The mixture was stirred at 0°C until homogeneous.
次いで、金属の型内に流し込み、180℃で5時間、次
いで250℃で5時間硬化を行い、縦127I、横12
.7ms、厚さ6.4+uiの強靭な硬化物を得た。Next, it was poured into a metal mold and cured at 180°C for 5 hours and then at 250°C for 5 hours.
.. A tough cured product with a time of 7 ms and a thickness of 6.4+ui was obtained.
mニ
ジアミンをヘキサメチレン−ビス(3−アミノベンゾア
ート)に変える以外は実施例1と同様の操作を行い、黄
色のビスマレイミド66.19を得た。The same procedure as in Example 1 was performed except that m-nidiamine was changed to hexamethylene-bis(3-aminobenzoate) to obtain yellow bismaleimide 66.19.
収率91.5%、融点81〜84℃であった。The yield was 91.5%, and the melting point was 81-84°C.
本発明の実施により得られるビスイミドは単独で加熱溶
融することにより強靭な硬化物を与える。The bisimide obtained by carrying out the present invention gives a tough cured product by heating and melting it alone.
また、架橋反応を促進する目的で、種々の重合開始剤お
よび触媒を添加することも可能である。また、公知のマ
レイミドと併用することも可能であり、アミン類および
アリルフェノール類との付加反応による硬化や、エポキ
シ樹脂、ビニル化合物、アクリレート、シアン酸エステ
ル等との配合により、目的に応じた変成を行うことも可
能である。Furthermore, various polymerization initiators and catalysts can be added for the purpose of promoting the crosslinking reaction. In addition, it can be used in combination with known maleimides, and can be modified according to the purpose by curing by addition reaction with amines and allylphenols, or by blending with epoxy resins, vinyl compounds, acrylates, cyanate esters, etc. It is also possible to do this.
第1図は実施例1において得られたビスマレイミドの赤
外線吸収スペクトルであり、第2図は核磁気共鳴スペク
トルである。FIG. 1 is an infrared absorption spectrum of bismaleimide obtained in Example 1, and FIG. 2 is a nuclear magnetic resonance spectrum.
Claims (1)
個有する炭素数2〜24のアルキレン基であり、Rは水
素原子、ハロゲン原子または炭素数1〜4のアルキル基
もしくはアルコキシ基を示す。 nは2〜15の整数である〕 で示されるビスイミド。[Claims] General formula ▲ Numerical formula, chemical formula, table, etc. ▼ [In the formula, D represents at least one polymerizable unsaturated double bond]
It is an alkylene group having 2 to 24 carbon atoms, and R represents a hydrogen atom, a halogen atom, or an alkyl group or an alkoxy group having 1 to 4 carbon atoms. n is an integer of 2 to 15] A bisimide represented by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11165690A JPH0413661A (en) | 1990-05-01 | 1990-05-01 | Bisimide |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11165690A JPH0413661A (en) | 1990-05-01 | 1990-05-01 | Bisimide |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0413661A true JPH0413661A (en) | 1992-01-17 |
Family
ID=14566858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11165690A Pending JPH0413661A (en) | 1990-05-01 | 1990-05-01 | Bisimide |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0413661A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017071738A (en) * | 2015-10-09 | 2017-04-13 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
-
1990
- 1990-05-01 JP JP11165690A patent/JPH0413661A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017071738A (en) * | 2015-10-09 | 2017-04-13 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
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