JPH04135018U - Chip-shaped piezoelectric components - Google Patents

Abstract

(57) [Summary] [Purpose] Increase added value and increase packaging density. [Structure] On the first and second main surfaces of a rectangular piezoelectric substrate,
a piezoelectric element provided with a vibrating electrode, an extraction electrode, and a lead electrode connecting the vibrating electrode and the extraction electrode; a sealing substrate surrounding the piezoelectric element; In a chip-shaped piezoelectric component consisting of an external electrode connected to an extraction electrode, a circuit network connected to the external electrode of the sealing substrate to form a Colpitts-type oscillation circuit was provided and integrated.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention is a chip-shaped piezoelectric component that incorporates a circuit network into a piezoelectric resonator to create a composite component. For example, a chip having a circuitry for forming a Colpitts-type oscillator circuit. Regarding piezoelectric components.

0002

[Conventional technology]

As an example of a chip-shaped piezoelectric component, those shown in FIGS. 9 and 10 are known. There is. This chip-shaped piezoelectric component 21 has a piezoelectric element 22 sandwiched between sealing substrates 24 and 25. It is formed by laminating and integrating and providing external electrodes 26, 27, 28 on the surface of this part. Ru. This piezoelectric component 21 is formed by an oscillator E formed by a piezoelectric element 22 and electrodes 26 and 28. capacitor C1 formed by the electrodes 27 and 28, and a capacitor C2 formed by the electrodes 27 and 28. It is becoming more and more. The piezoelectric element 22, as shown in FIG. A vibrating electrode 29 and an extraction electrode 31 are provided on the main surface (front surface), and these two electrodes are connected. A lead electrode 33 is provided on the second main surface (back surface), and a lead electrode 33 is provided on the second main surface (back surface) to correspond to the vibration electrode 29. A vibrating electrode 30 is provided along the side opposite to the extraction electrode 31, and It is configured by providing an electrode 32 and a lead electrode 34 connecting these two electrodes. Ru. The circuit components shown by dotted lines forming the Colpitts type oscillation circuit shown in FIG. used as a product. In addition, piezoelectric components that have a separate capacitor or coil built into the piezoelectric element are also known. It is.

0003

[Problem that the idea aims to solve]

The conventional chip-shaped piezoelectric components mentioned above have a separate built-in capacitor or coil. However, other parts must be used for the resistor and coil, and they cannot be used as chip-shaped piezoelectric components. There is a limit to the added value of the It was not possible to increase the density very much.

0004 The present invention has been made in view of the circumstances of the above-mentioned prior art, and has added value. It is possible to easily form Colpitts-type oscillator circuits and increase packaging density. The purpose is to provide chip-shaped piezoelectric components.

[0005]

[Means to solve the problem]

The chip-shaped piezoelectric component according to the present invention is formed on the first main surface and the second main surface of a rectangular piezoelectric substrate. , a vibrating electrode, an extraction electrode, and connecting the vibrating electrode and the extraction electrode. A piezoelectric element each provided with a lead electrode, and a sealing substrate surrounding the piezoelectric element. , and an external electrode connected to the extraction electrode provided on the surface where these are integrated. In a chip-shaped piezoelectric component that is connected to the external electrode of the above-mentioned sealing substrate, A feature is that a circuit network forming an oscillation circuit is provided and integrated.

[0006]

[Effect]

According to the chip-shaped piezoelectric component according to the present invention, there is a gap between the piezoelectric element and the external electrode of the sealing substrate. A circuit network is provided and integrated to form a Colpitts-type oscillator circuit. As a result, the components forming a Colpitts-type oscillator circuit can be obtained on one chip. It is possible to increase the packaging density and improve the packaging productivity.

[0007]

【Example】

Hereinafter, embodiments of the present invention will be described based on the drawings. 1 and 2 are for explaining a chip-shaped piezoelectric component according to a first embodiment of the present invention. This is a diagram. In the figure, 1 is a chip-shaped piezoelectric component, 2 is a piezoelectric element, and this piezoelectric element 2 is It is configured with electrodes provided on the first main surface (front surface) and the second main surface (back surface) as follows. ing. The piezoelectric resonator 2 has a vibrating electrode 11 formed in the center of the surface of a rectangular piezoelectric substrate 3. , an extraction electrode 12 is formed on one side, and these two electrodes 11 and 12 are connected. A lead electrode 13 is provided. Also, on the other back side, there is a vibrating electric A vibrating electrode 14 is provided at a position facing the pole 11, and a pair opposite to the extraction electrode 12 is provided. An extraction electrode 15 is provided on the opposite side, and the vibration electrode 14 and the extraction electrode 15 are connected. A lead electrode 16 is provided.

[0008] Sealing substrates 4 and 5 are placed on the front and back surfaces of the piezoelectric element 2 configured in this way, respectively. They are layered around each other and integrated into a block. Table of this block External electrodes 6 and 7 are formed on the surface, and a resistance pattern R is connected to the external electrodes. is formed on the back surface of the sealing substrate 4. When laminating the piezoelectric element 2 and the sealing substrates 4 and 5 , by interposing an adhesive or the like so that each vibrating electrode 14 does not come into contact with the sealing substrates 4 and 5. There is a gap. Then, a chip-shaped piezoelectric component having the circuit configuration shown in FIG. 2 is constructed.

[0009] 3 and 4 are diagrams illustrating a second embodiment of the present invention. In this embodiment, the piezoelectric element 2 is the same as in the first embodiment. A sealing substrate 4 on which a resistance pattern R1 is formed is laminated on the surface side of the piezoelectric element 2 and bonded. Then, a sealing substrate 5 is laminated on the back side and bonded to form a block. this block In addition, external electrodes 6 and 7 are formed on the sides of the adjacent side from the opposing sides, and An external electrode 8a is formed by winding it in parallel in a band shape in the center, and between the external electrodes 6 and 8a, Capacitors C1 and C2 are formed between the external electrodes 7 and 8a, respectively, and the circuit shown in FIG. It is a chip-shaped piezoelectric component with the following configuration. When configured as in this example, a separate The chip-shaped piezoelectric component according to this example can be used as an inverter without combining a capacitor or the like. A Colpitts-type oscillator circuit can be formed by simply connecting the

0010 FIGS. 5 and 6 are diagrams explaining the third embodiment. In this embodiment, the piezoelectric element 2b is configured with electrodes provided on the front and back surfaces as follows. has been done. On the surface of the piezoelectric substrate 3, vibrating electrodes 11b, 11b and extraction electrodes 12b are provided. , 12b are provided, and are connected to each vibrating electrode 11b and each extraction electrode 12b to form a lead. An electrode 13b is provided. On the back side of the piezoelectric substrate 3, there is one vibrating electrode 1 facing the vibrating electrodes 11b, 11b. 4b is provided, and an extraction electrode 15b is formed in the middle part of one side, and the vibrating electrode 1 4b and a lead electrode 16b connected to the extraction electrode 15b. Ru.

[0011] On the outer surface of the sealing substrate 4 laminated on the front side of the piezoelectric substrate 3, external electrodes 6 are arranged parallel to each other in a band shape. , 7, and connection electrodes 8b, 9b are formed. Connect the external electrode 6 and the connection electrode 8b with the resistor pattern R1, and connect it to the extraction electrode 12b. Connected. Connect the external electrode 7 and the connection electrode 9b with the resistance pattern R2, and It is connected to the output electrodes 12b and 15b to form a chip-shaped piezoelectric component with an equivalent circuit shown in FIG. ing.

0012 7 and 8 are diagrams explaining a fourth embodiment of the present invention. In this embodiment, the piezoelectric element 2c has electrodes provided on the surface of the substrate 3 as follows. It is composed of Vibration electrodes 11c, 11c and extraction electrodes 12c, 12c are provided on the front side of the piezoelectric substrate 3. The vibration electrode 11c and the extraction electrode 12c are connected to form lead electrodes 13c, 13. c is provided. Each extraction electrode 12c is provided on the opposite side, respectively. There is. Further, on the back side of the piezoelectric substrate 3, a vibrating electrode 1 is provided opposite to the vibrating electrodes 11c, 11c. 4c and 14c are provided, and the extraction electrode 15c is not provided, and the extraction electrode 12c is not provided. Vibrating electrodes 14c, 14c and extraction electrode 15c are provided on one side of the sides. A lead electrode 16c is provided to connect the two.

[0013] An external electrode 6 provided on the sealing substrate 4 laminated on the front side of the piezoelectric element 2c, 7 are connected to form a coil pattern L. Between the external electrodes 6 and 7 of the sealing substrate 5 laminated on the back side, approximately parallel to these, An external electrode 8c is provided only on the surface side, and this external electrode 8c is connected to the extraction electrode 15c. Connected. Then, the piezoelectric element 2c and the sealing substrates 4 and 5 described above are laminated and integrated, as shown in FIG. It constitutes a chip-shaped piezoelectric component with the equivalent circuit shown in .

[0014] Note that the above resistor or coil is formed in a pattern on the front or back of one of the sealing substrates. Although an example has been shown, the resistor may be formed in the plane between the external electrodes. Also, resistance or Although we have shown an example in which one side of the coil is formed, it is also possible to form both sides, or to connect them with each other. Two or more types may be formed by combining the capacitor with the capacitor.

[0015]

[Effect of the idea]

As described above, according to the chip-shaped piezoelectric component according to the present invention, the oscillation element and the resistor or core are connected to each other. Since the file is integrated into one chip, it can be made into a small composite component and the packaging density can be reduced. can be improved. Additionally, a Colpitts-type oscillator circuit can be easily formed. can.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of a chip-shaped piezoelectric component according to the present invention.

FIG. 2 is an equivalent circuit diagram according to this embodiment.

FIG. 3 is an exploded perspective view illustrating a second embodiment of the present invention.

FIG. 4 is an equivalent circuit diagram of this embodiment.

FIG. 5 is an exploded perspective view illustrating a third embodiment of the present invention.

FIG. 6 is an equivalent circuit diagram of this embodiment.

FIG. 7 is an exploded perspective view illustrating a fourth embodiment of the present invention.

FIG. 8 is an equivalent circuit diagram of this embodiment.

FIG. 9 is a perspective view of a conventional chip-shaped piezoelectric component.

FIG. 10 is a plan view showing a piezoelectric element constituting a conventional chip-shaped piezoelectric component.

FIG. 11 is an equivalent circuit diagram showing a configuration example of a circuit using a conventional chip-shaped piezoelectric component.

[Explanation of symbols]

1 Chip-shaped piezoelectric component 2 Piezoelectric element 3 Piezoelectric substrate 4,5 Sealing substrate 11,14 Vibrating electrode 12,15 Extraction electrode 13,16 Lead electrode

Claims (1)

[Scope of utility model registration request] 1. A piezoelectric element comprising a vibrating electrode, an extraction electrode, and a lead electrode connecting the vibrating electrode and the extraction electrode on a first principal surface and a second principal surface of a rectangular piezoelectric substrate, respectively; A chip-shaped piezoelectric component comprising a sealing substrate surrounding the piezoelectric element and an external electrode connected to the extraction electrode provided on the surface of the piezoelectric element, which is connected to the external electrode of the sealing substrate to form a Colpitts-shaped piezoelectric component. A chip-shaped piezoelectric component characterized by being integrated with a circuit network that forms an oscillation circuit.