JPH04130828U - Packing pasting mold equipment - Google Patents
Packing pasting mold equipmentInfo
- Publication number
- JPH04130828U JPH04130828U JP3764191U JP3764191U JPH04130828U JP H04130828 U JPH04130828 U JP H04130828U JP 3764191 U JP3764191 U JP 3764191U JP 3764191 U JP3764191 U JP 3764191U JP H04130828 U JPH04130828 U JP H04130828U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- upper mold
- packing
- lower mold
- directly below
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012856 packing Methods 0.000 title claims abstract description 18
- 238000002360 preparation method Methods 0.000 abstract description 3
- 238000007731 hot pressing Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
(57)【要約】
【目的】成形品にパッキングを貼り付ける金型装置にお
いて、作業性と安全性を向上させ、成形品とパッキング
の位置ずれも防止する。
【構成】一つの上型１と、一対の連結された下型２，
２’と、上型１の直下へ前記一対の下型２，２’を交互
に移動させる下型の移動装置３を備えている。下型２，
２’の底板４，４’は、下型本体とは別体であり位置決
め用のピン５，５’を立てたものである。上型の直下に
位置した下型には、ヒータが当接する。下型２を上型の
直下に移動させると、下型２’は上型１の直下から外れ
た位置にくる。上型１が邪魔にならないここで仕込みや
製品の取り出しをする。成形品とパッキングは、位置決
め用のピン５，５’に通してあり位置ずれを防ぐことが
できる。
(57) [Summary] [Purpose] To improve workability and safety in a mold device that attaches packing to a molded product, and to prevent misalignment between the molded product and the packing. [Structure] One upper mold 1, a pair of connected lower molds 2,
2', and a lower mold moving device 3 that alternately moves the pair of lower molds 2, 2' directly below the upper mold 1. Lower mold 2,
The bottom plates 4, 4' of 2' are separate from the lower mold body, and have positioning pins 5, 5' erected thereon. A heater comes into contact with the lower mold located directly below the upper mold. When the lower mold 2 is moved directly below the upper mold, the lower mold 2' comes to a position away from directly under the upper mold 1. Preparation and product removal are done here where the upper mold 1 does not get in the way. The molded product and packing are passed through positioning pins 5, 5' to prevent misalignment.
Description
【０００１】0001
本考案は、成形品表面に熱圧によりパッキングを貼り付ける金型装置に関する 。 This invention relates to a mold device that attaches packing to the surface of a molded product using heat and pressure. .
【０００２】0002
従来、パッキングを貼り付ける金型装置は、上型の直下に下型が位置し、下型 に成形品とパッキングを仕込んで上型を降下させ、熱と圧力により成形品とパッ キングの一体化を行なっている。仕込みのときにも製品を金型から取り出すとき にも、下型の上方には上型がいつも位置している。 Conventionally, in mold equipment for pasting packing, the lower mold is located directly below the upper mold; The molded product and packing are placed in the mold, the upper mold is lowered, and the molded product and packing are sealed using heat and pressure. We are unifying the king. During preparation and when removing the product from the mold However, the upper mold is always located above the lower mold.
【０００３】0003
上記の金型装置では、いつも下型の上方に上型が位置しているので作業性が悪 く、安全性の面からも好ましいものではない。また、成形品とパッキングは、下 形内に重ねて置くだけであるので熱圧のときに位置ずれを起こしやすい。 本考案が解決しようとする課題は、上記パッキングを貼り付ける金型装置にお いて、作業性と安全性を向上させ、成形品とパッキングの位置ずれも防止するこ とである。 In the above mold equipment, the upper mold is always located above the lower mold, resulting in poor workability. This is not desirable from a safety standpoint. In addition, molded products and packing are Since they are simply placed one on top of the other in the shape, they tend to shift during hot pressing. The problem that this invention aims to solve is the mold equipment that attaches the above packing. This improves work efficiency and safety, and prevents misalignment of the molded product and packing. That is.
【０００４】0004
上記課題を解決するために、本考案に係る金型装置は、次のように構成したも のである。すなわち、一つの上型と、一対の連結された下型と、上型の直下へ前 記一対の下型を交互に移動させる下型の移動装置を備える。下型の底板は、下型 の本体とは別体であり位置決め用のピンを立てたものとなっている。また、上型 の直下に位置した下型には、ヒータが当接するようになっている。 In order to solve the above problems, the mold device according to the present invention has the following configuration. It is. In other words, one upper mold, a pair of connected lower molds, and the front mold directly below the upper mold. A lower mold moving device is provided for alternately moving the pair of lower molds. The bottom plate of the lower mold is It is separate from the main body and has pins for positioning. Also, the upper mold The heater is brought into contact with the lower mold located directly below the mold.
【０００５】[0005]
上記の金型装置では、一対の連結された下型の一方を上型の直下に移動させる と、他方の下型は上型の直下から外れた位置にくる。上型が邪魔にならないここ で仕込みや製品の取り出しをする。下型に仕込んだ成形品とパッキングは、位置 決め用のピンに通すことにより貼り付け作業時に両者の位置ずれを防ぐことがで きる。 In the above mold device, one of the pair of connected lower molds is moved directly below the upper mold. Then, the other lower mold is positioned away from directly under the upper mold. This is where the upper mold does not get in the way. Prepare and take out products. The molded product and packing placed in the lower mold are By passing it through the fixing pin, you can prevent the two from shifting during the pasting process. Wear.
【０００６】[0006]
図１は、本考案に係る一実施例を示したものである。 上型１はヒータを内蔵しており、昇降するようになっている。その下方には、 一対の連結された下型２，２’があり、移動装置３により交互に上型１の直下に 移動する。移動装置３は、エアシリンダである。下型２，２’の底板４，４’は 、本体とは別体となっており、位置決め用のピン５，５’を立てたものである。 一方の下型２に成形品とパッキングを仕込む。両者は、位置決め用ピン５に通 して下型２に仕込んで位置合わせをし、その後の位置ずれもこれによって防止さ れる。下型２を移動装置３により上型１の直下に移動させると、上型１が下降し てきて、重ねた成形品とパッキングを加圧する。そして、上型１に内蔵のヒータ と下型１に接するヒータ６によって加熱もされる。 FIG. 1 shows an embodiment of the present invention. The upper mold 1 has a built-in heater and is designed to move up and down. Below that, There is a pair of connected lower molds 2, 2', which are alternately placed directly under the upper mold 1 by a moving device 3. Moving. The moving device 3 is an air cylinder. The bottom plates 4, 4' of the lower molds 2, 2' are , is separate from the main body, and has pins 5, 5' for positioning. The molded product and packing are placed in one of the lower molds 2. Both pass through the positioning pin 5. Then place it in the lower mold 2 and align it, and this will prevent any subsequent misalignment. It will be done. When the lower mold 2 is moved directly below the upper mold 1 by the moving device 3, the upper mold 1 is lowered. Then, pressurize the stacked molded products and packing. And the heater built into the upper mold 1 It is also heated by the heater 6 in contact with the lower mold 1.
【０００７】 この間、下型２’は、上型１の下方から外れた位置にあり、この位置で下型２ ’に別の成形品とパッキングを仕込んで次の貼り合わせ作業に備える。下型２で の貼り合わせが終わると、上型１が上昇し、移動装置３により下型２’を上型１ の直下に移動させる。これに伴って、下型２は上型１の下方から外れた位置にく るので、ここで、貼り合わせた製品の下型２からの取り出しをし、次の仕込みを する。このとき、下型２’へは上型１が降下してきており、貼り合わせ作業を行 っている。[0007] During this time, the lower mold 2' is in a position removed from below the upper mold 1, and in this position the lower mold 2' ’ to prepare for the next bonding work by loading another molded product and packing. With lower mold 2 When the pasting is finished, the upper mold 1 rises, and the moving device 3 moves the lower mold 2' to the upper mold 1. Move it directly below. Along with this, the lower mold 2 is not placed in a position that is removed from the bottom of the upper mold 1. At this point, remove the pasted product from the lower mold 2 and prepare for the next step. do. At this time, the upper mold 1 has descended to the lower mold 2', and the bonding work is being carried out. ing.
【０００８】[0008]
上述のように、本考案に係る金型装置では、一方の下型が貼り合わせ作業に使 用されているときに、上型で邪魔にならないところで、他方の金型からの貼り合 わせた製品の取り出しと、次の貼り合わせのために下型への成形品とパッキング の仕込みをすることができるので、作業性がよく効率も高い。また、底板に立て たピンにより、成形品とパッキングの貼り合わせの位置ずれも防止することがで きる。底板は下型の本体とは別体になっているので、成形品の形状が変わったと きにはそれにピンの位置を合わせた別の底板と取り替えるだけで段取り替えが済 み、都合がよい。 As mentioned above, in the mold device according to the present invention, one of the lower molds is used for bonding work. When the bonding from the other mold is being carried out, the Taking out the molded product and packing it into the lower mold for the next bonding. It is possible to make preparations, so the workability is good and efficiency is high. Also, it can be placed on the bottom plate. The pins also prevent misalignment when bonding the molded product and packing. Wear. The bottom plate is separate from the main body of the lower mold, so if the shape of the molded product changes, When necessary, you can easily change the setup by simply replacing it with another bottom plate with the pins aligned. Well, it's convenient.
【図１】本考案に係る実施例を示す金型装置の正面図で
ある。FIG. 1 is a front view of a mold device showing an embodiment of the present invention.
１は上型 ２，２’は下型 ３は移動装置 ４，４’は底板 ５，５’はピン ６はヒータ 1 is the upper mold 2, 2' is the lower mold 3 is a moving device 4, 4' is the bottom plate 5, 5' are pins 6 is the heater
Claims (1)
上型の直下へ前記一対の下型を交互に移動させる下型の
移動装置と、下型とは別体であり位置決め用のピンを立
てた下型の底板と、上型の直下に位置した下型に当接す
るヒータを備えたパッキングの貼り付け金型装置。Claim 1: One upper mold, a pair of connected lower molds,
a lower mold moving device that alternately moves the pair of lower molds directly below the upper mold; a bottom plate of the lower mold that is separate from the lower mold and has positioning pins; and a bottom plate located directly below the upper mold. A packing pasting mold device equipped with a heater that comes into contact with the lower mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3764191U JPH04130828U (en) | 1991-05-28 | 1991-05-28 | Packing pasting mold equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3764191U JPH04130828U (en) | 1991-05-28 | 1991-05-28 | Packing pasting mold equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04130828U true JPH04130828U (en) | 1992-12-01 |
Family
ID=31919317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3764191U Pending JPH04130828U (en) | 1991-05-28 | 1991-05-28 | Packing pasting mold equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04130828U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5330726A (en) * | 1976-09-02 | 1978-03-23 | Fuji Electric Co Ltd | Slip frequency detector for induction motor |
| JPS53119019A (en) * | 1977-03-28 | 1978-10-18 | Kawai Musical Instr Mfg Co | Electronic musical instrument with oneefinger accompaniment key |
| JPS5866662A (en) * | 1981-10-12 | 1983-04-20 | Hitachi Ltd | Correcting method and device for deflection of metal bond diamond grindstone by electrical discharge machining |
| JPS61191786A (en) * | 1985-02-19 | 1986-08-26 | ピルキントン・ブラザーズ・ピーエルシー | Hermetically closed type double glass unit |
-
1991
- 1991-05-28 JP JP3764191U patent/JPH04130828U/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5330726A (en) * | 1976-09-02 | 1978-03-23 | Fuji Electric Co Ltd | Slip frequency detector for induction motor |
| JPS53119019A (en) * | 1977-03-28 | 1978-10-18 | Kawai Musical Instr Mfg Co | Electronic musical instrument with oneefinger accompaniment key |
| JPS5866662A (en) * | 1981-10-12 | 1983-04-20 | Hitachi Ltd | Correcting method and device for deflection of metal bond diamond grindstone by electrical discharge machining |
| JPS61191786A (en) * | 1985-02-19 | 1986-08-26 | ピルキントン・ブラザーズ・ピーエルシー | Hermetically closed type double glass unit |
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