JPH0412693U - - Google Patents
Info
- Publication number
- JPH0412693U JPH0412693U JP5300090U JP5300090U JPH0412693U JP H0412693 U JPH0412693 U JP H0412693U JP 5300090 U JP5300090 U JP 5300090U JP 5300090 U JP5300090 U JP 5300090U JP H0412693 U JPH0412693 U JP H0412693U
- Authority
- JP
- Japan
- Prior art keywords
- board
- flexible printed
- printed wiring
- wiring board
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の実施例の構造図であり、ａ図
は斜視図、ｂ図はａ図の矢視図、第２図は従来の
ＤＩＰ型ＩＣの搭載例、第３図は従来のＬＣＣ型
ＩＣの搭載例、第４図は従来のＳＯＰ型ＩＣの搭
載例を示す。
１……ＩＣ、２……フレキシブル基板、３……
コネクタ、４……基板。
Fig. 1 is a structural diagram of an embodiment of the present invention, Fig. a is a perspective view, Fig. b is a view taken in the direction of the arrow in Fig. A, Fig. 2 is an example of mounting a conventional DIP type IC, and Fig. 3 is a conventional FIG. 4 shows an example of mounting an LCC type IC, and FIG. 4 shows an example of mounting a conventional SOP type IC. 1...IC, 2...flexible board, 3...
Connector, 4...board.
Claims (1)
該フレキシブル印刷配線板の配線と電気的接続を
してあり、 (b) 前記フレキシブル印刷配線板の配線の端部
はコネクタに接続できる形状としてあり、 (c) 前記フレキシブル印刷配線板の裏面には両
面粘着テープを貼りつけてあり、基板との接着を
該両面粘着テープで行なうようにしてあることを
特徴とする基板へのＩＣ搭載構造。[Claims for Utility Model Registration] As a structure for mounting an IC on a board, (a) the IC is mounted on a flexible printed wiring board and electrically connected to the wiring of the flexible printed wiring board, (b) the above-mentioned The ends of the wiring of the flexible printed wiring board are shaped so that they can be connected to connectors, and (c) double-sided adhesive tape is pasted on the back side of the flexible printed wiring board, and the double-sided adhesive tape is used to adhere to the board. A structure for mounting an IC on a board, which is characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5300090U JPH0412693U (en) | 1990-05-23 | 1990-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5300090U JPH0412693U (en) | 1990-05-23 | 1990-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0412693U true JPH0412693U (en) | 1992-01-31 |
Family
ID=31573801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5300090U Pending JPH0412693U (en) | 1990-05-23 | 1990-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412693U (en) |
-
1990
- 1990-05-23 JP JP5300090U patent/JPH0412693U/ja active Pending
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