JPH0412677U - - Google Patents
Info
- Publication number
- JPH0412677U JPH0412677U JP5329990U JP5329990U JPH0412677U JP H0412677 U JPH0412677 U JP H0412677U JP 5329990 U JP5329990 U JP 5329990U JP 5329990 U JP5329990 U JP 5329990U JP H0412677 U JPH0412677 U JP H0412677U
- Authority
- JP
- Japan
- Prior art keywords
- case
- grounded
- wiring board
- printed wiring
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5329990U JPH0412677U (el) | 1990-05-22 | 1990-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5329990U JPH0412677U (el) | 1990-05-22 | 1990-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0412677U true JPH0412677U (el) | 1992-01-31 |
Family
ID=31574364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5329990U Pending JPH0412677U (el) | 1990-05-22 | 1990-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412677U (el) |
-
1990
- 1990-05-22 JP JP5329990U patent/JPH0412677U/ja active Pending