JPH0412659U - - Google Patents
Info
- Publication number
- JPH0412659U JPH0412659U JP5442390U JP5442390U JPH0412659U JP H0412659 U JPH0412659 U JP H0412659U JP 5442390 U JP5442390 U JP 5442390U JP 5442390 U JP5442390 U JP 5442390U JP H0412659 U JPH0412659 U JP H0412659U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- fixed
- semiconductor element
- holding member
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の分解斜視図、第２
図は第１図に示される実施例の縦断面図、第３図
はその実施例の構成を明瞭に示すための水平断面
図、第４図はその実施例の背後から見た斜視図、
第５図は本考案の他の実施例の一部の分解斜視図
、第６図は先行技術の断面図である。
１１，１２……半導体素子、１３……放熱部材
、１４……配線基板、１５……半導体素子用保持
部材、１６……放熱部材用保持部材、１７……下
ケース、１８……上ケース、４１，４２……リー
ド端子。
Fig. 1 is an exploded perspective view of one embodiment of the present invention;
The figure is a longitudinal sectional view of the embodiment shown in FIG. 1, FIG. 3 is a horizontal sectional view to clearly show the configuration of the embodiment, and FIG. 4 is a perspective view of the embodiment seen from behind.
FIG. 5 is an exploded perspective view of a portion of another embodiment of the present invention, and FIG. 6 is a sectional view of the prior art. 11, 12... Semiconductor element, 13... Heat dissipation member, 14... Wiring board, 15... Holding member for semiconductor element, 16... Holding member for heat dissipation member, 17... Lower case, 18... Upper case, 41, 42...Lead terminals.
Claims (1)
固定し、 放熱部材を、放熱部材用保持部材に固定し、 半導体素子用保持部材と放熱部材との間に、配
線基板に接続される半導体素子を挟持して固定し
、 配線基板が固定されるケースに、放熱部材用保
持部材を、半導体素子の厚み方向に移動変位可能
に、かつ厚み方向に垂直な軸線まわりに角変位可
能に固定することを特徴とする半導体素子の放熱
構造。[Scope of Claim for Utility Model Registration] A semiconductor element holding member is erected and fixed on a wiring board, a heat dissipation member is fixed to the heat dissipation member holding member, and between the semiconductor element holding member and the heat dissipation member. , a semiconductor element to be connected to a wiring board is clamped and fixed, and a heat dissipation member holding member is attached to the case to which the wiring board is fixed, and is movable in the thickness direction of the semiconductor element, and is arranged along an axis perpendicular to the thickness direction. A heat dissipation structure for a semiconductor device, which is characterized by being fixed around the device so that it can be angularly displaced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5442390U JP2504608Y2 (en) | 1990-05-23 | 1990-05-23 | Heat dissipation structure of semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5442390U JP2504608Y2 (en) | 1990-05-23 | 1990-05-23 | Heat dissipation structure of semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0412659U true JPH0412659U (en) | 1992-01-31 |
| JP2504608Y2 JP2504608Y2 (en) | 1996-07-10 |
Family
ID=31576477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5442390U Expired - Fee Related JP2504608Y2 (en) | 1990-05-23 | 1990-05-23 | Heat dissipation structure of semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2504608Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006158484A (en) * | 2004-12-03 | 2006-06-22 | Pentax Corp | Connector for electronic endoscope |
| JP2013157484A (en) * | 2012-01-30 | 2013-08-15 | Jvc Kenwood Corp | Retaining member, heat sink device, and method for mounting heat sink |
| CN108399910A (en) * | 2018-05-02 | 2018-08-14 | 格力电器（合肥）有限公司 | Buzzer and its shell |
-
1990
- 1990-05-23 JP JP5442390U patent/JP2504608Y2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006158484A (en) * | 2004-12-03 | 2006-06-22 | Pentax Corp | Connector for electronic endoscope |
| JP4531542B2 (en) * | 2004-12-03 | 2010-08-25 | Ｈｏｙａ株式会社 | Connector for electronic endoscope |
| JP2013157484A (en) * | 2012-01-30 | 2013-08-15 | Jvc Kenwood Corp | Retaining member, heat sink device, and method for mounting heat sink |
| CN108399910A (en) * | 2018-05-02 | 2018-08-14 | 格力电器（合肥）有限公司 | Buzzer and its shell |
| CN108399910B (en) * | 2018-05-02 | 2024-06-04 | 格力电器（合肥）有限公司 | Buzzer and shell thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2504608Y2 (en) | 1996-07-10 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |