JPH0412637U - - Google Patents
Info
- Publication number
- JPH0412637U JPH0412637U JP5423090U JP5423090U JPH0412637U JP H0412637 U JPH0412637 U JP H0412637U JP 5423090 U JP5423090 U JP 5423090U JP 5423090 U JP5423090 U JP 5423090U JP H0412637 U JPH0412637 U JP H0412637U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- mounting section
- powder
- metal base
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims 3
- 229910001080 W alloy Inorganic materials 0.000 claims 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 229910052596 spinel Inorganic materials 0.000 claims 1
- 239000011029 spinel Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5423090U JP2510585Y2 (ja) | 1990-05-24 | 1990-05-24 | 半導体素子収納用パッケ―ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5423090U JP2510585Y2 (ja) | 1990-05-24 | 1990-05-24 | 半導体素子収納用パッケ―ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0412637U true JPH0412637U (ko) | 1992-01-31 |
| JP2510585Y2 JP2510585Y2 (ja) | 1996-09-11 |
Family
ID=31576111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5423090U Expired - Lifetime JP2510585Y2 (ja) | 1990-05-24 | 1990-05-24 | 半導体素子収納用パッケ―ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2510585Y2 (ko) |
-
1990
- 1990-05-24 JP JP5423090U patent/JP2510585Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2510585Y2 (ja) | 1996-09-11 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |