JPH04123544U - Jig for moving semiconductor wafers - Google Patents

Abstract

(57) [Summary] [Purpose] The purpose is to provide a jig that can protect the outer periphery of a wafer during semiconductor wafer handling. [Configuration] A semi-circular arc-shaped wafer outer circumference protector (arc cover) 1, a pair of scissor-shaped handling jig (arc scissors) 6 with a grip on the semi-circular arc, and a semi-circular arc-shaped outer circumference protector. It is composed of three parts: a dedicated carrier 2 on which a tool 1 is set; By sandwiching the wafer between the semi-circular arc-shaped outer circumference protector 1 and the semi-circular arc-shaped handling jig 6, the outer circumference of the wafer is protected during handling from the carrier 2.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

The present invention relates to a jig used for transporting or moving semiconductor wafers.

0002

[Conventional technology]

Conventionally, semiconductor wafers are transported in a carrier 10 shown in FIG. 4(a). child The carrier 10 has grooves 11 provided inside two side plates 11 and 12 facing each other. A plurality of semiconductor wafers are placed in parallel along lines a and 12a. This key When extracting one semiconductor wafer from the carrier 10, the truth shown in FIG. Either attach the empty suction pen 13 to the back side of the semiconductor wafer, or use a pin for semiconductor wafers. Extraction was performed using a set.

0003

[Problem that the idea aims to solve]

However, when extracting a semiconductor wafer from the conventional carrier 10, When returning the semiconductor wafer to the rear 10, use the vacuum suction pen 13 or tweezers. Then, the outer periphery of the semiconductor wafer comes into contact with other wafers and the carrier 10, and the semiconductor wafer There were problems with the discs sticking to them or being damaged.

0004 Therefore, the present invention has been developed to remove semiconductor wafers from carriers and to insert them into carriers. To provide a jig for moving semiconductor wafers that does not damage semiconductor wafers during loading. aimed to.

[0005]

[Means to solve the problem]

The present invention solves the above problem by creating a semi-circular arc with a groove to accommodate the semiconductor wafer. A protective device for the semiconductor wafer outer periphery of the mold (hereinafter referred to as an arc cover) and a mating half A handling jig with a nigiri on the arc (hereinafter referred to as arc scissors) and the arc It consists of a special carrier that houses the cover.

[0006]

[Effect]

When removing a wafer from a special carrier with an arc cover set, Scissor the whole cover with arc scissors, join the arc cover and the uneven part of the arc scissors, and then Remove the wafer by pulling it out with the wafer sandwiched between the arc cover and the arc scissors. The above problem can be solved.

[0007]

【Example】

This invention will be explained below with reference to the drawings. Figure 1(a) is a semicircular arc type semiconductor. This is a protective device for the outer periphery of the body wafer, that is, an arc cover 1, and this is the dedicated It is attached to the carrier 2 to house the semiconductor wafer. This arc cover 1 is shown in Fig. 1 (c ) to pull it out using the handling jig (arc scissors) 6. Arc cover in Figure 1(a) 1 has a groove 1a inside to accommodate the semiconductor wafer, and this arc cover 1 into the arc cover groove 2a of the dedicated carrier 2, it is possible to replace the conventional carrier. Semiconductor wafers can be stored in the same way. The dedicated carrier 2 comes with a stopper 5. There is. This is the structure shown in Fig. 2(a), and the arc cover 1 is shown in the direction of A in Fig. 2(b). When entering the rear 2, the spring plate 7 expands with elastic force and is pushed and bent, and the convex part 8 of the stopper 5 opens outward as shown in FIG. 2(b). On the other hand, the force in the direction of B in Fig. 2(c) The spring plate 7 does not bend, and the arc cover 1 is stopped by the convex portion 8 of the stopper 5. This arc In order to extract the wafer stored in the dedicated carrier 2 with the bar 1 attached, Figure 1(c) ) Use arc scissors 6. This arc scissor 6 operates in the same way as scissors from the central stop. to open and close the arc cover 1, and connect the convex part 6a to the concave part 1b of the arc cover 1 on the carrier 2. By inserting the stopper 5, it comes off as shown in FIG. 2(b). Then use arc scissors 6 Engage the concave and convex portions 1b and 6a of the closing arc cover 1 and the arc scissors 6 as shown in Fig. 3(a). let As a result, the wafer is fixed by the arc cover 1 and the arc scissors 2, and the wafer is - Can be removed while protecting the outer periphery. When returning the wafer, handle the wafer Insert the drilled arc scissors 6 into the special carrier 2 and open the arc scissors 6. Therefore, the uneven parts 1b and 6a come off as shown in Fig. 3(b), and the wafer and arc cover are used exclusively. Can be returned to carrier.

[0008]

[Effect of the idea]

As explained above, by using these jigs, the carrier can be In addition to being able to operate the wafer in a protect it from contact with other wafers or other objects. There are also suction pens and wafers. It is also possible to extract it using tweezers.

[Brief explanation of drawings]

[Figure 1] (a) Perspective view of the semicircular arc-shaped semiconductor wafer outer circumferential protector (arc cover) of this invention (b) Perspective view of a dedicated carrier in which the semiconductor wafer outer circumferential protector can be set (c) Dedicated handling jig Perspective view of (arc scissors)

FIG. 2(a) is an enlarged cross-sectional view of a stopper for securing the semiconductor wafer outer circumferential protector on the side surface of a dedicated carrier; c) Condition when force is applied in the direction (direction B) in which the semiconductor wafer outer circumferential protector comes off (direction B) with the semiconductor wafer outer circumferential protector shown in Fig. 1(a) housed in the dedicated carrier shown in Fig. 1(b) figure

[Figure 3] (a) Front view of the concave and convex portion of the semiconductor wafer outer peripheral protector and handling jig joined together (b) Front view of the concave and convex portion when the handling jig is open

[Fig. 4] (a) Perspective view of a conventional carrier (b) Perspective view of semiconductor wafer suction pen

[Explanation of symbols]

1 Semiconductor wafer outer peripheral protector 2 carrier 6 Handling jig

Claims (1)

[Scope of utility model registration request] 1. A semiconductor wafer outer periphery protector having a semi-circular arc shape having a groove for accommodating the outer periphery of a semiconductor wafer, a carrier in which the semiconductor wafer outer periphery protector is housed, and a semiconductor wafer outer periphery protector comprising: A semiconductor wafer moving jig comprising a handling jig for loading and unloading a carrier.