JPH04117483U - printed wiring board equipment - Google Patents

Abstract

(57) [Summary] [Purpose] To obtain a printed wiring board device with good heat conduction. [Structure] A heat pipe 7 is interposed between the cooling plate 4 and the board 2, and the heat from the circuit component 1 is accurately transferred to the board holder 5.
It was designed to conduct electricity. [Effect] The heat generated by the circuit components is quickly conducted to the board holder by the heat pipe, allowing for good heat dissipation.

Description

[Detailed explanation of the idea]

[Purpose of invention]

0001

[Industrial application field]

This invention relates to a printed wiring board device suitable for being housed in a sealed case. do.

0002

[Conventional technology]

Generally, printed wiring boards housed in electronic equipment are cooled by natural air or forced air. Cooling suppresses the temperature rise of circuit components mounted on the board, ensuring that the circuit always operates normally. is configured to create

0003 However, it is often used outdoors and exposed to the elements, or It is mounted on aircraft, ships, etc., and is used in harsh environments ranging from -54 degrees Celsius to +71 degrees Celsius. In electronic equipment used under such conditions, the electronic circuit is housed in a sealed enclosure as shown in Figure 5. By cooling the case with forced air cooling, the temperature rise of internal circuit components is reduced. It is configured to be pressed.

0004 That is, FIG. 5 shows an electronic device equipped with a conventional printed wiring board device. A large number of printed wiring boards 2 equipped with circuit components 1 such as ICs are connected via connectors 21. A large number of them are detachably housed in the housing 3. Example of 1 piece for printed wiring board 2 For example, about 20 to 30 W of power is consumed, and the heat generated in circuit component 1 is as shown in Figure 6(a). And as shown in (b), the aluminum cooling plate 4 is attached to the periphery. The heat is conducted to the housing 3 via the substrate holder 5 . There are internal heat dissipation flaps on both sides of the housing 3. A cooling path 31 with a cooling fan 6 is formed, and the air is blown by the forced air cooling fan 6. cooled down. Note that 32 is a top cover of the housing 3.

[0005] The board holder 5 is mounted on a cooling guide with the printed wiring board 2 housed in the housing 3. The heat from the circuit component 1 is conducted from the cooling guide 33 to the entire housing 3. It has the function of That is, as shown in an enlarged view of the main part in FIG. 7, the threaded rod 51 is rotated. By connecting the first taper blocks 52 on both ends and the cooling plate 4 at the center. The fixed second taper block 53 moves relative to the tapered surface (sliding surface). Therefore, the first taper block 52 presses the rail 33a of the cooling guide 33. It is fixed (locked) and heat conduction takes place.

[0006] In this way, in the conventional printed wiring board device, the heat generated in the circuit component 1 is absorbed by the cooling plate. The heat is transmitted to the substrate holder 5 and the cooling guide 33 via the cooling guide 4 in sequence. however, Although the aluminum cooling plate 4 itself is a heat conductor, As shown in b), the layout pattern of a large number of circuit components 1 mounted on two sides of a printed wiring board is Depending on the turn, a complicated punching pattern is created to avoid each lead wire of circuit component 1. It is now on. Therefore, the width of the heat conduction path up to the substrate holder 5 is narrow. There are also paths where the heat generated by each circuit component 1 is not sufficiently conducted. It was difficult to conduct the signal up to Ruder 5. Therefore, the heat generated in circuit component 1 Partially remains near the installation location, creating an abnormal temperature condition and preventing good circuit operation. The disadvantage was that it was no longer guaranteed.

[0007]

[Problem that the idea aims to solve]

In conventional printed wiring board devices, the cooling plate, which is a heat conductor, has a complicated cutout shape. Because of this, the heat generated by the circuit components cannot be efficiently conducted to the board holder. There were some drawbacks, and improvements were requested.

[0008] Therefore, this invention uses a simple configuration to efficiently transfer heat generated by circuit components to a board holder. We propose a printed wiring board device that can effectively cool the The purpose is to provide

[0009] [Structure of the idea]

0010

[Means to solve the problem] The printed wiring board device based on this invention is a printed wiring board equipped with circuit components. A heat pipe inserted between a board and this printed wiring board and the circuit component. , a cooling plate inserted between the heat pipe and the circuit component, and a cooling plate inserted between the heat pipe and the circuit component; The peripheral edge of the printed wiring board receives heat from the pipe and conducts the heat to the housing side. A substrate holder attached to the substrate holder.

[0011]

[Effect]

The printed wiring board device based on this invention has a connection between the circuit components and the printed wiring board. A heat pipe was inserted between the two, and the heat pipe was connected to the board holder, so Heat generated by circuit components can be evenly and quickly conducted to the board holder. It is effectively cooled through the , casing, etc.

0012

【Example】

An embodiment of the printed wiring board device according to this invention is shown below with reference to FIGS. 1 to 4. I will look at it and explain. Note that the same reference numerals are used for the same configuration as the conventional configuration shown in FIGS. 5 to 7. A detailed explanation will be omitted.

[0013] That is, as shown in FIG. 1 and FIG. The generated heat is transferred to the aluminum cooling plate 4 and the heat source wired to the printed wiring board 2. It is conducted to the substrate holder 5 attached to the peripheral edge of the substrate 2 through the root pipe 7. It is configured and arranged so that it can be used. Therefore, the heat generated in circuit component 1 is used to cool the layer below it. It is immediately conducted to the heat pipe 7 via the plate 4, and the heat pipe 7 is , has an extremely good heat transfer function, so the heat from the cooling plate 4 is quickly transferred to the substrate holder. is conducted to the driver 5. Note that in this embodiment, the connection between the heat pipe 7 and the circuit component 1 is As in the conventional case, by interposing the cooling plate 4, the distance between the component 1 and the cooling plate 5 is reduced. The contact area is secured and good heat conduction is achieved.

[0014] Furthermore, as shown in an enlarged view in FIG. 3, the heat pipe 7 is connected to a cooling plate under the circuit component 1. 4, and fixed with soldering or thermally conductive adhesive. Ru. For example, the cooling plate 4 to which the heat pipe 7 is attached has its entire surface insulated. An oxide film is formed by the alumite treatment. Heat pipe 7 is the circuit section to be cooled The thickness and type can be selected and used depending on the size of the item 1. However, from the heating part In order to efficiently conduct the heat to the substrate holder 5 at the periphery, as shown in FIG. The working fluid in the heat pipe 7 is vaporized in the heat receiving part and becomes steam, which is then circulated. Multiple check valves are installed so that the ring is cooled and liquefied in the heat dissipation section, and vaporized again in the heat reception section. 71 is provided to connect the heat receiving part of the circuit component 1 side part and the heat dissipating part of the part connected to the board holder 5. The structure is such that refrigerant such as chlorofluorocarbons can be smoothly circulated between the

[0015] However, when the working fluid condenses and liquefies in the heat dissipation part of the board holder 5, it absorbs water. Since an attractive force is generated and a negative vapor pressure is generated, this vapor pressure and suction force and the check valve 71 Due to the interaction with the heat pipe 7, the working fluid inside the heat pipe 7 is touring.

[0016] As described above, the printed wiring board device according to this invention has a simple configuration, and Heat generated by electronic components, etc. is effectively conducted to the board holder, so Remarkable effects can be obtained by storing and using it in closed electronic devices.

[0017]

[Effect of the idea]

The printed wiring board device based on this idea has a simple configuration and is capable of effective heat conduction. Since heat is dissipated well, remarkable effects can be obtained in practical use.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway plan view showing an embodiment of a printed wiring board device according to the invention.

FIG. 2 is a sectional view taken along line A-A of the device shown in FIG. 1;

FIG. 3 is an enlarged view of a portion indicated by reference numeral B in FIG. 2;

FIG. 4 is a plan view showing the arrangement of heat pipes in the device shown in FIG. 1;

FIG. 5 is an exploded perspective view showing an electronic device equipped with a conventional printed wiring board device.

6(a) is a plan view of the printed wiring board device shown in FIG. 5, and FIG. 6(b) is a cross-sectional view taken along line CC in FIG. 6(a).

7 is an enlarged perspective view showing a board holder of the printed wiring board device shown in FIG. 5. FIG.

[Explanation of symbols]

1...Circuit parts 2...Printed wiring board 3...Housing 4...Cooling plate 5... Board holder 7...Heat pipe

Claims (1)

[Scope of utility model registration request] 1. A printed wiring board on which a circuit component is mounted, a heat pipe inserted between the printed wiring board and the circuit component, and a heat pipe inserted between the heat pipe and the circuit component. 1. A printed wiring board device comprising: a cooling plate; and a board holder attached to a peripheral edge of the printed wiring board so as to receive heat from the heat pipe and conduct the heat to a housing side.