JPH04115591A - Leakage prevention of electromagnetic waves - Google Patents
Leakage prevention of electromagnetic wavesInfo
- Publication number
- JPH04115591A JPH04115591A JP23666990A JP23666990A JPH04115591A JP H04115591 A JPH04115591 A JP H04115591A JP 23666990 A JP23666990 A JP 23666990A JP 23666990 A JP23666990 A JP 23666990A JP H04115591 A JPH04115591 A JP H04115591A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic waves
- pattern
- conductive
- circuit board
- shield plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002265 prevention Effects 0.000 title claims description 8
- 238000000034 method Methods 0.000 claims description 19
- 238000010276 construction Methods 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000010949 copper Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000010365 information processing Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000007888 film coating Substances 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
プリント基板に搭載した電子回路から放射される電磁波
の周囲空間への漏洩を防止する電磁波の漏洩防止方法に
関し、
簡単、且つ低コストで電磁波の周囲空間への漏洩を防止
することのできる電磁波の漏洩防止方法の提供を目的と
し、
プリント基板の表裏面に設けられて、電子回路を搭載し
たプリント基板上の領域を取り囲む導電性を有する周回
パターンと、
前記周回パターンと接触して前記領域を遮蔽し、周回パ
ターンとともに接地された導電性のシールド板とにより
電磁波の周囲空間への漏洩を防止するように構成する。[Detailed Description of the Invention] [Summary] This invention relates to an electromagnetic wave leakage prevention method for preventing electromagnetic waves emitted from an electronic circuit mounted on a printed circuit board from leaking into the surrounding space, and which easily and at low cost can prevent electromagnetic waves from leaking into the surrounding space. The purpose of the present invention is to provide a method for preventing leakage of electromagnetic waves that can prevent leakage of electromagnetic waves, and includes a conductive circular pattern provided on the front and back surfaces of a printed circuit board and surrounding an area on the printed circuit board on which an electronic circuit is mounted; The area is shielded by contacting the circulating pattern, and a conductive shield plate that is grounded together with the circulating pattern is configured to prevent electromagnetic waves from leaking into the surrounding space.
本発明は、プリント基板に搭載した電子回路が放射する
電磁波の漏洩を防止する電磁波の漏洩防止方法、特に簡
単、且つ低コストで電磁波の漏洩を防止できる電磁波の
漏洩防止方法に関する。The present invention relates to a method for preventing leakage of electromagnetic waves emitted by an electronic circuit mounted on a printed circuit board, and particularly to a method for preventing leakage of electromagnetic waves that is simple and inexpensive.
昨今、ワードプロセッサーやパーソナルコンピュータ等
で見られるように情報処理をデジタル信号により行う各
種情報処理装置が、一般家庭に広く普及していることは
周知のことである。It is well known that various information processing devices that process information using digital signals, such as word processors and personal computers, have recently become widespread in general households.
ところが、これらの情報処理装置から放射される電磁波
は、テレビの画面のちらつきの原因になったり、時には
周囲の装置等を突然誤動作させる等の引金にもなってい
た。However, the electromagnetic waves emitted from these information processing devices cause flickering on television screens, and sometimes cause surrounding devices to suddenly malfunction.
従って、かかる情報処理装置から放射される電磁波の漏
洩を防止することは、極めて重要な課題になっている。Therefore, preventing leakage of electromagnetic waves emitted from such information processing devices has become an extremely important issue.
従来の電磁波の漏洩防止方法は、電子回路を内部に収容
する筐体又はキャビネット等（以下、キャビネットと総
称）に導電性を付与して構成し、電子回路が放射する電
磁波をキャビネットによりシールド（遮蔽）し、電磁波
がキャビネット外に漏洩するのを防止していた。Conventional electromagnetic wave leakage prevention methods consist of providing conductivity to a casing or cabinet that houses an electronic circuit (hereinafter collectively referred to as a cabinet), and shielding the electromagnetic waves emitted by the electronic circuit with the cabinet. ) to prevent electromagnetic waves from leaking outside the cabinet.
前述したキャビネットは、ＡＢＳ樹脂（アクリロニトリ
ル・ブタジェン・スチレン樹脂）等の導電性のないプラ
スチックをモールド成形した後、内面に金属膜、例えば
＃ｐＪ（Ｃｕ）とニッケル（Ｎｉ）をこの順で無電界メ
ツキにより被着して構成するか、若しくは、導電性塗料
、例えば銀（Ａｇ）、銅または炭素（Ｃ）等の微粒子を
メタアクリル樹脂などの熱可塑性樹脂やエポキシ樹脂な
どの熱硬化性樹脂又はゴムと混ぜ合わせて作った導電性
塗料を内面に塗布して構成したものである。The above-mentioned cabinet is made by molding non-conductive plastic such as ABS resin (acrylonitrile-butadiene-styrene resin), and then coating the inner surface with a metal film, such as #pJ (Cu) and nickel (Ni), in this order without an electric field. Alternatively, conductive paint, such as fine particles of silver (Ag), copper or carbon (C), may be applied to thermoplastic resin such as methacrylic resin, thermosetting resin such as epoxy resin, or It is constructed by coating the inner surface with a conductive paint made by mixing it with rubber.
このように片面（内面）だけに金属膜若しくは導電膜塗
膜を被着して形成したキャビネットは、多くの工数がか
かることにより原価高となることが避けられなかった（
キャビネットの表面に金属膜若しくは導電膜塗膜が被着
しないように当該表面をマスクすることが必要）。In this way, a cabinet formed by coating only one side (inner surface) with a metal film or conductive film coating inevitably requires a large number of man-hours, resulting in high costs (
(It is necessary to mask the surface of the cabinet so that the metal film or conductive film coating does not adhere to the surface.)
従って、このようなキャビネットを使用する従来の電磁
波の漏洩防止方法は、必然的にコスト高となっていた。Therefore, the conventional electromagnetic wave leakage prevention method using such a cabinet has inevitably been expensive.
更に、設計上、キャビネットに隙間や開口部が不可避的
に存在する際には、追加的な部品や工数をかけて、これ
らの隙間や開口部を塞ぐことが必要であった。Furthermore, when gaps or openings inevitably exist in the cabinet due to design, it is necessary to use additional parts and man-hours to close these gaps or openings.
本発明は、このような問題を解決するためになされたも
ので、その目的は簡単、且つ低コストで電磁波の周囲空
間への漏洩を防止することのできる電磁波の漏洩防止方
法の提供にある。The present invention was made to solve these problems, and its purpose is to provide a method for preventing leakage of electromagnetic waves that is simple and inexpensive and can prevent electromagnetic waves from leaking into the surrounding space.
［課題を解決するための手段］
前記目的は、第１図の本発明の原理説明図に示すように
プリント基板１１に搭載した電子回路１０から放射され
る電磁波の周囲空間への漏洩を防止する電磁波の漏洩防
止方法において、
プリント基板１１の表裏面に設けられて、電子回路１０
を搭載したプリント基板１１上の領域Ａを取り囲む導電
性を有する周回パターン１２と、周回パターンエ２と接
触して領域Ａを遮蔽し、周回パターン１２とともに接地
された導電性のシールド板１３とにより電磁波の周囲空
間への漏洩を防止することを特徴とする電磁波の漏洩防
止方法により達成される。[Means for Solving the Problems] The purpose is to prevent electromagnetic waves radiated from the electronic circuit 10 mounted on the printed circuit board 11 from leaking into the surrounding space, as shown in the diagram explaining the principle of the present invention in FIG. In the electromagnetic wave leakage prevention method, the electronic circuit 10 is provided on the front and back surfaces of the printed circuit board 11.
A conductive circular pattern 12 surrounding the area A on the printed circuit board 11 on which the circuit board 11 is mounted, and a conductive shield plate 13 that is in contact with the circular pattern A 2 to shield the area A and is grounded together with the circular pattern 12. This is achieved by an electromagnetic wave leakage prevention method characterized by preventing electromagnetic waves from leaking into the surrounding space.
なお、第１図の同図（ａ）は側断面図、同図（ｂ）は平
面図である。Note that FIG. 1(a) is a side sectional view, and FIG. 1(b) is a plan view.
本発明の電磁波の漏洩防止方法は、第１図に示すように
プリント基板１１の表裏面に設けられて、電子回路１０
を搭載したプリント基板１１上の領域Ａを取り囲む導電
性を有する周回パターン１２と、周回パターン１２と接
触して領域Ａを遮蔽し、周回パターン１２とともに接地
された導電性のシールド板１３とにより電磁波の周囲空
間への漏洩を防止するように構成している。As shown in FIG. 1, the method for preventing leakage of electromagnetic waves according to the present invention is to
Electromagnetic waves are generated by a conductive circular pattern 12 that surrounds the area A on the printed circuit board 11 on which the circuit board 11 is mounted, and a conductive shield plate 13 that is in contact with the circular pattern 12, shields the area A, and is grounded together with the circular pattern 12. The structure is designed to prevent leakage of water into the surrounding space.
この周回パターン１２は、プリント基板１１の配線パタ
ーンｌｌａを形成する際に該配線パターンＩｌａと同時
に形成することが可能となる。This circumferential pattern 12 can be formed at the same time as the wiring pattern Ila of the printed circuit board 11 when the wiring pattern Ila is formed.
また、シールド板１３は、ＡＢＳ樹脂をモールド成形し
たものであっても、両面に金属膜若しくは導電膜塗膜が
被着できるために、そのコストも低いものとなる。Further, even if the shield plate 13 is made of ABS resin by molding, a metal film or a conductive film can be coated on both sides, so that the cost is low.
斯くして、本発明の電磁波の漏洩防止方法は、簡単、且
つ低コストで電磁波の周囲空間への漏洩を防止できるこ
ととなる。Thus, the electromagnetic wave leakage prevention method of the present invention can prevent electromagnetic waves from leaking into the surrounding space easily and at low cost.
〔実 施 例］
以下、第２図により本発明の一実施例の電磁波の漏洩防
止方法を説明する。[Example] Hereinafter, a method for preventing leakage of electromagnetic waves according to an example of the present invention will be explained with reference to FIG.
第２図は、本発明の一実施例の電磁波の漏洩防止方法を
説明するための図で、同図（ａ）は装置に実装した状態
の要部概略側断面図、同図（ｂ）はプリント基板の平面
図、同図（ｃ）は表面シールド板の平面図、同図（ｄ）
は表面シールド板の側断面図、同図（ｅ）は裏面シール
ド板の側断面図、同図（ｆ）はＢ部の拡大図である。FIG. 2 is a diagram for explaining a method for preventing leakage of electromagnetic waves according to an embodiment of the present invention. FIG. A plan view of the printed circuit board, (c) a plan view of the front shield plate, (d)
is a sectional side view of the front shield plate, (e) is a side sectional view of the back shield plate, and (f) is an enlarged view of section B.
本発明の一実施例の電磁波の漏洩防止方法は、同図（ａ
）に示すようにプリント基板２１の両面を表面シールド
板２３ａと裏面シールド＋ｆｆｌ ２３ ｂとによりサ
ンドインチ状に挟み込むようにして、例えば情報処理装
置のフレーム３０に取り付けねじ２４（又はスナップフ
ットなど）により固定し、プリント基板２１に搭載した
電子回路２０から放射される電磁波が周囲空間に漏洩す
ることを防止するように構成したものである。A method for preventing leakage of electromagnetic waves according to an embodiment of the present invention is shown in FIG.
), both sides of the printed circuit board 21 are sandwiched between the front shield plate 23a and the back shield +ffl 23b in a sandwich-like manner, and then attached to the frame 30 of the information processing device, for example, with the mounting screws 24 (or snap feet, etc.). It is configured to prevent electromagnetic waves emitted from the electronic circuit 20 fixed and mounted on the printed circuit board 21 from leaking into the surrounding space.
かかる状態においては、表面シールド板２３ａと裏面シ
ールド板２３ｂは、プリント基板２１の表裏面の周縁部
に設けた銅箔よりなる周回パターン２２に金属製の取り
付けねじ２４により押圧されて、周回パターン２２と表
面シールド板２３ａ及び裏面シールド板２３ｂは電気的
に接続されるとともに、金属製のフレーム３０を介して
接地されている。In this state, the front shield plate 23a and the back shield plate 23b are pressed by the metal mounting screws 24 against the circular pattern 22 made of copper foil provided on the peripheral edges of the front and back surfaces of the printed circuit board 21, so that the circular pattern 22 The front shield plate 23a and the back shield plate 23b are electrically connected and grounded via a metal frame 30.
プリント基板２１は、同図（ａ）及び同図（ｂ）に示す
ように表裏面の周縁部を一周する周回パターン２２と、
各コーナ部で表面の周回パターン２２から裏面の周回パ
ターン２２まで貫通するねし孔２１ｂが設けられて構成
されている。The printed circuit board 21 has a circular pattern 22 that goes around the periphery of the front and back surfaces, as shown in FIGS.
A threaded hole 21b penetrating from the circumferential pattern 22 on the front surface to the circumferential pattern 22 on the back surface is provided at each corner.
なお、この周回パターン２２は、プリント基板２１の配
線パターン２１ａを形成する際に、この配線パターン２
１ａと同時に形成されるために、その製造原価は極めて
低いものとなる。Note that this circular pattern 22 is used when forming the wiring pattern 21a of the printed circuit board 21.
Since it is formed simultaneously with 1a, its manufacturing cost is extremely low.
また、表面シールド板２３ａ及び裏面シールド板２３ｂ
は、同図（ｃ）〜同図（ｆ）に示すようにＡＢＳ樹脂を
モールド成形した後に、全面に銅Ｃｕ、ニッケルＮｉを
この順にそれぞれ１μｍ程度に無電界メツキにより被着
して構成したものである。In addition, the front shield plate 23a and the back shield plate 23b
As shown in Figures (c) to (f), after molding ABS resin, copper (Cu) and nickel (Ni) were deposited on the entire surface in this order to a thickness of approximately 1 μm by electroless plating. It is.
斯くして、このように形成した表面シールド板２３ａ及
び裏面シールド板２３ｂは、大きさもプリント基板２１
の大きさ程度で十分であり、かつ両面に銅Ｃｕ、ニッケ
ルＮｉを被着していることにより表面をマスクすること
が不要となるために、その製造原価は低いものとなる。Thus, the front shield plate 23a and the back shield plate 23b formed in this way have the same size as the printed circuit board 21.
It is sufficient to have a size of about 100 mm, and since both surfaces are coated with copper Cu and nickel Ni, it is not necessary to mask the surface, so the manufacturing cost is low.
なお、表面シールド板２３ａ及び裏面シールド板２３ｂ
に設けたねし孔２３ａ＋、２３１ｇ は取り付けねし２
４が挿通するためのもである。Note that the front shield plate 23a and the back shield plate 23b
The screw holes 23a+ and 231g provided in are the mounting screws 2.
4 is for insertion.
また、表面シールド板２３ａに設けたケーブル孔２３ａ
２は、プリント基板２１に搭載した電子回路２０を外部
に導出する導出ケーブル２５を挿通するためのものであ
る。In addition, a cable hole 23a provided in the front shield plate 23a
Reference numeral 2 is for inserting a lead-out cable 25 for leading the electronic circuit 20 mounted on the printed circuit board 21 to the outside.
を防止することのできる電磁波の漏洩防止方法の提供が
可能となる。It becomes possible to provide a method for preventing leakage of electromagnetic waves that can prevent leakage of electromagnetic waves.
第１図は、本発明の原理説明図、
第２図は、本発明の一実施例の電磁波の漏洩防止方法を
説明するための図である。
図において、
１０と２０は電子回路、
１１と２１はプリント基板、
１２と２２は周回パターン、
１３はシールド板、
２３ａは表面シールド板、
２３ｂは裏面シールド板、
２４は取り付けねじ、
２５は導出ケーブルをそれぞれ示す。
〔発明の効果〕
以上の説明から明らかなように本発明によれば、簡単、
且つ低コストで電磁波の周囲空間への漏洩側＠面図
（ｂ）
千面閏
４’ｆｌ Ｆ；’ＰＩ ／ｌ １’ｊｒＪ！’＃を明ｆ
Ｗ第１図
＋ＣＩ ｌ ９Ｊ ＋：フ畷二ＨＬｒ＝７ｔ’ｊ’ｊ、
／ ｔ（丁−ＲｒＥ８ｈｔＪｌ’ｒｔｆｎ ０Ｌｂ）７
゛リシト基ＬりＯ１侶４リシク第
囚FIG. 1 is a diagram for explaining the principle of the present invention, and FIG. 2 is a diagram for explaining a method for preventing leakage of electromagnetic waves according to an embodiment of the present invention. In the figure, 10 and 20 are electronic circuits, 11 and 21 are printed circuit boards, 12 and 22 are circular patterns, 13 is a shield plate, 23a is a front shield plate, 23b is a back shield plate, 24 is a mounting screw, and 25 is a lead-out cable are shown respectively. [Effects of the Invention] As is clear from the above explanation, according to the present invention, simple and
Leakage side of electromagnetic waves into the surrounding space at low cost @ Plane view (b) Thousand-sided leap 4'fl F;'PI /l 1'jrJ! '# clear f
W Fig. 1 + CI l 9J +: Fuwaji HLr = 7t'j'j,
/t(Ding-RrE8htJl'rtfn 0Lb)7
゛Rishito Group L Ri O1 Member 4 Rishiku 1st Prisoner
Claims (1)
放射される電磁波の周囲空間への漏洩を防止する電磁波
の漏洩防止方法において、 プリント基板（１１）の表裏面に設けられて、電子回路
（１０）を搭載したプリント基板（１１）上の領域（Ａ
）を取り囲む導電性を有する周回パターン（１２）と、
前記周回パターン（１２）と接触して前記領域（Ａ）を
遮蔽し、周回パターン（１２）とともに接地された導電
性のシールド板（１３）とにより電磁波の周囲空間への
漏洩を防止することを特徴とする電磁波の漏洩防止方法
。[Claims] An electromagnetic wave leakage prevention method for preventing electromagnetic waves emitted from an electronic circuit (10) mounted on a printed circuit board (11) from leaking into surrounding space, comprising: area (A) on the printed circuit board (11) on which the electronic circuit (10) is mounted.
) surrounding a conductive circular pattern (12);
A conductive shield plate (13) that contacts the circular pattern (12) and shields the area (A) and is grounded together with the circular pattern (12) prevents electromagnetic waves from leaking into the surrounding space. Features a method for preventing leakage of electromagnetic waves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23666990A JPH04115591A (en) | 1990-09-05 | 1990-09-05 | Leakage prevention of electromagnetic waves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23666990A JPH04115591A (en) | 1990-09-05 | 1990-09-05 | Leakage prevention of electromagnetic waves |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04115591A true JPH04115591A (en) | 1992-04-16 |
Family
ID=17004033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23666990A Pending JPH04115591A (en) | 1990-09-05 | 1990-09-05 | Leakage prevention of electromagnetic waves |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04115591A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5946194A (en) * | 1993-12-23 | 1999-08-31 | Symbol Technologies, Inc. | Memory card assembly having an integral antenna |
| US6295031B1 (en) | 1993-12-23 | 2001-09-25 | Symbol Technologies, Inc. | Memory card assembly having an integral antenna |
-
1990
- 1990-09-05 JP JP23666990A patent/JPH04115591A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5946194A (en) * | 1993-12-23 | 1999-08-31 | Symbol Technologies, Inc. | Memory card assembly having an integral antenna |
| US6104620A (en) * | 1993-12-23 | 2000-08-15 | Symbol Technologies, Inc. | Shielded radio card assembly |
| US6295031B1 (en) | 1993-12-23 | 2001-09-25 | Symbol Technologies, Inc. | Memory card assembly having an integral antenna |
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