JPH04114564U - Plating jig for thin substrates - Google Patents

Abstract

(57) [Summary] [Purpose] There is no risk of the board or jig being bent or bent, uniform plating is possible, and the board can be attached to and removed from the jig without any problems even if the board is warped or twisted. It's easy to do. [Structure] By holding the printed circuit board 2 in the rigid frame 1 in a detachable manner, there is no risk of the board 2 or the jig being bent, uniform plating is possible, and the mounting and removal of the board 2 from the jig is easy. Even if the substrate 2 is warped or twisted, it can be easily done without any problem.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention relates to a jig used for plating thin, flexible substrates. In detail, clamp the thin board with the clamp part of the plating equipment, and then shake the clamp part. Regarding the plating jig for thin substrates used for rocking plating on substrates by dynamic motion. Ru.

0002

[Conventional technology]

Figure 7 is an explanatory perspective view of plating using a plating device equipped with a clamp section. , FIG. 8 is an explanatory side view of the plated case. This plating equipment The upper part of the lint board 2 is clamped by the clamp part 12, and the board 2 is placed on the float guide 13. Insert the float guide 13 into the plating bath 14 and swing it back and forth to remove the substrate 2. Rock plating. In such plating equipment, the plate thickness is 0.5mm or less. Clamp the printed circuit board 2 made of lath epoxy resin and insert the board 2 into the plating tank 14. When the floating float guide 13 is sunk and the board 2 is plated by swinging, the board 2 will not bend. Occur.

0003 In order to prevent this board 2 from bending, rocking plating is performed using a rigid jig. That's true. Figure 9 is a perspective view showing the configuration of an example of a conventional jig, and Figure 10 is this conventional jig. FIG. This conventional jig is A plating window 15 that matches the size of the plating area of the printed circuit board 2 on a rigid plate made of plastic. are provided to form a rigid frame 1, and mushroom-shaped holes for fixing the board are provided at the four corners of the rigid frame 1 on the board side. A drop prevention hook 4 is provided on the upper frame portion on the side opposite to the board. Ru.

0004 On the other hand, on the printed circuit board 2 side, there is a mushroom-shaped boss 16 that matches the corresponding position and diameter. A stop hole 17 is provided, and the end of the mushroom-shaped boss 16 of the conventional jig is inserted into the stop hole. The board 2 is fixed to the jig by being locked to the stopper hole locking portion 17b via the portion 17a. Ru.

[0005] The conventional jig with the board 2 fixed in this way is clamped to the clamp part of the plating equipment. Then, it will be immersed in a plating bath and subjected to rocking plating. The clamp part 12 is shown in FIG. The two plates 7, 7 are pivoted at the fulcrum 8 so that the two plates 7, 7 Insert the spring 9 and use the action of this spring 9 to clamp the printed circuit board 2 at the other end. It is configured to be held between a boss 10 and an abutting portion 11.

[0006]

[Problem that the idea aims to solve]

In the conventional jig with the above configuration, when removing the printed circuit board 2 from the jig after plating, , the hole wall of stopper hole 17 is damaged and burrs are generated, and the burrs can damage the product in the subsequent process. , and it is also necessary to make a stop hole 17 on the board 2 side into which the mushroom-shaped boss 16 is inserted. This requires a lot of effort, reduces the effective area of the board 2, and requires mounting the board 2 on a jig. Otherwise, when removing the board from the jig, the jig is easily damaged because the jig is bent, and the board 2 is There were problems such as poor bending.

[0007]

[Means to solve the problem]

In order to solve the above problems, the invented jig holds a printed circuit board 2 in a rigid frame 1 with a holding hand. It is removably held at step 3, and a fall prevention strap is attached to the upper frame part of the rigid frame 1 on the side opposite to the board. It has a configuration in which a hanging portion 4 is provided.

[0008]

[Effect]

With this configuration, there is a risk that the board 2 or the jig may be bent incorrectly. This makes it possible to perform rocking plating, which enables uniform plating, and by simply holding the board 2. Since there is no need to drill holes in this, it is time-consuming and reduces the effective area of the board 2. Not only that, but also damage and damage to the board 2 and the jig can be prevented. become.

[0009]

【Example】 FIG. 1 is a perspective view showing the structure of the first embodiment of the jig of the present invention, and FIG. 2 shows the first embodiment. FIG. 3 is a side view of the plating device in a state where it is clamped to a clamp portion of the plating device. 1 is the bend 2 is a thin flexible printed circuit board, 3 is rigid frame 1 This is a holding means for detachably holding the printed circuit board 2.

0010 The holding means 3 of the first embodiment has a board support part 5A inside the lower frame part of the U-shaped frame. A board holding part 6B is provided inside the left and right frame portions of the U-shaped frame. Above rigid frame 1 A hook part 4 for preventing falling is provided on the opposite side of the frame part to the board. Clamp for plating equipment The unit pivots two plates 7, 7 at a fulcrum 8, and a spring is installed between one end of the two plates 7, 7. 9 is inserted, and the action of this spring 9 holds the printed circuit board 2 in place with the clamping button on the other end. It is configured to be held between the base and the abutting portion 11.

[0011] The printed circuit board 2 is moved along the rigid frame 1 from above the board holding parts 6B, 6B of the holding means 3. It is supported by the board support part 5A, and tilting is prevented by both board holding parts 6B, 6B. (See Figure 1). According to the first embodiment in which the printed circuit board 2 is held in this way The jig is used by hooking the clamp boss 10 of the clamp part onto the fall prevention hook part 4. It is clamped by the boss 10 and the abutment part 11 (see FIG. 2).

0012 FIG. 3 is a perspective view showing the configuration of the second embodiment, and FIG. 4 is a perspective view showing the configuration of the second embodiment. It is a side view of the state clamped to the clamp part. This second embodiment is the same as the one shown in FIG. The only difference from the first embodiment is the configuration of the holding means 3. This second embodiment The holding means 3 is provided with a board support part 5a in the lower frame part of the rigid frame 1, and A substrate holding portion 6b is provided at the portion.

[0013] The printed circuit board 2 is held by the holding means 3 in the same manner as in the first embodiment (see FIG. 3), the jig according to the second embodiment that holds the printed circuit board 2 is also the same as the jig according to the first embodiment. It is clamped by the clamping boss 10 and the abutment part 11 of the clamping part in the same way. (See Figure 4).

FIG. 5 is a perspective view showing the configuration of a third embodiment, and this third embodiment is almost the same except that the board support portion 5a in FIG. 3 is replaced with two support portions 5a ₁ and 5a ₂ . The structure is as follows. FIG. 6 is a perspective view showing the configuration of a fourth embodiment. In this fourth embodiment, the rigid frame 1 shown in FIG. 3 is divided into a plurality of parts, for example, divided into upper and lower halves, and two printed circuit boards are plated at the same time. This is an example.

[0015] No matter which jig is used in the first to fourth embodiments above, the clamp part of the plating machine will The jig of the present invention holding the lamped printed circuit board 2 is immersed in the plating bath and the printed circuit board 2 is immersed in the plating bath. Swing plating can be performed without bending the plate 2. Holds board 2 securely There is no problem in performing rocking plating because it can be used. Also, the board 2 may be warped or twisted. Even if there is, it can be easily removed.

[0016] In addition, the rigid frame 1 in the present invention is made from a stainless steel plate to the area of the printed circuit board 2. This can also be obtained by punching out a hole in the center.

[0017]

[Effect of the idea]

As described above, according to the present invention, the printed circuit board 2 is attached to and detached from the rigid frame 1 using the holding means 3. A fall prevention hook 4 is attached to the upper frame portion of the rigid frame 1 on the side opposite to the board. Therefore, even if the board 2 is thin and flexible, the board 2 There is no need to bend the jig when attaching or removing it from the jig of the present invention. There is no risk of the board 2 or the jig bending or becoming defective, and rocking plating is possible. Uniform plating can be achieved, and there is no need to drill holes in the substrate 2 just by holding it. , not only is it time-consuming and does not reduce the effective area of the board 2, but also the board 2 and Damage and damage to the jig can be prevented. Also, insert the board 2 into the jig of the present invention. Since it can be installed or removed with just the Even if there is a problem, it can be installed and removed more easily than the jig of the present invention.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the structure of a first embodiment of the jig of the present invention.

FIG. 2 is a side view of the first embodiment in a state where it is clamped to a clamp section of a plating device.

FIG. 3 is a perspective view showing the configuration of a second embodiment.

FIG. 4 is a side view of the second embodiment in a state where it is clamped to a clamp section of a plating device.

FIG. 5 is a perspective view showing the configuration of a third embodiment.

FIG. 6 is a perspective view showing the configuration of a fourth embodiment.

FIG. 7 is an explanatory perspective view of plating using a plating device equipped with a clamp section.

FIG. 8 is an explanatory side view in the case of plating.

FIG. 9 is a perspective view showing the configuration of an example of a conventional jig.

FIG. 10 is a perspective view of a printed circuit board subjected to swing plating using this conventional jig.

[Explanation of symbols]

1 Rigid frame 2 Printed circuit board 3 Holding means 4 Fall prevention hook 5A Board support section 5a Board support section 5a ₁ Support section 5a ₂ Support section 6B Board holding section 6b Board holding section

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[Procedural amendment]

[Submission date] July 3, 1991

[Procedural amendment 1]

[Name of document to be corrected] Drawing

[Correction target item name] Full map

[Correction method] Change

[Correction details]

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[Figure 10]

Claims (3)

[Scope of utility model registration request] 1. A printed circuit board (2) is removably held on a rigid frame (1) by a holding means (3), and a fall prevention hook part is provided on the side opposite to the board of the upper frame part of the rigid frame (1). (4) A plating jig for thin substrates. [Claim 2] The holding means (3) includes a board support part (5A) provided inside the lower frame portion of the U-shaped frame, and board holding parts (6B) provided inside the left and right frame parts of the U-shaped frame. The plating jig for thin substrates according to claim 1. [Claim 3] The holding means (3) includes a board support part (5a) provided in the lower frame portion of the rigid frame (1), and board holding parts (6b) provided in the left and right frame parts of the rigid frame (1). The plating jig for thin substrates according to claim 1.