JPH0410979U - - Google Patents
Info
- Publication number
- JPH0410979U JPH0410979U JP5120090U JP5120090U JPH0410979U JP H0410979 U JPH0410979 U JP H0410979U JP 5120090 U JP5120090 U JP 5120090U JP 5120090 U JP5120090 U JP 5120090U JP H0410979 U JPH0410979 U JP H0410979U
- Authority
- JP
- Japan
- Prior art keywords
- shield cover
- main body
- connector
- connector main
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000004873 anchoring Methods 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Elimination Of Static Electricity (AREA)
Description
第１図は本考案の実施例を説明するための図、
第２図は本考案の実施例の作用を説明するための
図、第３図は従来のＥＭＩ対策を施したコネクタ
を示す図である。
図において、１……ケーブル、２……コンタク
ト、３……コネクタ本体、４，４ａ，４ｂ……シ
ールドカバー、５……樹脂被覆、６，７……孔、
を示す。
FIG. 1 is a diagram for explaining an embodiment of the present invention,
FIG. 2 is a diagram for explaining the operation of the embodiment of the present invention, and FIG. 3 is a diagram showing a conventional connector with EMI countermeasures. In the figure, 1... Cable, 2... Contact, 3... Connector body, 4, 4a, 4b... Shield cover, 5... Resin coating, 6, 7... Hole,
shows.
Claims (1)
する絶縁材よりなるコネクタ本体３と、該コネク
タ本体３及びケーブル結線部を覆う金属製シール
ドカバー４と、該シールドカバー４を被覆するよ
うにモールドした樹脂被覆５とからなるコネクタ
において、 上記シールドカバー４をコネクタ本体部とケー
ブル結線部とに２分割し、且つその一方の端部を
拡大して他方と嵌合可能とし、その重なり合う部
分に上側が小さく下側が大きい孔６，７を穿設し
、樹脂被覆５用にモールドした樹脂が該孔６，７
にも注入され投錨効果を生ずるようにしたことを
特徴とするコネクタ。[Scope of Claim for Utility Model Registration] A connector main body 3 made of an insulating material and having a large number of contacts 2 connected to a cable 1, a metal shield cover 4 that covers the connector main body 3 and the cable connection part, and the shield cover 4. In a connector consisting of a resin coating 5 molded to cover the shield cover 4, the shield cover 4 is divided into two parts, a connector main body part and a cable connection part, and one end thereof is enlarged so that it can be fitted with the other part, Holes 6 and 7 are formed in the overlapping part, and the upper side is smaller and the lower side is larger, and the molded resin for the resin coating 5 is poured into the holes 6 and 7.
A connector characterized in that it is injected into the water to produce an anchoring effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5120090U JPH0410979U (en) | 1990-05-18 | 1990-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5120090U JPH0410979U (en) | 1990-05-18 | 1990-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0410979U true JPH0410979U (en) | 1992-01-29 |
Family
ID=31570420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5120090U Pending JPH0410979U (en) | 1990-05-18 | 1990-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410979U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0631089U (en) * | 1992-09-28 | 1994-04-22 | 日本航空電子工業株式会社 | Connector with shell |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60751A (en) * | 1983-06-17 | 1985-01-05 | Nec Corp | Manufacture of substrate for semiconductor integrated circuit |
| JPS6332482B2 (en) * | 1979-04-19 | 1988-06-30 | Teijin Ltd |
-
1990
- 1990-05-18 JP JP5120090U patent/JPH0410979U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6332482B2 (en) * | 1979-04-19 | 1988-06-30 | Teijin Ltd | |
| JPS60751A (en) * | 1983-06-17 | 1985-01-05 | Nec Corp | Manufacture of substrate for semiconductor integrated circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0631089U (en) * | 1992-09-28 | 1994-04-22 | 日本航空電子工業株式会社 | Connector with shell |