JPH0410890B2 - - Google Patents
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- Publication number
- JPH0410890B2 JPH0410890B2 JP60037537A JP3753785A JPH0410890B2 JP H0410890 B2 JPH0410890 B2 JP H0410890B2 JP 60037537 A JP60037537 A JP 60037537A JP 3753785 A JP3753785 A JP 3753785A JP H0410890 B2 JPH0410890 B2 JP H0410890B2
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- JP
- Japan
- Prior art keywords
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- weight
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- insulating material
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 150000001993 dienes Chemical class 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 9
- 239000005056 polyisocyanate Substances 0.000 claims description 8
- 229920001228 polyisocyanate Polymers 0.000 claims description 8
- 125000005575 polycyclic aromatic hydrocarbon group Chemical group 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 239000003208 petroleum Substances 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 239000012777 electrically insulating material Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- -1 polycyclic aromatic compounds Chemical class 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- MDRWOAQZCGCEQK-UHFFFAOYSA-N cyclohexane;1,2-diisocyanatobenzene Chemical compound C1CCCCC1.O=C=NC1=CC=CC=C1N=C=O MDRWOAQZCGCEQK-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012772 electrical insulation material Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012429 reaction media Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polyurethanes Or Polyureas (AREA)
- Organic Insulating Materials (AREA)
Description
〔産業上の利用分野〕
本発明は電気絶縁材料に関し、詳しくは透明性
を有し、電気的特性に優れた電気絶縁材料に関す
る。
〔従来技術及び発明が解決しようとする問題点〕
従来、水酸基含有液状ポリブタンジエンなどの
ジエン系重合体およびジフエニルメタンジイソシ
アネートなどのポリイソシアネートからなる組成
物の硬化体を電気絶縁材料として用いることは知
られている。しかしながら、この材料は透明性に
劣るため、プリント基板に用いた場合、配線状態
を視認するのが困難であつた。また、体積抵抗率
などの電気的特性にも改良の余地があつた。
そこで本発明者らは、これら問題点を解消した
電気絶縁材料を開発すべく鋭意研究した結果、本
発明を完成するに至つた。
〔問題点を解決するための手段〕
すなわち、本発明は(A)水酸基含有液状ジエン系
重合体(以下、(A)成分という。)、(B)ポリイソシア
ネート化合物(以下、(B)成分という。)および(C)
後記する如き、一般式〔〕および〔〕で表わ
される化合物から選択される、少なくとも1種の
多環芳香族炭化水素(以下、(C)成分という。)か
らなる電気絶縁材料(以下、第1発明という。)
およびこれら(A)、(B)、(C)成分にさらに(D)石油樹脂
(以下、(D)成分という。)を配合してなる電気絶縁
材料(以下、第2発明という。)である。
まず、第1発明について説明する。
本発明の(A)成分である水酸基含有液状ジエン系
重合体は分子内、好ましくは分子末満に水酸基を
有する数平均分子量が300〜25000、好ましくは
500〜10000の液状ジエン系重合体であり、水酸基
含有量は0.1〜10meq/g、好ましくは0.5〜5meq/
gである。これらの液状ジエン系重合体とは炭素
数4〜12のジエン重合体、ジエン共重合体、さら
にはこれらジエンモノマーと炭素数2〜22のα−
オレフイン性付加重合性モノマーとの共重合体な
どがある。具体的にはブタジエンホモポリマー、
イソプレンホモポリマー、ブタジエン−スチレン
コポリマー、ブタジエン−イソプレンコポリマ
ー、ブタジエン−アクリロニトリルコポリマー、
ブタジエン−2−エチルヘキシルアクリレートコ
ポリマー、ブタジエン−n−オクタデシルアクリ
レレートコポリマーなどを例示することができ
る。これら液状ジエン系重合体は、例えば液状反
応媒体中で共役ジエンモノマーを過酸化水素の存
在下、加熱反応させることにより製造することが
できる。
本発明の(B)成分であるポリイシアネート化合物
とは1分子中に2個若しくはそれ以上のイソシア
ネート基を有する有機化合物であつて、(A)成分の
水酸基含有液状ジエン系重合体の水酸基に対する
反応性イソシアネート基を有する。ポリイソシア
ネート化合物の例としては、通常の芳香族、脂肪
族および脂環族のものをあげることができ、たと
えばトリレンジイソシアネート、ヘキサメチレン
ジイソシアネート、ジフエニルメタンジイソシア
ネート(MDI)、液状変性ジフエニルメタンジイ
ソシアネート、ポリメチレンポリフエニルイソシ
アネート、キシリレンジイソシアネート、シクロ
ヘキシルジイソシアネート、シクロヘキサンフエ
ニレンジイソシアネート、ナフタリン−1,5−
ジイソシアネート、イソプロピルベンゼン−2,
4−ジイソシアネート、ポリプロピレングリコー
ルとトリレンジイソシアネート付加反応物などが
あり、とりわけMDI、液状変性ジフエニルメタ
ンジイソシアネート、トリレンジイソシアネート
等が好ましい。
次に、(C)成分である多環芳香族炭化水素として
は
一般式
および
一般式
で表わされる化合物から選択される、少なくとも
1種の多環芳香族炭化水素が用いられる。一般式
()および()において、R1,R2,R3,R4,
R5,R6,R7およびR8は水素原子あるいは低級ア
ルキル基を示す。ここで低級アルキル基とは炭素
数1〜5程度のアルキル基であつて、メチル基、
エチル基、プロピル基、t−ブチル基などが挙げ
られる。R1〜R8はそれぞれ同一でも異なつたも
のであつても良い。また、nは1〜3の整数を示
す。多環芳香族化合物の具体例を以下に示す。
多環芳香族化合物は単独で用いてもよく、ある
いは2種以上を組合せて用いることもできる。
第1発明の電気絶縁材料を構成する上記3成分
の配合量については特に制限はないが、通常(A)成
分100重量部に対して(B)成分0.1〜500重量部、好
ましくは1〜200重量部、(C)成分10〜1000重量部、
好ましくは30〜500重量部である。(B)成分の配合
量が上記範囲外であると、硬化が十分に行なわれ
ない。また、(C)成分が10重量部未満であると、硬
化物の透明性が得られず、1000重量部を超える
と、強度が不十分となる。
電気絶縁材料は各成分を所定量配合し、混練し
て硬化することにより得られる。硬化は通常、0
〜200℃、好ましくは10〜150℃にて0.5〜180分
間、好ましくは5〜60分間行なう。この場合、ま
ず(A)成分と(C)成分を混合したのち、(B)成分を加え
て混練、硬化することが望ましい。
次に、第2発明について説明する。
第1発明における電気絶縁材料の機械的物性を
改善するため、上記(A)、(B)、(C)成分に加えて(D)成
分を配合したものが第2発明の電気絶縁材料であ
る。
(A)成分、(B)および(C)成分は第1発明で説明した
ものと同じである。
本発明の(D)成分である石油樹脂はナフサ等の熱
分解によるエチレンの製造の際に副生する分解ガ
ソリンから芳香族化合物を回収した蒸留残渣油
(多種成分の混合物)をフリーデル・クラフト触
媒により重合して得られるロジン状の樹脂であ
る。石油樹脂は軟化点が40〜200℃程度のものが
好適である。
本発明の電気絶縁材料を構成する上記(A)、(B)、
(C)および(D)成分の配合割合については、特に制限
はないが、通常は(A)成分100重量部に対して(B)成
分0.1〜500重量部、好ましくは1〜200重量部、
(C)成分10〜1000重量部、好ましくは30〜500重量
部、(D)成分10〜1000重量部、好ましくは30〜500
重量部である。(B)成分および(C)成分の配合量が上
記範囲外であると好ましくない理由は、前記第1
発明にて説明した通りである。(D)成分が10重量部
未満であると、すぐれた機械的物性が得られず、
また1000重量部を越えると、ゴム的性質に劣り可
撓性に欠けるものとなる。
第2発明の電気絶縁材料は第1発明と同様にし
て製造することができる。なお、この場合にまず
(A)成分、(C)成分および(D)成分をを混合し、しかる
後(B)成分を加えて混練、硬化することが望まし
い。
〔発明の効果〕
上述の如く、第1および第2発明に係る電気絶
縁材料は通常、板状の硬化体として成形され、
ICプリント基板、ICポツテイング材、トランス
含浸ワニス、コンデンサーコイル含浸ワニス等の
電気絶縁材料として使用される。本発明の電気絶
縁材料は透明性に優れており、プリント基板等の
配線状態、部品の状態、塗布状態等の視認が容易
であるほか、体積抵抗率等の電気的特性が良好
で、特に第2発明の材料は機械的物性も優れてお
り、電気絶縁材料として極めて有効に利用し得る
ものである。
〔実施例〕
次に、実施例により本発明を詳しく説明する。
実施例 1、2
第1表に示す水酸基含有液状ジエン系重合体と
多環芳香族炭化水素を300mlセパラブルフラスコ
に入れ、60℃、1mmHgにて1時間加熱撹拌して
水分を除去した。次いで、25℃まで冷却したのち
60℃で溶融したポリイソシアネート化合物を撹拌
しながら素早く添加し、25℃に保持して2時間加
熱撹拌した。
次いで、この混合物を室温まで冷却し、厚さ2
mmのシート金型に流し込み、23℃で湿度60%の恒
湿器中にて2週間湿気硬化させシート成形物を製
造した。このシートの物性を測定した。結果を第
1表に示す。
実施例 3
第1表に示す水酸基含有液状ジエン系重合体、
多環芳香族炭化水素および石油樹脂を実施例1、
2と同様に処理したのち、実施例1、2と同様に
してポリイソシアネート化合物を加え、加熱撹拌
した。
以下、実施例1、2と同様にしてシート成形物
を得た。このシートの物性の測定結果を第1表に
示す。
比較例 1
多環芳香族炭化水素を加えなかつたこと以外は
実施例1、2と同様に行なつた。結果を第1表に
示す。
[Industrial Field of Application] The present invention relates to an electrically insulating material, and more particularly to an electrically insulating material that is transparent and has excellent electrical properties. [Prior art and problems to be solved by the invention] Conventionally, cured products of compositions consisting of diene polymers such as hydroxyl group-containing liquid polybutane diene and polyisocyanates such as diphenylmethane diisocyanate have been used as electrical insulating materials. is known. However, since this material has poor transparency, it is difficult to visually check the wiring state when used for a printed circuit board. There was also room for improvement in electrical properties such as volume resistivity. Therefore, the present inventors conducted intensive research to develop an electrically insulating material that solved these problems, and as a result, they completed the present invention. [Means for Solving the Problems] That is, the present invention comprises (A) a hydroxyl group-containing liquid diene polymer (hereinafter referred to as component (A)), (B) a polyisocyanate compound (hereinafter referred to as component (B)). ) and (C)
As described later, an electrical insulating material (hereinafter referred to as the first (referred to as an invention).
and an electrical insulating material (hereinafter referred to as the second invention) made by further blending (D) petroleum resin (hereinafter referred to as (D) component) to these components (A), (B), and (C). . First, the first invention will be explained. The hydroxyl group-containing liquid diene polymer, component (A) of the present invention, has hydroxyl groups in the molecule, preferably at the end of the molecule, and has a number average molecular weight of 300 to 25,000, preferably
500 to 10,000, and the hydroxyl group content is 0.1 to 10 meq/g, preferably 0.5 to 5 meq/g.
It is g. These liquid diene polymers include diene polymers and diene copolymers having 4 to 12 carbon atoms, and also combinations of these diene monomers with α-carbon atoms having 2 to 22 carbon atoms.
Examples include copolymers with olefinic addition polymerizable monomers. Specifically, butadiene homopolymer,
Isoprene homopolymer, butadiene-styrene copolymer, butadiene-isoprene copolymer, butadiene-acrylonitrile copolymer,
Examples include butadiene-2-ethylhexyl acrylate copolymer and butadiene-n-octadecyl acrylate copolymer. These liquid diene polymers can be produced, for example, by subjecting a conjugated diene monomer to a heating reaction in a liquid reaction medium in the presence of hydrogen peroxide. The polyisocyanate compound which is the component (B) of the present invention is an organic compound having two or more isocyanate groups in one molecule, and which reacts with the hydroxyl group of the hydroxyl group-containing liquid diene polymer of the component (A). It has a natural isocyanate group. Examples of polyisocyanate compounds include the usual aromatic, aliphatic and cycloaliphatic ones, such as tolylene diisocyanate, hexamethylene diisocyanate, diphenylmethane diisocyanate (MDI), liquid modified diphenylmethane diisocyanate. , polymethylene polyphenyl isocyanate, xylylene diisocyanate, cyclohexyl diisocyanate, cyclohexane phenylene diisocyanate, naphthalene-1,5-
Diisocyanate, isopropylbenzene-2,
Examples include 4-diisocyanate, an addition reaction product of polypropylene glycol and tolylene diisocyanate, and particularly preferred are MDI, liquid modified diphenylmethane diisocyanate, and tolylene diisocyanate. Next, the polycyclic aromatic hydrocarbon which is component (C) has the general formula and general formula At least one type of polycyclic aromatic hydrocarbon selected from the compounds represented by is used. In general formulas () and (), R 1 , R 2 , R 3 , R 4 ,
R 5 , R 6 , R 7 and R 8 represent a hydrogen atom or a lower alkyl group. Here, the lower alkyl group is an alkyl group having about 1 to 5 carbon atoms, and includes a methyl group,
Examples include ethyl group, propyl group, t-butyl group, and the like. R 1 to R 8 may be the same or different. Moreover, n represents an integer of 1 to 3. Specific examples of polycyclic aromatic compounds are shown below. Polycyclic aromatic compounds may be used alone or in combination of two or more. There is no particular restriction on the blending amount of the above three components constituting the electrical insulating material of the first invention, but usually 0.1 to 500 parts by weight of component (B), preferably 1 to 200 parts by weight of component (B) per 100 parts by weight of component (A). parts by weight, component (C) 10 to 1000 parts by weight,
Preferably it is 30 to 500 parts by weight. If the amount of component (B) is outside the above range, sufficient curing will not occur. Furthermore, if the amount of component (C) is less than 10 parts by weight, the cured product will not have transparency, and if it exceeds 1000 parts by weight, the strength will be insufficient. The electrically insulating material is obtained by blending predetermined amounts of each component, kneading, and curing. Curing is usually 0
It is carried out at ~200°C, preferably 10-150°C, for 0.5-180 minutes, preferably 5-60 minutes. In this case, it is desirable to first mix components (A) and (C), then add component (B), knead, and cure. Next, the second invention will be explained. In order to improve the mechanical properties of the electrically insulating material of the first invention, the electrically insulating material of the second invention is a material containing component (D) in addition to the components (A), (B), and (C) above. . Components (A), (B) and (C) are the same as those explained in the first invention. The petroleum resin, which is component (D) of the present invention, is a distillation residue oil (mixture of various components) obtained by recovering aromatic compounds from cracked gasoline, which is a by-product during the production of ethylene by thermal decomposition of naphtha, etc. It is a rosin-like resin obtained by polymerization using a catalyst. The petroleum resin preferably has a softening point of about 40 to 200°C. The above (A), (B) constituting the electrically insulating material of the present invention,
There is no particular restriction on the blending ratio of components (C) and (D), but usually 0.1 to 500 parts by weight, preferably 1 to 200 parts by weight of component (B) to 100 parts by weight of component (A),
Component (C) 10 to 1000 parts by weight, preferably 30 to 500 parts by weight, Component (D) 10 to 1000 parts by weight, preferably 30 to 500 parts by weight
Parts by weight. The reason why it is undesirable for the blending amounts of component (B) and component (C) to be outside the above range is as follows.
This is as explained in the invention. If component (D) is less than 10 parts by weight, excellent mechanical properties will not be obtained;
Moreover, if it exceeds 1000 parts by weight, the rubbery properties will be poor and the product will lack flexibility. The electrically insulating material of the second invention can be manufactured in the same manner as the first invention. In this case, first
It is desirable to mix component (A), component (C) and component (D), then add component (B), knead and cure. [Effects of the Invention] As described above, the electrical insulating materials according to the first and second inventions are usually formed as a plate-shaped cured body,
Used as an electrical insulation material for IC printed circuit boards, IC potting materials, transformer impregnated varnish, capacitor coil impregnated varnish, etc. The electrical insulating material of the present invention has excellent transparency, which makes it easy to visually check the wiring state of printed circuit boards, the state of parts, the coating state, etc., and has good electrical properties such as volume resistivity. The material of the second invention also has excellent mechanical properties and can be used extremely effectively as an electrical insulating material. [Example] Next, the present invention will be explained in detail with reference to Examples. Examples 1 and 2 The hydroxyl group-containing liquid diene polymer shown in Table 1 and the polycyclic aromatic hydrocarbon were placed in a 300 ml separable flask and heated and stirred at 60° C. and 1 mmHg for 1 hour to remove water. Then, after cooling to 25℃
The polyisocyanate compound melted at 60°C was quickly added while stirring, and the mixture was heated and stirred at 25°C for 2 hours. The mixture is then cooled to room temperature and formed to a thickness of 2
The mixture was poured into a sheet mold with a diameter of 1.5 mm and cured in a humidifier at 23° C. and 60% humidity for two weeks to produce a sheet molded product. The physical properties of this sheet were measured. The results are shown in Table 1. Example 3 Hydroxyl group-containing liquid diene polymer shown in Table 1,
Polycyclic aromatic hydrocarbon and petroleum resin in Example 1,
After the same treatment as in Example 2, a polyisocyanate compound was added in the same manner as in Examples 1 and 2, and the mixture was heated and stirred. Thereafter, a sheet molded product was obtained in the same manner as in Examples 1 and 2. Table 1 shows the measurement results of the physical properties of this sheet. Comparative Example 1 The same procedure as in Examples 1 and 2 was carried out except that no polycyclic aromatic hydrocarbon was added. The results are shown in Table 1.
【表】【table】
Claims (1)
ソシアネート化合物および(C)一般式 【式】および 一般式 (式中、R1,R2,R3,R4,R5,R6,R7および
R8は、それぞれ水素原子あるいは低級アルキル
基を示す。但し、R1〜R8は同一でも異なつてい
ても良い。また、nは1〜3の整数を示す。) で表される化合物から選択される、少なくとも1
種の多環芳香族炭化水素からなる電気絶縁材料。 2 (A)水酸基含有液状ジエン系重合体、(B)ポリイ
ソシアネート化合物および(C)一般式 【式】および 一般式 (式中、R1,R2,R3.R4,R5,R6,R7および
R8は、それぞれ水素原子あるいは低級アルキル
基を示す。但し、R1〜R8は同一でも異なつてい
ても良い。また、nは1〜3の整数を示す。) で表される化合物から選択される、少なくとも1
種の多環芳香族炭化水素および(D)石油樹脂からな
る電気絶縁材料。[Claims] 1 (A) hydroxyl group-containing liquid diene polymer, (B) polyisocyanate compound, and (C) general formula [formula] and general formula (In the formula, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and
R 8 each represents a hydrogen atom or a lower alkyl group. However, R 1 to R 8 may be the same or different. Moreover, n represents an integer of 1 to 3. ) at least one selected from the compounds represented by
Electrical insulating material consisting of various polycyclic aromatic hydrocarbons. 2 (A) hydroxyl group-containing liquid diene polymer, (B) polyisocyanate compound, and (C) general formula [formula] and general formula (In the formula, R 1 , R 2 , R 3 .R 4 , R 5 , R 6 , R 7 and
R 8 each represents a hydrogen atom or a lower alkyl group. However, R 1 to R 8 may be the same or different. Moreover, n represents an integer of 1 to 3. ) at least one selected from the compounds represented by
An electrical insulating material consisting of a variety of polycyclic aromatic hydrocarbons and (D) petroleum resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60037537A JPS61197620A (en) | 1985-02-28 | 1985-02-28 | Electrical insulation material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60037537A JPS61197620A (en) | 1985-02-28 | 1985-02-28 | Electrical insulation material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61197620A JPS61197620A (en) | 1986-09-01 |
JPH0410890B2 true JPH0410890B2 (en) | 1992-02-26 |
Family
ID=12500273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60037537A Granted JPS61197620A (en) | 1985-02-28 | 1985-02-28 | Electrical insulation material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61197620A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015137220A1 (en) | 2014-03-11 | 2015-09-17 | シチズン電子株式会社 | Push-button switch |
-
1985
- 1985-02-28 JP JP60037537A patent/JPS61197620A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61197620A (en) | 1986-09-01 |
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