JPH04108555A - Spray apparatus - Google Patents

Spray apparatus

Info

Publication number
JPH04108555A
JPH04108555A JP2227259A JP22725990A JPH04108555A JP H04108555 A JPH04108555 A JP H04108555A JP 2227259 A JP2227259 A JP 2227259A JP 22725990 A JP22725990 A JP 22725990A JP H04108555 A JPH04108555 A JP H04108555A
Authority
JP
Japan
Prior art keywords
spraying
printed circuit
circuit board
agent
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2227259A
Other languages
Japanese (ja)
Inventor
Hisayoshi Nagatani
永谷 壽啓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP2227259A priority Critical patent/JPH04108555A/en
Publication of JPH04108555A publication Critical patent/JPH04108555A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0091Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/60Arrangements for mounting, supporting or holding spraying apparatus
    • B05B15/68Arrangements for adjusting the position of spray heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • B05B13/0264Overhead conveying means, i.e. the object or other work being suspended from the conveying means; Details thereof, e.g. hanging hooks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B05B13/0405Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333Deposition techniques, e.g. coating
    • H05K2203/1366Spraying coating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1518Vertically held PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1572Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spray Control Apparatus (AREA)

Abstract

PURPOSE:To carry out spray work in an extremely efficient manner by arranging spray members simultaneously ejecting a spray agent on both sides of the passing position of the substrate fed by a conveyor. CONSTITUTION:Coating guns 17, 17 simultaneously ejecting a coating agent are symmetrically arranged on both sides of the passing position of a printed circuit board 5 fed by a conveyor 11 in opposed relationship. The coating guns 17, 17 are supported by an arm 16 and controlled in the same timing so that the ejecting amounts and pressures of the coating agent from the coating guns 17, 17 become equal. The coating guns 17, 17 are supported by a housing 15 and the arm 16 to be moved and drive within the plane parallel to the flat surface of the printed circuit board 15 to simultaneously spray the coating agent to both surfaces of the printed circuit board 5. By this method, a spray agent can always be sprayed in a stable state.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、コンベアにより搬送される平板状の基板に対
して例えば塗装ガン等の吹付部材から吹付剤を吐出させ
、上記基板の両面に上記吹付剤を吹き付ける吹付装置に
関し、特に、プリント基板へ表面コーティング剤を吹き
付ける吹付装置として好適である。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention involves discharging a spraying agent from a spraying member such as a painting gun onto a flat substrate conveyed by a conveyor, and applying the above-mentioned spraying agent to both sides of the substrate. Regarding a spraying device that sprays a spraying agent, it is particularly suitable as a spraying device that sprays a surface coating agent onto a printed circuit board.

〔従来技術〕[Prior art]

一般に、プリント基板では、基板素地の表・裏面に対し
てコーティング剤が吹き付けられ、抵抗。
Generally, in printed circuit boards, a coating agent is sprayed on the front and back sides of the base board to create resistance.

ダイオード、ICチップ等の半田付は部分を除いて電気
信号回路を外気から遮断するように構成されている。
The soldering of diodes, IC chips, etc. is configured to isolate the electrical signal circuit from the outside air except for some parts.

そして、′上記プリント基板は、その厚み寸法が厚手の
もの(約10m5+)から薄手のもの(1mm以下のフ
ィルム状)に移行してきている。
The thickness of the above-mentioned printed circuit boards has been shifting from thick ones (approximately 10 m5+) to thin ones (film-like ones of 1 mm or less).

先ず、第4図に基づいて、厚手のプリント基板lにコー
ティング剤を吹き付ける場合の手順について説明する。
First, based on FIG. 4, a procedure for spraying a coating agent onto a thick printed circuit board 1 will be described.

上記プリント基板1は、その表面を横たえた状態で治具
2により各角部を支持されてローラ式のコンベア3によ
り搬送される。
The printed circuit board 1 is conveyed by a roller conveyor 3 with each corner supported by a jig 2 while lying on its surface.

上記プリント基板lが吹付位置で停止されると、上記プ
リント基Filを支持する上記治具2が上昇移動され、
該プリント基板1の表面に例えば塗装ロボット4にてコ
ーティング剤が吹き付けられる。
When the printed board l is stopped at the spraying position, the jig 2 supporting the printed board Fil is moved upward,
A coating agent is sprayed onto the surface of the printed circuit board 1 by a coating robot 4, for example.

上記プリント基Filの片面への吹付作業が終了する出
、上記プリント基板Jは反転されて、該プリント基板1
の他面側へのコーティング剤の吹付作業が実施される。
After the spraying work of the printed circuit board Fil on one side is completed, the printed circuit board J is turned over and the printed circuit board 1 is turned over.
The coating agent is sprayed onto the other side.

引き続き、第5図(a)、(ハ)に基づいて、薄手のプ
リント基板5にコーティング剤を吹き付ける場合の手順
について説明する。
Subsequently, the procedure for spraying the coating agent onto the thin printed circuit board 5 will be explained based on FIGS. 5(a) and 5(c).

この薄手のプリント基板5は、前記したような厚手のプ
リント基板lの場合のようにその表面を横たえた状態で
支持すると自重によって下方へ撓むことから、該プリン
ト基板5は垂下された状態で支持される。
If this thin printed circuit board 5 is supported with its surface lying down as in the case of the thick printed circuit board 1 described above, it will bend downward due to its own weight, so the printed circuit board 5 will be in a hanging state. Supported.

即ち、上記プリント基板5の上下両端部がそれぞれ複数
のクリップ6にて挟持され、上方に位置するクリップ6
はハンガー7に取り付けられている。下方に位置するク
リップ6も、コイルスプリング8を介して上記ハンガー
7に取り付けられている。上記のようにしてプリント基
板5に弾性的な張力を付与することにより、該プリント
基板5の面を平板状と成し得るように配慮されている。
That is, both upper and lower ends of the printed circuit board 5 are held by a plurality of clips 6, respectively, and the clip 6 located above
is attached to the hanger 7. The clip 6 located below is also attached to the hanger 7 via a coil spring 8. By applying elastic tension to the printed circuit board 5 as described above, consideration is given to making the surface of the printed circuit board 5 flat.

そして、上記クリップ6を支持する上記ハンガー7は、
コンヘア9によって搬送される。
The hanger 7 that supports the clip 6 is
Conveyed by Conhair 9.

上記のようにしてコンヘア9により支持されて搬送され
るプリント基板5が吹付位置で停止されると、塗装ロボ
・7ト4によりその表面にコーティング剤が吹き付けら
れる。
When the printed circuit board 5 supported and conveyed by the container 9 as described above is stopped at the spraying position, the coating robot 7 sprays the coating agent onto its surface.

上記のようにしてプリント基板5の片面へのコーティン
グ剤の吹付作業が終了すると、上記プリント基板5は反
転されてその他面側に対してもコティング剤の吹付作業
が実施される。
When the spraying operation of the coating agent on one side of the printed circuit board 5 is completed as described above, the printed circuit board 5 is turned over and the operation of spraying the coating agent on the other side is also carried out.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところが、上記のような従来の吹付装置においては、上
述の如く、プリント基板1,5に対するコーティング剤
の吹き付けは片面づつに対して実施されることから、作
業としては2工程を必要とされ、吹付効率が悪いという
不具合があった。
However, in the conventional spraying device as described above, since the coating agent is sprayed on each side of the printed circuit boards 1 and 5 as described above, two steps are required, and the spraying The problem was that it was inefficient.

更に、薄手の上記プリント基板5に対しては、コイルス
プリング8により該プリント基板5を弾性的に引っ張っ
ているものの、塗装ロボット4からのコーティング剤の
吹き付けの際の圧力(吹付圧)によって、プリント基板
5自体が撓んだり、或いは揺れ動き、吹付ムラを生して
膜厚が不均一になるという問題点があった。
Furthermore, although the thin printed circuit board 5 is elastically pulled by the coil spring 8, the pressure (spraying pressure) when the coating agent is sprayed from the painting robot 4 causes the printing There was a problem in that the substrate 5 itself was bent or swayed, causing uneven spraying and resulting in non-uniform film thickness.

そこで、本発明の目的とするところは、基板の両面に対
して吹付剤の吹き付けを同時に行って、極めて効率良く
吹付作業を実施し得ると共に、上記基板が薄手のもので
あっても、該基板を吹付剤の吹き付けの際における吹付
圧によって撓ませることなく、常時安定した状態で吹付
剤を吹き付は得る吹付装置を提供することである。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to simultaneously spray a spraying agent onto both sides of a substrate, thereby making it possible to carry out the spraying work extremely efficiently, and even when the substrate is thin. To provide a spraying device capable of spraying a spraying agent in a stable state at all times without being deflected by the spraying pressure during spraying of the spraying agent.

〔課題を解決するための手段〕[Means to solve the problem]

上記目的を達成するために、本発明が採用する主たる手
段は、その要旨とするところが、コンベアにより搬送さ
れる平板状の基板に対して基台により支持された吹付部
材から吹付剤を吐出させ、上記基板に上記吹付剤を吹き
付ける吹付装置において、上記コンベアにより搬送され
る上記基板の通過位置を挟んでその両側に、吹付剤を同
時に吐出させる吹付部材を配備し、上記基板の両面に吹
付剤を同時に吹き付けるようにした点に係る吹付装置で
ある。
In order to achieve the above object, the main means adopted by the present invention is that a spraying agent is discharged from a spraying member supported by a base onto a flat substrate conveyed by a conveyor, In a spraying device that sprays the spraying agent onto the substrate, spraying members that simultaneously discharge the spraying agent are provided on both sides of the passing position of the substrate conveyed by the conveyor, and the spraying agent is sprayed onto both sides of the substrate. This is a spraying device that sprays at the same time.

更に、当該装置においては、上記吹付部材を上記基板の
通過位置に対して対称に配備してもよい。
Furthermore, in the apparatus, the spraying member may be arranged symmetrically with respect to the passage position of the substrate.

〔作用〕[Effect]

本発明に係る吹付装置によれば、コンヘアにより搬送さ
れる基板の通過位置を挟んでその両側に配備された吹付
部材により、上記基板の両面に吹付剤が同時に吹き付け
られる。
According to the spraying device according to the present invention, the spraying agent is simultaneously sprayed onto both sides of the substrate by the spraying members arranged on both sides of the passing position of the substrate conveyed by the conhair.

更に、上記吹付部材を上記基板の通過位置に対して対称
に配備することにより、上記基板の同一部位にその両面
から吹付圧が作用することとなり、該基板が薄手のもの
であっても撓んだり或いは揺れ動くという不具合は回避
される。
Furthermore, by arranging the spray member symmetrically with respect to the passage position of the board, the spray pressure will be applied to the same part of the board from both sides, so that even if the board is thin, it will not bend. Problems such as shaking or shaking are avoided.

〔実施例〕〔Example〕

以下添付図面を参照して、本発明を具体化した実施例に
つき説明し、本発明の理解に供する。尚、以下の実施例
は、本発明を具体化した一例であっで、本発明の技術的
範囲を限定する性格のものではない。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples embodying the present invention will be described below with reference to the accompanying drawings to provide an understanding of the present invention. It should be noted that the following examples are examples embodying the present invention, and are not intended to limit the technical scope of the present invention.

ここに、第1図は本発明の一実施例に係る吹付装置の概
略構造を示すものであって、同図(a)は斜視図、同図
0))は部分側面図、第2図及び第3回はそれぞれ本発
明の他の実施例に係る吹付装置の概略構造を示す部分側
面図である。
Here, FIG. 1 shows a schematic structure of a spraying device according to an embodiment of the present invention, in which FIG. 1A is a perspective view, FIG. 0) is a partial side view, and FIGS. The third part is a partial side view showing a schematic structure of a spraying device according to another embodiment of the present invention.

この実施例に係る吹付装置10では、第1図(a) 。The spraying device 10 according to this embodiment is shown in FIG. 1(a).

(b)に示す如く、例えば薄手のプリント基板5が、コ
ンベア11により吊り下げられるようにその上端部を保
持されている。即ち、上記プリント基板5の上端部がク
リップ12により挟持されて、該クリップ12はハンガ
ー13に取り付けられている。そして、上記ハンガー1
3は、上記コンベア11により搬送される。
As shown in (b), for example, a thin printed circuit board 5 is held at its upper end so as to be suspended by the conveyor 11. That is, the upper end of the printed circuit board 5 is held by a clip 12, and the clip 12 is attached to a hanger 13. And the above hanger 1
3 is conveyed by the conveyor 11.

上記コンベア11の側部と対向する位置にはベース14
が配備されており、該ベース14上には上記コンベア1
1の搬送方向と平行に移動可能な筺体15が配備されて
いる。上記筺体15上には、上記コンヘア11の搬送方
向に対して垂直方向へ移動可能なアーム16(基台)が
配備されている。
A base 14 is located at a position facing the side of the conveyor 11.
is provided, and the conveyor 1 is placed on the base 14.
A housing 15 is provided that is movable in parallel to the conveyance direction of the paper. An arm 16 (base) movable in a direction perpendicular to the conveyance direction of the conhair 11 is provided on the housing 15.

上記コンヘア11により搬送される上記プリント基板5
の通過位置を挾んでその両側に、コーティング剤を同時
に吐出させる塗装ガン17.17(吹付部材)が対称に
対向配備されており、該塗装ガン17.17は上記アー
ム16により支持されている。
The printed circuit board 5 transported by the conhair 11
Coating guns 17.17 (spraying members) for simultaneously discharging the coating agent are arranged symmetrically and oppositely on both sides of the passing position of the coating agent, and the coating guns 17.17 are supported by the arm 16.

上記塗装ガン17.17は、該塗装ガン17゜17から
のコーティング剤の吐出量及び吐出圧等が等しくなるよ
うに同一のタイミングにて制御される。そして、上記塗
装ガン17.17は、上記筐体15及びアーム16によ
り支持されて上記プリント基板5の平面と平行な面内に
おいて移動駆動され、上記プリント基板5の両面にコー
ティング剤を同時に吹き付けることができる。
The coating guns 17.17 are controlled at the same timing so that the discharge amount and discharge pressure of the coating agent from the coating guns 17.17 are equal. The coating gun 17.17 is supported by the casing 15 and the arm 16 and is driven to move in a plane parallel to the plane of the printed circuit board 5, and sprays the coating agent onto both sides of the printed circuit board 5 at the same time. I can do it.

従って、本実施例装置によれば、プリント基板5(前記
プリント基板1の場合も同様)の両面に対してコーティ
ング剤の吹付を同時に行って極めて効率良く吹付作業を
実施することができる。
Therefore, according to the apparatus of this embodiment, the coating agent can be sprayed on both sides of the printed circuit board 5 (the same applies to the printed circuit board 1) at the same time, and the spraying operation can be carried out extremely efficiently.

又、上記プリント基板5へのコーティング剤の吹付作業
は単一の工程において実施されることから、従来装置の
場合よりもその吹付ラインの設置長さを短縮することが
でき、それに伴って搬送設備費を低減させることができ
る。同時に、複数の塗装ガンを単一のアーム16にて支
持させていることから、吹付装置自体に係るコストも低
減させることができる。
Furthermore, since the spraying operation of the coating agent onto the printed circuit board 5 is carried out in a single process, the installation length of the spraying line can be shortened compared to the case of conventional equipment, and accordingly, the installation length of the spraying line can be shortened compared to the case of conventional equipment. Costs can be reduced. At the same time, since a plurality of painting guns are supported by a single arm 16, the cost of the spraying device itself can be reduced.

更に又、上記コンベア11への上記プリント基板5の取
り付けは、その上端部のみをクリップ12にて挟持すれ
ばよく、その取付作業の効率も飛躍的に向上される。
Furthermore, the printed circuit board 5 can be attached to the conveyor 11 by holding only its upper end with the clips 12, and the efficiency of the attachment work is dramatically improved.

そして、上記プリント基板5へのコーティング剤の吹き
付けの際には、上述の如く、同一部位に対してその両面
から同一タイミングにて同一の吹付圧によってそれぞれ
コーティング剤が吹き付けられる為、該プリント基板5
の平面に作用する力は打ち消し合うこととなり、薄手の
上記プリント基板5であっても該プリント基板5は従来
装置の場合のように撓んだり或いは揺れ動くという事態
は回避される。その結果、常に安定した状態で均一な膜
厚のコーティング層を形成することができる。
When spraying the coating agent onto the printed circuit board 5, as described above, the coating agent is sprayed onto the same portion from both sides at the same timing and with the same spray pressure.
The forces acting on the plane of the device cancel each other out, and even if the printed circuit board 5 is thin, the printed circuit board 5 is prevented from being bent or swaying as in the case of the conventional device. As a result, a coating layer with a uniform thickness can always be formed in a stable state.

尚、上記塗装ガン17.17からコーティング剤を吐出
させる際の吹付圧は、比較的小さな値とすることにより
、より高品質のコーティング層を得ることができる。
Note that by setting the spraying pressure when discharging the coating agent from the coating gun 17, 17 to a relatively small value, a coating layer of higher quality can be obtained.

第2図に示す他の実施例に係る吹付装置では、塗装ガン
17.17がそれぞれの軸芯が同一の角度(α)をもっ
て下向きとなるように支持されている。
In a spraying device according to another embodiment shown in FIG. 2, the coating guns 17, 17 are supported such that their respective axes point downward at the same angle (α).

上記のように構成することにより、該塗装ガン17.1
7の間からプリント基板5が通過した後において、上記
塗装ガン17.17から相互にコーティング剤が吐出さ
れてもこのコーティング剤によって上記塗装ガン17.
17が相互に汚されるという不具合は回避される。
By configuring as described above, the painting gun 17.1
Even if the coating agent is discharged from the painting guns 17.17 to each other after the printed circuit board 5 has passed between the spaces between the painting guns 17.
The problem that 17 is contaminated with each other is avoided.

第3図に示す更に他の実施例に係る吹付装置では、上記
塗装ガン17.17を上記プリント基板5の通過位置に
対して対称的に移動させる移動機構18を具備して構成
されている。
A spraying device according to yet another embodiment shown in FIG. 3 is constructed with a moving mechanism 18 for moving the coating gun 17, 17 symmetrically with respect to the position where the printed circuit board 5 passes.

即ち、前記筺体15上に、前記アーム16に代えてスラ
イド台19が配備されており、該スライド台19上の軸
芯方向には、中央部を境に逆方向のオネジが刻設された
ネジ軸20が回転自在に配備されている。そして、上記
ネジ軸20には、上記塗装ガン17.17を支持するア
ーム21.21の各基部側がスライド自在に噛合されて
いる。
That is, a slide stand 19 is provided on the housing 15 in place of the arm 16, and a screw with a male thread in the opposite direction is formed in the axial direction on the slide stand 19. A shaft 20 is rotatably provided. Each base side of an arm 21.21 supporting the painting gun 17.17 is slidably engaged with the screw shaft 20.

そして、上記7ジ軸20が例えばエアモータ22にて回
転駆動されることにより、上記塗装ガン17.17は上
記プリント基板5の通過位置に対して対称的に移動され
る。
By rotationally driving the 7-axis shaft 20 by, for example, an air motor 22, the coating guns 17, 17 are moved symmetrically with respect to the position where the printed circuit board 5 passes.

上記のように塗装ガン17.17を対称的に移動可能と
することにより、上記プリント基vifや5の大きさや
厚さによってコーティング剤の膜厚を変更する場合、コ
ーティング剤の吐出量、吐出圧、吹付パターン幅等の調
整と共に上記プリント基板1,5に対する塗装ガン17
.17の距離を調整してより効果的に対応することがで
きる。
By making the coating guns 17 and 17 symmetrically movable as described above, when changing the film thickness of the coating agent depending on the size and thickness of the printing base vif and 5, the discharge amount and the discharge pressure of the coating agent can be changed. , the coating gun 17 for the printed circuit boards 1 and 5 while adjusting the spray pattern width, etc.
.. 17 distance can be adjusted to respond more effectively.

〔発明の効果〕〔Effect of the invention〕

本発明は、上記したように、コンヘアにより搬送される
平板状の基板に対して基台により支持された吹付部材か
ら吹付剤を吐出させ、上記基板5二上記吹付剤を吹き付
ける吹付装置において、上記コンヘアにより搬送される
上記基板の通過位置を挟んでその両側に、吹付剤を同時
に吐出させる吹は部材を配備し、上記基板の両面に吹付
剤を同時に吹き付けるようにしたことを特徴とする吹付
装置であるから、基板の両面に対して吹付剤の吹き付け
を同時に行って極めて効率よく吹付作業を実施し得ると
共に、上記基板が薄手のものであっても、該基板を吹付
剤の吹き付けの際における吹付圧によって撓ませること
なく、常時安定した状態で吹付剤を吹き付けることがで
きる。
As described above, the present invention provides a spraying device for discharging a spraying agent from a spraying member supported by a base onto a flat substrate conveyed by a conhair, and spraying the spraying agent on the substrate 5. A spraying device characterized in that blowing members for simultaneously discharging a spraying agent are provided on both sides of the passing position of the substrate conveyed by a conhair, so that the spraying agent is simultaneously sprayed on both sides of the substrate. Therefore, the spraying agent can be sprayed on both sides of the substrate at the same time, and the spraying work can be carried out extremely efficiently. The spray agent can be sprayed in a stable state at all times without being deflected by spray pressure.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例に係る吹付装置の概略構造を
示すものであって、同図(a)は斜視図、同図(b)は
部分側面図、第2図及び第3図はそれぞれ本発明の他の
実施例に係る吹付装置の概略構造を示す部分側面図、第
4図は従来の吹付装置の概略構造を示す斜視図、第5図
は更に他の従来の吹付装置の概略構造を示すものであっ
て、同[m (a)は斜視図、同図(b)は部分側面図
である。 〔符号の説明〕 1.5・・・プリント基板 10・・・吹付装置 11・・・コンベア 12・・・クリップ 13・・・ハンガー 16.21・・・アーム(基台) 17・・・塗装ガン(吹付部材) 18・・・移動機構 20・・・ネジ軸 22・・・エアモータ
FIG. 1 shows a schematic structure of a spraying device according to an embodiment of the present invention, in which FIG. 1(a) is a perspective view, FIG. 1(b) is a partial side view, and FIGS. 2 and 3. 4 is a partial side view showing a schematic structure of a spray device according to another embodiment of the present invention, FIG. 4 is a perspective view showing a schematic structure of a conventional spray device, and FIG. 5 is a partial side view showing a schematic structure of a spray device according to another embodiment of the present invention. The schematic structure is shown in FIG. 1 (a) is a perspective view, and FIG. [Explanation of symbols] 1.5... Printed circuit board 10... Spraying device 11... Conveyor 12... Clip 13... Hanger 16. 21... Arm (base) 17... Painting Gun (spray member) 18...Movement mechanism 20...Screw shaft 22...Air motor

Claims (1)

【特許請求の範囲】 1、コンベアにより搬送される平板状の基板に対して基
台により支持された吹付部材から吹付剤を吐出させ、上
記基板に上記吹付剤を吹き付ける吹付装置において、上
記コンベアにより搬送される上記基板の通過位置を挟ん
でその両側に、吹付剤を同時に吐出させる吹付部材を配
備し、上記基板の両面に吹付剤を同時に吹き付けるよう
にしたことを特徴とする吹付装置。 2、上記吹付部材が上記基板の通過位置に対して対称に
配備されてなる請求項1に記載の吹付装置。
[Scope of Claims] 1. In a spraying device for discharging a spraying agent from a spraying member supported by a base onto a flat substrate conveyed by a conveyor, and spraying the spraying agent on the substrate, the conveyor A spraying device characterized in that spraying members for simultaneously discharging a spraying agent are disposed on both sides of a passing position of the substrate to be conveyed, so that the spraying agent is simultaneously sprayed on both sides of the substrate. 2. The spraying device according to claim 1, wherein the spraying member is arranged symmetrically with respect to the passage position of the substrate.
JP2227259A 1990-08-28 1990-08-28 Spray apparatus Pending JPH04108555A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2227259A JPH04108555A (en) 1990-08-28 1990-08-28 Spray apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2227259A JPH04108555A (en) 1990-08-28 1990-08-28 Spray apparatus

Publications (1)

Publication Number Publication Date
JPH04108555A true JPH04108555A (en) 1992-04-09

Family

ID=16858020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2227259A Pending JPH04108555A (en) 1990-08-28 1990-08-28 Spray apparatus

Country Status (1)

Country Link
JP (1) JPH04108555A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006346606A (en) * 2005-06-17 2006-12-28 Kazuyo Yanagida Coating apparatus and coating method using the same
CN111570132A (en) * 2020-04-07 2020-08-25 厦门鸿基伟业复材科技有限公司 Paint spraying system of annular product

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006346606A (en) * 2005-06-17 2006-12-28 Kazuyo Yanagida Coating apparatus and coating method using the same
CN111570132A (en) * 2020-04-07 2020-08-25 厦门鸿基伟业复材科技有限公司 Paint spraying system of annular product
CN111570132B (en) * 2020-04-07 2021-08-31 厦门鸿基伟业复材科技有限公司 Paint spraying system of annular product

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