JPH04107898U - Shield structure of printed wiring board - Google Patents
Shield structure of printed wiring boardInfo
- Publication number
- JPH04107898U JPH04107898U JP1589391U JP1589391U JPH04107898U JP H04107898 U JPH04107898 U JP H04107898U JP 1589391 U JP1589391 U JP 1589391U JP 1589391 U JP1589391 U JP 1589391U JP H04107898 U JPH04107898 U JP H04107898U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- receiving unit
- wiring board
- hole
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 3
- 230000000694 effects Effects 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003321 amplification Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Abstract
(57)【要約】
【目的】この考案は、受信ユニットの送信信号の侵入を
防止可能にしている。
【構成】送信ユニットと受信ユニットを同一の基板上に
実装する構造において、前記受信ユニットの周囲にスル
ーホールを形成し、少なくとも２つのスルーホールにメ
ッキを施したことを特徴としている。
(57) [Summary] [Purpose] This invention makes it possible to prevent intrusion of transmitted signals from the receiving unit. A structure in which a transmitting unit and a receiving unit are mounted on the same substrate is characterized in that a through hole is formed around the receiving unit, and at least two through holes are plated.
Description
【０００１】0001
この考案は、光センサ、超音波センサ、微小信号増巾回路に利用されるプリン ト配線板のシールド構造に関するものである。 This idea is based on printers used in optical sensors, ultrasonic sensors, and small signal amplification circuits. The present invention relates to a shield structure for a wiring board.
【０００２】0002
従来は、図４に図示したように、送信ユニットｃと受信ユニットｂとを同一の プリント配線基板上ａに実装した場合は、送信ユニットｃの送信信号ｄが受信ユ ニットｂに混入しないように、該基板ａの上面と下面をシールドケースｂ１、ｂ ２で覆って遮断する方法がある。 Conventionally, as shown in FIG. 4, transmitting unit c and receiving unit b are When mounted on a printed wiring board a, the transmitting signal d from the transmitting unit c is transmitted to the receiving unit. To prevent contamination with the knit b, cover the upper and lower surfaces of the board a with the shield cases b1 and b. There is a method to cover it with 2 and shut it off.
【０００３】 また、送信ユニットｃと受信ユニットｂを別々のプリント配線基板上に実装し 、受信ユニットｂ側をシールドケースで覆て置き、プリント配線基板同士を接合 する方法がある。0003 In addition, transmitting unit c and receiving unit b are mounted on separate printed wiring boards. , cover the receiving unit b side with a shield case, and connect the printed wiring boards together. There is a way to do it.
【０００４】0004
しかし、前記従来の技術では、前者の場合は、プリント配線基板の内部は、シ ールドされていないため、送信ユニットｃからの送信信号ｄが該基板ａの内部を 伝わって直接受信ユニットｂに侵入するという問題点がある。 However, in the above conventional technology, in the former case, the inside of the printed wiring board is Since the transmission signal d from the transmission unit c is not held, the transmission signal d from the transmission unit There is a problem in that the signal is transmitted and directly enters the receiving unit b.
【０００５】 また、後者の場合は、別体構成のため、コスト高になる上に、組み立て後２つ の基板の接合に手間が掛かるという問題点がある。[0005] In addition, in the latter case, since it is a separate structure, it is costly and requires two There is a problem in that it takes time and effort to bond the substrates.
【０００６】 そこで、本考案は、上記従来の技術の問題点に鑑みて創案されたもので、プリ ント配線基板に実装した送信ユニットからの送信信号の侵入を防止可能にするプ リント配線板のシールド構造の提供を目的としている。[0006] Therefore, the present invention was devised in view of the above-mentioned problems of the conventional technology. This is a printed circuit board that prevents the intrusion of transmitted signals from the transmitting unit mounted on the component wiring board. The purpose is to provide a shield structure for lint wiring boards.
【０００７】[0007]
【課題を解決するための手段】 上記目的を達成するため、本考案におけるプリント配線板のシールド構造にお いては、送信ユニットと受信ユニットを同一の基板上に実装する構造において、 前記受信ユニットの周囲にスルーホールを形成し、少なくとも２つのスルーホー ルにメッキを施したことを特徴としている。[Means to solve the problem] In order to achieve the above purpose, the shield structure of the printed wiring board in this invention is In a structure in which a transmitting unit and a receiving unit are mounted on the same board, A through hole is formed around the receiving unit, and at least two through holes are formed around the receiving unit. It is characterized by being plated on the surface.
【０００８】[0008]
プリント配線基板に実装される受信ユニットの周囲に、該ユニットの各辺とほ ぼ平行に、長穴のスルーホールを形成し、所定箇所の該スルーホールの内部にメ ッキを施してシールド効果を持たせる。 Around the receiving unit mounted on the printed wiring board, place around each side of the unit. Form elongated through holes approximately parallel to each other, and insert metal holes inside the through holes at predetermined locations. It is coated with a shielding effect.
【０００９】[0009]
実施例について図面を参照して説明する。図１〜図２において、プリント配線 基板２には、受信素子、プリアンプ等から構成された受信ユニット１と送信ユニ ット（図示省略）が実装されている。 Examples will be described with reference to the drawings. In Figures 1 and 2, printed wiring On the board 2, there is a receiving unit 1 consisting of a receiving element, a preamplifier, etc., and a transmitting unit. A cut (not shown) is implemented.
【００１０】 また、該受信ユニット１の周辺には、該ユニット１の周囲を囲むように、長穴 のスルーホール３が設けられている。このスルーホール３は、受信ユニット１の 各辺とほぼ平行な位置に形成するのがよい。0010 Further, around the receiving unit 1, a long hole is provided so as to surround the periphery of the unit 1. A through hole 3 is provided. This through hole 3 is connected to the receiving unit 1. It is best to form it at a position approximately parallel to each side.
【００１１】 また、所定スルーホール３の内部にはメッキを施してシールド効果を持たせて いる。[0011] In addition, the inside of the designated through hole 3 is plated to provide a shielding effect. There is.
【００１２】 即ち、受信ユニット１が分離しないように、少なくとも２箇所は基板部の繋が りを設ける。0012 In other words, to prevent the receiving unit 1 from separating, the board parts are connected at least in two places. Establishment of rules.
【００１３】 図３は、本考案の構造の別実施例であり、基板部が繋がっている部分から送信 信号が漏れて侵入するのを防止するため、前記スルーホール３の外側にさらにス ルーホール３１を、前記スルーホール３と一部が重なる形態で形成され、所定箇 所のスルーホール３１は、同様な手段でシールドされている。[0013] Figure 3 shows another embodiment of the structure of the present invention. In order to prevent signals from leaking and entering, an additional strip is installed outside the through hole 3. The through hole 31 is formed so as to partially overlap the through hole 3, and is formed in a predetermined position. The through hole 31 is shielded by similar means.
【００１４】 なお、部品面とはんだ面のシールド板（図示省略）は、必要に応じて取付けら れる。[0014] Note that the shield plates (not shown) on the component side and solder side can be attached as necessary. It will be done.
【００１５】[0015]
本考案は、上述の通り構成されているので、次に記載する効果を奏する。 プリント配線基板の内部は、スルーホールにメッキを施すことによりシールド されているため、送信ユニットからの送信信号が該基板の内部を伝わって直接受 信ユニットに侵入するのを防止できる。 Since the present invention is configured as described above, it produces the following effects. The inside of the printed wiring board is shielded by plating the through holes. Since the transmitting signal from the transmitting unit is transmitted through the inside of the board and received directly, It can prevent intrusion into the communication unit.
【００１６】 また、シールドはスルーホールにメッキを施すことにより形成されるため、他 のプリント配線基板でも同じパターンで製作でき、かつ経済的に製作できる。[0016] In addition, since the shield is formed by plating the through hole, other Printed wiring boards can be manufactured with the same pattern and can be manufactured economically.
【００１７】 また、プリント配線基板は分離構造としていないため、送信部と受信部の位置 関係が常に一定となり、安定した動作が得られる。[0017] Also, since the printed wiring board does not have a separate structure, the location of the transmitter and receiver The relationship is always constant, resulting in stable operation.
【００１８】 さらに、プリント配線基板のつなぎ目のところは、更にスルーホールを設ける とシールド効果が向上する。[0018] Furthermore, additional through holes are provided at the joints of the printed wiring boards. and the shielding effect is improved.
【提出日】平成４年１月２４日[Submission date] January 24, 1992
【手続補正１】[Procedural amendment 1]
【補正対象書類名】明細書[Name of document to be amended] Specification
【補正対象項目名】００１１[Correction target item name] 0011
【補正方法】変更[Correction method] Change
【００１１】 また、所定スルーホール３の内部にはメッキ４を施してシールド効果を持たせ ている。[0011] In addition, plating 4 is applied to the inside of the predetermined through hole 3 to provide a shielding effect. ing.
【図１】本考案の実施例の側面図である。FIG. 1 is a side view of an embodiment of the present invention.
【図２】本考案の実施例の平面図である。FIG. 2 is a plan view of an embodiment of the present invention.
【図３】本考案の別実施例の平面図である。FIG. 3 is a plan view of another embodiment of the present invention.
【図４】従来例の実施例の側面図である。FIG. 4 is a side view of a conventional example.
１ 受信ユニット ２ 送信ユニット ３ プリント配線基板 ４ スルーホール ５ メッキ 1 Receiving unit 2 Transmission unit 3 Printed wiring board 4 Through hole 5 Plating
─────────────────────────────────────────────────────
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【手続補正書】[Procedural amendment]
【提出日】平成４年１月２４日[Submission date] January 24, 1992
【手続補正２】[Procedural amendment 2]
【補正対象書類名】明細書[Name of document to be amended] Specification
【補正対象項目名】符号の説明[Correction target item name] Explanation of code
【補正方法】変更[Correction method] Change
【補正内容】[Correction details]
【符号の説明】 １ 受信ユニット ２ プリント配線基板 ３ スルーホール ４ メッキ ３１ スルーホール[Explanation of symbols] 1 Receiving unit 2 Printed wiring board 3 Through hole 4 Plating 31 Through hole
Claims (1)
上に実装する構造において、前記受信ユニットの周囲に
スルーホールを形成し、少なくとも２つのスルーホール
にメッキを施したことを特徴とするプリント配線板のシ
ールド構造。1. A printed wiring structure in which a transmitting unit and a receiving unit are mounted on the same substrate, wherein a through hole is formed around the receiving unit, and at least two through holes are plated. Board shield structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1589391U JPH04107898U (en) | 1991-02-27 | 1991-02-27 | Shield structure of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1589391U JPH04107898U (en) | 1991-02-27 | 1991-02-27 | Shield structure of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04107898U true JPH04107898U (en) | 1992-09-17 |
Family
ID=31903014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1589391U Pending JPH04107898U (en) | 1991-02-27 | 1991-02-27 | Shield structure of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04107898U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH088573A (en) * | 1994-06-21 | 1996-01-12 | Nec Corp | Structure for shield case |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6122698A (en) * | 1984-07-03 | 1986-01-31 | ヒューレット・パッカード・カンパニー | Electronic circuit module |
| JPS61174006A (en) * | 1985-01-29 | 1986-08-05 | Fujitsu Ltd | Address control system of storage cell |
-
1991
- 1991-02-27 JP JP1589391U patent/JPH04107898U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6122698A (en) * | 1984-07-03 | 1986-01-31 | ヒューレット・パッカード・カンパニー | Electronic circuit module |
| JPS61174006A (en) * | 1985-01-29 | 1986-08-05 | Fujitsu Ltd | Address control system of storage cell |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH088573A (en) * | 1994-06-21 | 1996-01-12 | Nec Corp | Structure for shield case |
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