JPH04105561U - surface mounted LED - Google Patents
surface mounted LEDInfo
- Publication number
- JPH04105561U JPH04105561U JP1454591U JP1454591U JPH04105561U JP H04105561 U JPH04105561 U JP H04105561U JP 1454591 U JP1454591 U JP 1454591U JP 1454591 U JP1454591 U JP 1454591U JP H04105561 U JPH04105561 U JP H04105561U
- Authority
- JP
- Japan
- Prior art keywords
- led
- overhanging
- board
- mounted led
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 claims abstract description 7
- 238000000465 moulding Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
(57)【要約】
【目的】 基板表面に安定的に固定され、しかも容易に
実装することができる表面実装型ＬＥＤを提供する。
【構成】 発光ダイオード１１から延出するリードフレ
ーム１２，１３と、このリードフレーム１２，１３から
側方へ一体的に張り出す張出部１４，１５と、この張出
部１４，１５を包囲し且つその張出端部１４ｂ，１５ｂ
を露出させるように樹脂モールドして形成されたベース
部１６とからなる。
(57) [Summary] [Purpose] To provide a surface-mounted LED that is stably fixed to the surface of a substrate and can be easily mounted. [Structure] Lead frames 12 and 13 extending from a light emitting diode 11, overhanging portions 14 and 15 integrally overhanging from the lead frames 12 and 13 to the sides, and surrounding the overhanging portions 14 and 15. and its overhanging ends 14b, 15b
The base part 16 is formed by resin molding so as to expose the base part 16.
Description
【０００１】0001
本考案は、発光ダイオード（以下、ＬＥＤという）、特にプリント基板等の表 面に実装される表面実装型ＬＥＤの改良に関するものである。 This invention applies to light emitting diodes (hereinafter referred to as LEDs), especially the front surface of printed circuit boards, etc. The present invention relates to an improvement of a surface-mounted LED that is mounted on a surface.
【０００２】0002
従来、ＬＥＤをプリント基板に実装する場合、図４に示すような技術が採用さ れている。 Conventionally, when mounting LEDs on printed circuit boards, the technology shown in Figure 4 has been adopted. It is.
【０００３】 図において、２は裏面に所定の回路パターンを形成したプリント基板であり、 この基板２には部品取付穴が穿設されている。この基板２の部品取付穴に多数の ＬＥＤ１のリードフレーム部分を挿入し、各ＬＥＤ１を所定の高さに保持してリ ードフレーム３，３の先端部を基板２の裏面から突出させた状態で、該基板２の 裏面を半田漕に漬けることにより、複数個のＬＥＤ１を基板上に同時に実装する ようにしている。0003 In the figure, 2 is a printed circuit board with a predetermined circuit pattern formed on its back surface. This board 2 is provided with holes for attaching parts. There are many parts mounting holes on this board 2. Insert the lead frame part of LED1, hold each LED1 at the specified height, and then reset. With the tips of the board frames 3, 3 protruding from the back surface of the board 2, Multiple LEDs 1 can be mounted on the board at the same time by dipping the back side in a solder bath. That's what I do.
【０００４】0004
ところで、上記ＬＥＤ１は、基板２上で細い金属線でなるリードフレーム３， ３のみによって支えられているため、僅かな外力が加わっただけでこのリードフ レーム３，３が折れ曲がって、ＬＥＤ全体が傾いてしまったり、リードフレーム ３，３が破断してしまうといった問題があった。 By the way, the LED 1 has a lead frame 3 made of a thin metal wire on a substrate 2. Since it is supported only by 3, this reed can be easily removed by applying a slight external force. Frames 3 and 3 may be bent and the entire LED may be tilted, or the lead frame may be bent. There was a problem that 3, 3 would break.
【０００５】 また、基板２に挿入したＬＥＤ１を半田付けする際には、ＬＥＤ１のリードフ レーム３を基板２の部品取付穴に挿入する際、各ＬＥＤ１を所定の高さに保持し て安定を保つための専用の治具を用意しなければならず、半田付け作業が煩雑で あるという欠点があった。 本考案は、上記の問題に鑑みて案出されたものであって、基板表面に安定的に 固定され、しかも容易に実装することができる表面実装型ＬＥＤを提供すること を目的とする。[0005] Also, when soldering the LED 1 inserted into the board 2, the lead-off of the LED 1 should be When inserting the frame 3 into the component mounting hole of the board 2, hold each LED 1 at a specified height. A special jig must be prepared to maintain stability, and the soldering work is complicated. There was a drawback. The present invention was devised in view of the above-mentioned problems, and is designed to stably attach to the surface of the substrate. To provide a surface-mounted LED that is fixed and can be easily mounted. With the goal.
【０００６】 上記目的は、本考案にあっては、発光ダイオードから延出するリードフレーム と、このリードフレームから側方へ一体的に張り出す張出部と、この張出部を包 囲し且つその張出端部を露出させるように樹脂モールドして形成されたベース部 とからなる表面実装型ＬＥＤにより、達成される。[0006] In the present invention, the above purpose is to provide a lead frame extending from a light emitting diode. , an overhanging part that integrally projects laterally from this lead frame, and an overhanging part that wraps around this overhanging part. A base part formed by resin molding so as to surround it and expose its overhanging end. This is achieved by a surface-mounted LED consisting of.
【０００７】[0007]
上記構成によれば、ＬＥＤから延びるリードフレームには側方に向かって張り 出す張出部があり、この張出部を包囲するようにベース部が形成されている。 したがって、このベース部を利用してＬＥＤが実装基板上に載置され、安定良 く支持されることになる。この状態にて、ベースから露出しているリードフレー ムの張出端部が基板上面に予め形成された導電部に対して表面側から半田付けさ れる。 According to the above configuration, the lead frame extending from the LED has tension toward the side. There is a projecting portion, and a base portion is formed to surround this projecting portion. Therefore, using this base part, the LED is mounted on the mounting board, and it is stable and good. It will receive a lot of support. In this state, the lead frame exposed from the base The protruding end of the board is soldered from the front side to the conductive part previously formed on the top surface of the board. It will be done.
【０００８】[0008]
以下、本考案の好適な一実施例を添付図面中の図１乃至図３を参照しながら詳 細に説明する。 Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3 of the accompanying drawings. Explain in detail.
【０００９】 図１は、本実施例に係る表面実装型ＬＥＤの概略正面図，図２は概略平面図で ある。 図において、表面実装型ＬＥＤ１０は、発光ダイオード１１と、この発光ダイ オード１１より延出しているリードフレーム１２，１３と、このリードフレーム １２，１３から側方へ一体的に張り出している張出部１４，１５と、この張出部 １４，１５を包囲するとともに該張出部の後述する張出端部を露出させるように 形成したベース部１６とから構成されている。[0009] FIG. 1 is a schematic front view of the surface-mounted LED according to this example, and FIG. 2 is a schematic plan view. be. In the figure, a surface-mounted LED 10 includes a light emitting diode 11 and a light emitting diode 11. Lead frames 12 and 13 extending from the ord 11 and this lead frame Overhanging parts 14 and 15 integrally overhanging from 12 and 13 to the sides, and this overhanging part 14 and 15 and exposes the projecting end portion of the projecting portion, which will be described later. A base portion 16 is formed.
【００１０】 上記ＬＥＤ１１は、本実施例にあっては、実質的に平行に延びる２本のリード フレーム１２，１３のうち、一方のリードフレーム１３の先端部にＬＥＤチップ １１ａをダイボンンディングし、このＬＥＤチップ１１ａを他方のリードフレー ム１２の先端部とワイヤボンディングするとともに、これらの周囲を樹脂モール ド１１ｂすることにより形成されている。 上記リードフレーム１２，１３は導電性金属材料にて形成されており、図１に おいて下方へ向かって延びていて、その下部には図１において左右側方に向かっ て張り出した２つの張出部１４，１５が一体的に形成されている。0010 In this embodiment, the LED 11 has two leads extending substantially in parallel. Among the frames 12 and 13, an LED chip is attached to the tip of one lead frame 13. 11a is die-bonded, and this LED chip 11a is attached to the other lead frame. At the same time as wire bonding to the tip of the rubber band 12, resin molding is applied around these parts. 11b. The lead frames 12 and 13 are made of conductive metal material, and are shown in FIG. It extends downward from the bottom, and in the lower part there is a Two overhanging parts 14 and 15 are integrally formed.
【００１１】 さらに、上記張出部１４，１５を包囲するようにして台座状に合成樹脂をモー ルドすることにより、ベース１６が形成されている。このベース１６の側面には 上記張出部１４，１５が露出せしめられており、この露出した張出端部１４ｂ， １５ｂは、後述するように本表面実装型ＬＥＤ１０を実装基板上に半田付けする のに利用される。[0011] Furthermore, a synthetic resin is molded in a pedestal shape so as to surround the overhanging parts 14 and 15. A base 16 is formed by molding. On the side of this base 16 The projecting portions 14 and 15 are exposed, and the exposed projecting end portions 14b, 15b solders the surface-mounted LED 10 onto the mounting board as described later. used for.
【００１２】 また、好ましくは、図２に示すようにベース１６の一側（本例において右側） には切欠き１６ａ，１６ａが設けられ、後述するように実装用基板上での極性判 定に利用される。0012 Also, preferably, one side of the base 16 (the right side in this example) as shown in FIG. are provided with notches 16a, 16a for polarity determination on the mounting board as described later. It is used regularly.
【００１３】 本実施例は以上のように構成されており、図３はその製造過程の一部を示す正 面図である。 図において各ＬＥＤ１１を構成するリードフレーム１２，１３は、下方に長く 延長されて支持部２０に一体化されており、この支持部２０の各ピッチ孔２１に より、製造用治具（図示せず）に固定されている。[0013] This embodiment is constructed as described above, and FIG. 3 shows a diagram showing part of the manufacturing process. It is a front view. In the figure, the lead frames 12 and 13 that constitute each LED 11 are long downward. It is extended and integrated into the support part 20, and is provided in each pitch hole 21 of this support part 20. It is fixed to a manufacturing jig (not shown).
【００１４】 リードフレーム１２，１３の上端部は、図１に示すようにＬＥＤチップ１１ａ が固定されており且つ各リードフレーム１２，１３には上述の張出部１４，１５ とベース１６が予め形成されており、この状態で所定の成形型内に挿入すること により、上述のモールド樹脂が素子封止用樹脂内に成形される。次いで、リード フレーム１２，１３を所定位置でカットすることにより本表面実装型ＬＥＤ１０ が多数同時に製造される。[0014] The upper ends of the lead frames 12 and 13 are connected to the LED chip 11a as shown in FIG. is fixed, and each lead frame 12, 13 has the above-mentioned overhangs 14, 15. and the base 16 are formed in advance, and in this state it can be inserted into a predetermined mold. As a result, the above-mentioned molding resin is molded into the element sealing resin. Then lead By cutting frames 12 and 13 at predetermined positions, this surface-mounted LED 10 are produced in large numbers at the same time.
【００１５】 本実施例の表面実装型ＬＥＤ１０の実装用基板への取付けは、以下のように行 われる。 プリント基板Ｐの一面には、所定の回路パターン（図示せず）が形成されてお り、この基板Ｐ上に本表面実装型ＬＥＤ１０を載置する。 次いで、基板Ｐの上記パターン上にベース部１６の側面に露出している張出端 部１４ｂ，１５ｂをそれぞれアノード側及びカソード側端子として位置合わせす る。この際、ベース１６の切欠き１６ａ，１６ａは各張出端部１４ｂ，１５ｂが 基板Ｐ上で取り付けられるべき極性を判別するために利用されるとともに、ベー ス１６が表面実装型ＬＥＤ１０を基板Ｐ上で安定的に支えるから、位置合わせも 容易である。 次に、クリーム半田２２，２２を張出端部１４ｂ，１５ｂの側面に接触させつ つ基板Ｐ上に置き、この状態で図示しない炉内で加熱することにより、上記クリ ーム半田２２，２２を溶融させ、張出端部１４ｂ，１５ｂと基板Ｐ上の回路パタ ーンとに付着させる。これを炉内から外へ出し、冷却することにより各張出端部 １４ｂ，１５ｂは回路パターンに電気的に接続され、表面実装型ＬＥＤ１０の実 装は完了する。[0015] The surface mount type LED 10 of this example is attached to the mounting board as follows. be exposed. A predetermined circuit pattern (not shown) is formed on one side of the printed circuit board P. Then, the present surface-mounted LED 10 is placed on this substrate P. Next, the overhanging end exposed on the side surface of the base portion 16 is placed on the pattern of the substrate P. Position portions 14b and 15b as anode side and cathode side terminals, respectively. Ru. At this time, the notches 16a, 16a of the base 16 have respective projecting ends 14b, 15b. It is used to determine the polarity to be attached on the board P, and Since the base 16 stably supports the surface-mounted LED 10 on the board P, positioning is also easy. It's easy. Next, while bringing the cream solder 22, 22 into contact with the side surfaces of the overhanging ends 14b, 15b, The above-mentioned crystal is placed on the substrate P and heated in this state in a furnace (not shown). The overhanging ends 14b, 15b and the circuit pattern on the board P are melted. Attach it to the surface. By taking this out from the furnace and cooling it, each overhanging end 14b and 15b are electrically connected to the circuit pattern, and are connected to the actual surface-mounted LED 10. The outfit is complete.
【００１６】 かくして、本表面実装型ＬＥＤ１０は、プリント基板Ｐ上に極めて簡単な作業 により実装でき、この際の半田付けも表面から作業できて便利である。 また、本考案による表面実装型ＬＥＤ１０は、プリント基板Ｐ上でベース１６ により安定的に支持されるから、外力に影響されて傾いたりすることが有効に防 止される。 尚、上記実施例においては、リードフレームを２本用いたＬＥＤについて説明 したが、より多数のリードフレームで形成されるＬＥＤにも本考案が適用できる ことは勿論である。[0016] Thus, the present surface-mounted LED 10 can be mounted on the printed circuit board P with extremely simple operation. It can be mounted by using the same method, and soldering can be done from the surface, which is convenient. Moreover, the surface-mounted LED 10 according to the present invention is mounted on the base 16 on the printed circuit board P. Because it is stably supported by the will be stopped. In the above example, an LED using two lead frames will be described. However, the present invention can also be applied to LEDs formed with a larger number of lead frames. Of course.
【００１７】[0017]
以上説明したように、本考案によれば、基板表面側から半田付けすることによ り、該基板に容易に実装することができ、しかも安定的に取り付けられる優れた 表面実装型ＬＥＤを提供することができる。 As explained above, according to the present invention, soldering is performed from the surface side of the board. It is an excellent product that can be easily mounted on the board and can be stably attached. Surface mounted LEDs can be provided.
【図１】本考案の一実施例に係る表面実装型ＬＥＤの概
略正面図である。FIG. 1 is a schematic front view of a surface-mounted LED according to an embodiment of the present invention.
【図２】図１の実施例の概略平面図である。2 is a schematic plan view of the embodiment of FIG. 1; FIG.
【図３】図１の実施例に係る表面実装型ＬＥＤの製造過
程の一部を示す図である。FIG. 3 is a diagram showing a part of the manufacturing process of the surface-mounted LED according to the embodiment of FIG. 1;
【図４】従来の表面実装型ＬＥＤの一例を示す正面図で
ある。FIG. 4 is a front view showing an example of a conventional surface-mounted LED.
１０ 表面実装型ＬＥＤ １１ ＬＥＤ（樹脂部） １２，１３ リードフレーム １４，１５ 張出部 １４ｂ，１５ｂ 張出端部 １６ ベース ２２ クリーム半田 10 Surface mounted LED 11 LED (resin part) 12,13 Lead frame 14,15 Overhang 14b, 15b Overhanging end 16 base 22 Cream solder
Claims (1)
ームと、該リードフレームから側方へ一体的に張り出す
張出部と、該張出部を包囲し且つその張出端部を露出さ
せるように樹脂モールドして形成されたベース部とから
なる、表面実装型ＬＥＤ。1. A lead frame extending from a light emitting diode, a projecting portion that integrally projects laterally from the lead frame, and a structure that surrounds the projecting portion and exposes the projecting end. A surface-mounted LED consisting of a base part formed by resin molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1454591U JPH04105561U (en) | 1991-02-22 | 1991-02-22 | surface mounted LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1454591U JPH04105561U (en) | 1991-02-22 | 1991-02-22 | surface mounted LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04105561U true JPH04105561U (en) | 1992-09-10 |
Family
ID=31902052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1454591U Pending JPH04105561U (en) | 1991-02-22 | 1991-02-22 | surface mounted LED |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04105561U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6159362B2 (en) * | 1981-11-16 | 1986-12-16 | G Sojuzny Inst P Metall Z | |
| JP4082875B2 (en) * | 2001-03-26 | 2008-04-30 | 株式会社リコー | Electrophotographic photosensitive member and image forming apparatus |
-
1991
- 1991-02-22 JP JP1454591U patent/JPH04105561U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6159362B2 (en) * | 1981-11-16 | 1986-12-16 | G Sojuzny Inst P Metall Z | |
| JP4082875B2 (en) * | 2001-03-26 | 2008-04-30 | 株式会社リコー | Electrophotographic photosensitive member and image forming apparatus |
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