JPH04105337A - Packaging method of semiconductor element - Google Patents

Abstract

PURPOSE:To obtain a packaging method suitable for high density integration and capable of easy packaging of a semiconductor element, by using characteristics of a photosensitive film for an electrode of a semiconductor element, making conductive particles attach only on the electrode, and connecting the electrode of the semiconductor electrode, on which the conductive particles attach, with the electrode of a semiconductor element packaging substrate. CONSTITUTION:By using characteristics of a photosensitive film 13' for an electrode 12 of a semiconductor element 11, conductive particles 14 are made to attach only on the electrode 12, which is connected with an electrode 26 of a semiconductor element packaging substrate 21. For example, after organic sensitized material 13 for electrophotography is spread on the surface of the semiconductor element 11, a photosensive film 13' is formed by heating and drying, and the surface of the photosensitive film 13' is negatively charged by corona discharge. The objective electrode 12 only is irradiated with a light, and the surface of the film 13' of the irradiated part is turned into a neutral state. When toner containing metal nuclei is negatively charged and brought into contact with the photosensitive film l3', the negatively charged toner attaches on the neutralized photosensitive film surface corresponding with the electrode 13. The semiconductor element obtained in the above manner is mounted on a substrate 21.

Description

[Detailed description of the invention] (Industrial application field).

The present invention provides an IS! method for mounting semiconductor devices. ! It is something that can be done.

(Prior Art) Conventionally, as a technology in this field, there is one described in, for example, "Nikkei Microdevice", Nikkei BP, July 1989, pp. 57-60.

Figure 2 shows such a conventional COG (Chip On Gl).
FIG.

First, as shown in FIG. 2(a), a conductor 52 is formed on a glass substrate 51 (for example, a liquid crystal panel) on which a liquid crystal 50 is mounted.

Next, as shown in FIG. 2(b), the glass substrate 51
A paste made by mixing conductive particles 54 with adhesive is applied to the electrode 53 of the mounting portion of the semiconductor element by printing.

Next, as shown in FIG. 2(c), an adhesive 55 for fixing the semiconductor element is supplied by a dispensing method or the like.

Next, as shown in FIG. 2(d), the semiconductor element 56 is
After the desired electrodes are aligned, pressure is applied and they are pushed apart and temporarily fixed. The adhesive 1155 is hardened and the semiconductor element 56 is mounted.

Next, as shown in FIG. 2(e), the protective cap 57 of the semiconductor element 56 and the external chamber scraping board 58 are connected.

(Problems to be Solved by the Invention) However, in the conventional mounting method described above, since a printing method is used as a method of replenishing conductive particles, it is difficult to increase the density of the electrode pitch. In addition, printing is difficult because the liquid crystal part protrudes from the surface of the electrode connection part6.Furthermore, when using the panel outline for printing positioning, alignment must be made with high accuracy when forming panel conductors. , it takes time to create a panel. In addition, there was a problem in that the liquid crystal panel became expensive because the outer shape of the panel had to be precise.

In order to eliminate the above-mentioned problems, the present invention eliminates the adhesion of conductive particles by the printing method, and coats an organic electrophotographic photoreceptor on the semiconductor element side or the conductive element mounting substrate side, and utilizes the photosensitive properties of the metal. After attaching the toner containing nuclei to the connection electrode,
The semiconductor element and the electrodes of the semiconductor element mounting board are put together and pressure is applied, and the metal core of the metal core toner connects the electrodes. This increases the density, making it easier to mount the semiconductor element. The purpose of the present invention is to provide a method for mounting semiconductor devices that can be implemented easily.

(Means for Solving the Problems) The present invention provides a semiconductor device mounting method in which the characteristics of a photosensitive film are used for the electrodes of the semiconductor device, conductive particles are attached only to the electrodes, and the semiconductor device to which the conductive particles are attached is The electrodes of the element are connected to the electrodes of the semiconductor element mounting board.

Conversely, conductive particles are attached to the electrodes of the semiconductor element mounting board by the method described above, and the electrodes of the semiconductor element are connected to the electrodes of the semiconductor element mounting board.

In this case, the metal core of the conductive particles can destroy the photosensitive film and make the electrode conductive.

(Function) According to the present invention, as described above, an organic electrophotographic photoreceptor is applied to a semiconductor element or a semiconductor element mounting board to form a photoreceptor film, and then the connection electrode is irradiated with a photoreceptor. Attach toner containing metal nuclei to the area. Adhesive is supplied to either the semiconductor element or the semiconductor element substrate, and the electrodes are aligned.

The electrodes are brought into contact and pressure is applied until the photoresist film is destroyed by the metal nuclei in the toner, the electrodes are connected, the adhesive is cured, and the semiconductor is mounted.

Therefore, by increasing the density of the pitch between electrodes and using an exposure machine, alignment for electrode irradiation can be easily performed.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view of a semiconductor element mounting process showing an embodiment of the present invention.

First, as shown in FIG. 1(a), electrodes 12 are formed on the semiconductor element II, and a spinner type,
Alternatively, the organic electrophotographic photoreceptor 13 is applied by a spray method, dip method, or the like.

Thereafter, the surface of the semiconductor element 11 is exposed to light by heating and drying.
1A 13' is formed, and the surface of the photoresist film 13' is charged to - by, for example, corona discharge, as shown in FIG. 1(b).

Next, as shown in FIG. 1(c), only the target electrode 12 is irradiated with light by an exposure machine, and that part is exposed to light 1111.
The 3' surface is brought into a neutralized state.

Next, as shown in FIG. 1(d), toner containing metal nuclei (
The conductive particles 14 are charged to - and the toner 14 is brought into contact with the photoresist film 13'.

Then, as shown in FIG. 1(e), the negative charged photoresist film surface and the negative charged toner repel each other, but the photoresist film surface corresponding to the neutralized t-pole 13 Ha-
The charged toner will stick to the surface.

In this way, the conductive particles 14 can be attached to the electrodes of the semiconductor element.

Next, the semiconductor element thus obtained is mounted on a substrate. That is, the mounting process of semiconductor elements using COG will be explained.

As shown in FIG. 1(f), a glass substrate 21 (for example, a liquid crystal panel) on which a conductor 22 for mounting a liquid crystal section 20 is formed is prepared.

Next, as shown in FIG. 1(g), an adhesive 23 for fixing the semiconductor element is applied by a dispensing method or the like.

Next, as shown in FIG. 1(h), the semiconductor element 11 to which the metal core-containing toner (conductive particles H4 is attached) and the electrode 26 of the glass substrate 21 are aligned.

Next, as shown in FIG. 1(i), after bringing the electrodes into contact via the conductive particles 14, pressure is applied to the conductive particles 14.
The photoresist film 13' is destroyed by the metal core 14' of No. 4, and conduction is established between the semiconductor element electrode 12 and the electrode 26 of the glass substrate 21. After that, the adhesive 23 is hardened and the semiconductor element is mounted.

Next, as shown in FIG. 1(j), the protective cap 27 of the semiconductor element 11 and the external electrode extraction board 28 are connected.

FIG. 3 is a cross-sectional view of a semiconductor device mounting process showing a second embodiment of the present invention.

First, as shown in FIG. 3(a), an organic electrophotographic photoreceptor is coated on the surface of the glass substrate 31 on which the conductor 32 carrying the liquid crystal section 30 is formed, and the surface having the electrode 33 is coated with the photoreceptor. A photoresist film 34' is formed by heating and drying, and the surface of the photoresist film 34' is charged negative by, for example, corona discharge.

Therefore, an exposure machine is used to irradiate light only to the target electrode 33 to neutralize the surface of the photoresist film 34' in that area, and toner containing metal nuclei (conductive particles) is charged thereto.
The toner is brought into contact with the photoresist film 34'. Then, the negatively charged toner 35 adheres to the surface of the photoresist film corresponding to the neutralized electrode 33.

In this way, conductive particles can be attached to the electrodes of the glass substrate.

Next, a semiconductor element is mounted on the electrode of the glass substrate thus obtained.

First, as shown in 3rd M(b), adhesive 36 is applied between the electrodes of the glass substrate using a dispensing method or the like.

Next, as shown in FIG. 3(c), the glass Ji, the plate 31
The electrode 12 of the semiconductor element 11 is aligned with the electrode 33 of the semiconductor element 11 .

Next, as shown in FIG. 3(d), after bringing the electrodes into contact with each other through the toner 35 having conductive particles, pressure is applied to destroy the photoresist film 34' with a metal core, and the semiconductor element is The electrode 12 of the glass substrate 31 is electrically connected to the electrode 33 of the glass substrate 31. Thereafter, the adhesive 36 is hardened and the semiconductor element is mounted.

Next, as shown in FIG. 3(e), the protective cap 37 of the semiconductor element 11 and the external electrode extraction board 38 are connected.

In the above embodiments, a glass substrate was used as an example of a mounting substrate for a semiconductor element, but it is not limited to a glass substrate, and a general organic or inorganic substrate may be used. Although a toner containing a metal core charged to - is used for this purpose, it is also possible to use a toner with the metal core itself charged to -.

Further, although the photoreceptor is shown as one that is charged once, it may be one that is charged ten times, or one that is charged positively or negatively by light irradiation in a neutralized state.
In that case, the conductive particles may be treated to a state suitable for the purpose of use.

Note that the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

(Effects of the Invention) As described above in detail, according to the present invention, in order to make conductive particles adhere to the electrodes by using the characteristics of the photosensitive film, the pitch between the electrodes is increased in density, By using an exposure machine, alignment for electrode irradiation can be easily performed.

Furthermore, since a method of attaching conductive particles to electrodes is used, it is also applicable to bump forming methods such as flip-chip mounting and TAB mounting.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a mounting process of a semiconductor element showing an embodiment of the present invention, FIG. 2 is a sectional view of a mounting process of a semiconductor element in a conventional COG, and FIG. 3 is a sectional view of a semiconductor element mounting process of a conventional COG. FIG. 3 is a cross-sectional view of the element mounting process. 11...Semiconductor element, 12.26.33...
13... Organic electrophotographic photoreceptor, 13', 34'
... Photoresist film, 14.35 ... Conductive particles (toner containing metal core), 14' ... Metal core, 20, 30 ... Liquid crystal section, 21.31 ... Glass substrate, 22.32 ... Conductor, 23.36 ... Adhesive, 27.37 ... Protective cap, 28, 38 ... External electric scraping board. Patent applicant: Oki Electric Industry Co., Ltd. Agent: Patent attorney: Mamoru Shimizu (2 others) Figure 1 is /l
/) At 茫 former rib f-1 pass 勺 审 の に Ｇａｎｔ Ｇｕｒｄ Ｇ Ｇ Ｇ １０ fig. 1
Figure (zo02n Figure 2

Claims (3)

[Claims] (1) (a) Using the characteristics of a photosensitive film for the electrode of a semiconductor element, conductive particles are attached only to the electrode, (b) The electrode of the semiconductor element to which the conductive particles are attached is connected to the electrode of the semiconductor element mounting board. A method for mounting a semiconductor element, the method comprising: connecting a semiconductor element to a semiconductor element; (2) (a) Using the characteristics of a photosensitive film on the electrode of the semiconductor element mounting board, conductive particles are attached only to the electrode, and (b) The semiconductor element is attached to the electrode of the semiconductor element mounting board to which the conductive particles are attached. A method for mounting a semiconductor device, the method comprising: connecting electrodes. (3) A method for mounting a semiconductor device, which comprises destroying a photosensitive film with the metal core of the conductive particles according to claim 1 or 2, thereby making the electrode conductive.