JPH0410339U - - Google Patents

Info

Publication number
JPH0410339U
JPH0410339U JP5074790U JP5074790U JPH0410339U JP H0410339 U JPH0410339 U JP H0410339U JP 5074790 U JP5074790 U JP 5074790U JP 5074790 U JP5074790 U JP 5074790U JP H0410339 U JPH0410339 U JP H0410339U
Authority
JP
Japan
Prior art keywords
resin
semiconductor package
die pad
shape
dispersed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5074790U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5074790U priority Critical patent/JPH0410339U/ja
Publication of JPH0410339U publication Critical patent/JPH0410339U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP5074790U 1990-05-17 1990-05-17 Pending JPH0410339U (US20080094685A1-20080424-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5074790U JPH0410339U (US20080094685A1-20080424-C00004.png) 1990-05-17 1990-05-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5074790U JPH0410339U (US20080094685A1-20080424-C00004.png) 1990-05-17 1990-05-17

Publications (1)

Publication Number Publication Date
JPH0410339U true JPH0410339U (US20080094685A1-20080424-C00004.png) 1992-01-29

Family

ID=31569565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5074790U Pending JPH0410339U (US20080094685A1-20080424-C00004.png) 1990-05-17 1990-05-17

Country Status (1)

Country Link
JP (1) JPH0410339U (US20080094685A1-20080424-C00004.png)

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