JPH0397929U - - Google Patents
Info
- Publication number
- JPH0397929U JPH0397929U JP1990006646U JP664690U JPH0397929U JP H0397929 U JPH0397929 U JP H0397929U JP 1990006646 U JP1990006646 U JP 1990006646U JP 664690 U JP664690 U JP 664690U JP H0397929 U JPH0397929 U JP H0397929U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- mounting structure
- view
- spacer member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990006646U JPH0397929U (US06174465-20010116-C00003.png) | 1990-01-27 | 1990-01-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990006646U JPH0397929U (US06174465-20010116-C00003.png) | 1990-01-27 | 1990-01-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0397929U true JPH0397929U (US06174465-20010116-C00003.png) | 1991-10-09 |
Family
ID=31510317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990006646U Pending JPH0397929U (US06174465-20010116-C00003.png) | 1990-01-27 | 1990-01-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0397929U (US06174465-20010116-C00003.png) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57173953A (en) * | 1981-04-21 | 1982-10-26 | Seiko Epson Corp | Semiconductor device |
-
1990
- 1990-01-27 JP JP1990006646U patent/JPH0397929U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57173953A (en) * | 1981-04-21 | 1982-10-26 | Seiko Epson Corp | Semiconductor device |