JPH0397928U - - Google Patents

Info

Publication number
JPH0397928U
JPH0397928U JP1990005832U JP583290U JPH0397928U JP H0397928 U JPH0397928 U JP H0397928U JP 1990005832 U JP1990005832 U JP 1990005832U JP 583290 U JP583290 U JP 583290U JP H0397928 U JPH0397928 U JP H0397928U
Authority
JP
Japan
Prior art keywords
connecting electrode
protruding shape
gold
registration request
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990005832U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990005832U priority Critical patent/JPH0397928U/ja
Publication of JPH0397928U publication Critical patent/JPH0397928U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1990005832U 1990-01-25 1990-01-25 Pending JPH0397928U (US06521211-20030218-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990005832U JPH0397928U (US06521211-20030218-C00004.png) 1990-01-25 1990-01-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990005832U JPH0397928U (US06521211-20030218-C00004.png) 1990-01-25 1990-01-25

Publications (1)

Publication Number Publication Date
JPH0397928U true JPH0397928U (US06521211-20030218-C00004.png) 1991-10-09

Family

ID=31509523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990005832U Pending JPH0397928U (US06521211-20030218-C00004.png) 1990-01-25 1990-01-25

Country Status (1)

Country Link
JP (1) JPH0397928U (US06521211-20030218-C00004.png)

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