JPH0397755A - Stabilized polyamide-based resin composition - Google Patents
Stabilized polyamide-based resin compositionInfo
- Publication number
- JPH0397755A JPH0397755A JP1235174A JP23517489A JPH0397755A JP H0397755 A JPH0397755 A JP H0397755A JP 1235174 A JP1235174 A JP 1235174A JP 23517489 A JP23517489 A JP 23517489A JP H0397755 A JPH0397755 A JP H0397755A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- alkyl group
- parts
- carbon atoms
- based resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 5
- 229920002647 polyamide Polymers 0.000 title abstract description 7
- -1 cyclic phosphite compound Chemical class 0.000 claims abstract description 39
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 18
- 229920006122 polyamide resin Polymers 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 125000004429 atom Chemical group 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 10
- 239000011347 resin Substances 0.000 abstract description 10
- 238000002156 mixing Methods 0.000 abstract description 5
- 238000004040 coloring Methods 0.000 abstract description 4
- 125000002947 alkylene group Chemical group 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 description 12
- 239000002253 acid Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 239000008188 pellet Substances 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- 229920002292 Nylon 6 Polymers 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 3
- 239000004611 light stabiliser Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical class OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Chemical group CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical group CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JMUOXOJMXILBTE-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 JMUOXOJMXILBTE-UHFFFAOYSA-N 0.000 description 1
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical class OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- APQIUTYORBAGEZ-UHFFFAOYSA-N 1,1-dibromoethane Chemical compound CC(Br)Br APQIUTYORBAGEZ-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- SAADORAEBXDJQA-UHFFFAOYSA-N 2-cyanobut-2-enoic acid Chemical class CC=C(C#N)C(O)=O SAADORAEBXDJQA-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- STEYNUVPFMIUOY-UHFFFAOYSA-N 4-Hydroxy-1-(2-hydroxyethyl)-2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CC(O)CC(C)(C)N1CCO STEYNUVPFMIUOY-UHFFFAOYSA-N 0.000 description 1
- VWPQCOZMXULHDM-UHFFFAOYSA-N 9-aminononanoic acid Chemical compound NCCCCCCCCC(O)=O VWPQCOZMXULHDM-UHFFFAOYSA-N 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- 239000004593 Epoxy Chemical class 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920001007 Nylon 4 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- DCBNMBIOGUANTC-UHFFFAOYSA-N [5-[(5-benzoyl-4-hydroxy-2-methoxyphenyl)methyl]-2-hydroxy-4-methoxyphenyl]-phenylmethanone Chemical compound COC1=CC(O)=C(C(=O)C=2C=CC=CC=2)C=C1CC(C(=CC=1O)OC)=CC=1C(=O)C1=CC=CC=C1 DCBNMBIOGUANTC-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- CJYXCQLOZNIMFP-UHFFFAOYSA-N azocan-2-one Chemical compound O=C1CCCCCCN1 CJYXCQLOZNIMFP-UHFFFAOYSA-N 0.000 description 1
- 125000002511 behenyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- IAJNXBNRYMEYAZ-UHFFFAOYSA-N ethyl 2-cyano-3,3-diphenylprop-2-enoate Chemical compound C=1C=CC=CC=1C(=C(C#N)C(=O)OCC)C1=CC=CC=C1 IAJNXBNRYMEYAZ-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- NZYMWGXNIUZYRC-UHFFFAOYSA-N hexadecyl 3,5-ditert-butyl-4-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NZYMWGXNIUZYRC-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 125000002463 lignoceryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000001802 myricyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UKJARPDLRWBRAX-UHFFFAOYSA-N n,n'-bis(2,2,6,6-tetramethylpiperidin-4-yl)hexane-1,6-diamine Chemical compound C1C(C)(C)NC(C)(C)CC1NCCCCCCNC1CC(C)(C)NC(C)(C)C1 UKJARPDLRWBRAX-UHFFFAOYSA-N 0.000 description 1
- FTWUXYZHDFCGSV-UHFFFAOYSA-N n,n'-diphenyloxamide Chemical compound C=1C=CC=CC=1NC(=O)C(=O)NC1=CC=CC=C1 FTWUXYZHDFCGSV-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229960000969 phenyl salicylate Drugs 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 235000017807 phytochemicals Nutrition 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- XUWHAWMETYGRKB-UHFFFAOYSA-N piperidin-2-one Chemical compound O=C1CCCCN1 XUWHAWMETYGRKB-UHFFFAOYSA-N 0.000 description 1
- 229930000223 plant secondary metabolite Natural products 0.000 description 1
- 239000004014 plasticizer Chemical class 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- GDESWOTWNNGOMW-UHFFFAOYSA-N resorcinol monobenzoate Chemical compound OC1=CC=CC(OC(=O)C=2C=CC=CC=2)=C1 GDESWOTWNNGOMW-UHFFFAOYSA-N 0.000 description 1
- 238000005185 salting out Methods 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は安定化されたボリアミド系樹脂組或物に関し、
詳しくは、特定の有機環状ホスファイト化合物および特
定のフェノール化合物を添加することによって安定化さ
れたボリアくド系樹脂Ｍｉ或物に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a stabilized polyamide resin composition,
Specifically, the present invention relates to a boriacid resin Mi stabilized by adding a specific organic cyclic phosphite compound and a specific phenol compound.
ナイロン６、テトラメチレンアジバミド（ナイロン４．
６）などのボリアミド系樹脂は優れた強度、耐摩耗性、
耐疲労性、染色性などの特徴を持ち、エンジニアリング
プラスチックの一員として、合成繊維をはじめとしてフ
ィルム、戊型品などに幅広く使用されている。Nylon 6, tetramethyleneazibamide (nylon 4.
Polyamide resins such as 6) have excellent strength, abrasion resistance,
It has characteristics such as fatigue resistance and dyeability, and as a member of engineering plastics, it is widely used in synthetic fibers, films, and hollow-shaped products.
しかしながら、エンジニアリングプラスチンクとしての
ボリアミド系樹脂は熱および光に対する安定性に問題が
あり、高温或型時に熱分解を生じやすく、熱着色を生じ
、また戒型品の物性の著しい低下をもたらすという欠点
を有している。However, polyamide-based resins used as engineering plastics have problems with their stability against heat and light, and they tend to undergo thermal decomposition when molded at high temperatures, resulting in thermal coloring and a significant deterioration in the physical properties of molded products. have.
それを改良する方法としてハロゲン化銅化合物やアξン
系酸化防止剤を安定剤として添加する方法が提案され、
熱劣化防止に対してはある程度の効果があり、広く採用
されている。しかし、ハロゲン化銅化合物あるいはアミ
ン系酸化防止剤を使用した場合、ボリアミド系樹脂が黄
色または褐色に変色し、さらに水または水性溶媒により
これらの安定剤が抽出されてしまうために、使用範囲が
大きく限定されてしまう。As a method to improve this, a method of adding a copper halide compound or an ξ-based antioxidant as a stabilizer has been proposed.
It is effective to some extent in preventing thermal deterioration and is widely used. However, when copper halide compounds or amine antioxidants are used, the polyamide resin changes color to yellow or brown, and furthermore, these stabilizers are extracted by water or aqueous solvents, so the range of use is wide. It will be limited.
また、「プラスチックスエージ」第３２巻５号１３２〜
１３６頁（Ｉ９８６）株式会社プラスチックス・エージ
発行には、フェノール系化合物および／または有機ホス
ファイト化合物をボリアごド系樹脂の安定剤として効果
があり、しかも水または水性溶媒に抽出されにくい、効
果的なボリアミド系樹脂の安定剤として開示されている
。Also, "Plastic Swage" Vol. 32 No. 5 132-
Page 136 (I986) Published by Plastics Age Co., Ltd., states that phenolic compounds and/or organic phosphite compounds are effective as stabilizers for boriagodo-based resins, and are not easily extracted by water or aqueous solvents. It is disclosed as a stabilizer for polyamide resins.
しかしながら、これらの方法では、ポリアミド系樹脂の
熱酸化劣化の防止に関しては若干改良されるものの、実
用的な見地から満足すべき状態までには至っていない。However, although these methods provide some improvement in preventing thermal oxidative deterioration of polyamide resins, they have not yet reached a level that is satisfactory from a practical standpoint.
〔問題点を解決するための手段〕
本発明者等はかかる現状に鑑み鋭意検討を重ねた結果、
ボリアミド系樹脂に対して特定の有機環状ホスファイト
化合物と、特定のフェノール化合物を同時に使用するこ
とにより、熱安定性に優れることを見出し、本発明を完
或したものである。[Means for solving the problem] As a result of extensive studies in view of the current situation, the present inventors have found that:
The present invention has been completed by discovering that the polyamide resin has excellent thermal stability by simultaneously using a specific organic cyclic phosphite compound and a specific phenol compound.
すなわち、本発明はポリアミド系樹脂１００重量部に対
して次の一般式（Ｉ）で表される有機環状ホスファイト
化合物０．００１〜５重量部および次の一般式（ｎ）で
表される特定フェノール化合物０．００１〜５重量部を
添加してなる安定化されたボリアξド系樹脂組成物を提
供するものである。That is, the present invention provides 0.001 to 5 parts by weight of an organic cyclic phosphite compound represented by the following general formula (I) and a specific compound represented by the following general formula (n) per 100 parts by weight of the polyamide resin. The object of the present invention is to provide a stabilized boria ξ-do resin composition containing 0.001 to 5 parts by weight of a phenol compound.
（式中、Ｒ１は炭素原子数１〜９のアルキル基を示し、
Ｒ２は水素原子または炭素原子数１〜４のアルキル基を
示し、Ｒ，は炭素原子数１〜３０のアルキル基を示す。(In the formula, R1 represents an alkyl group having 1 to 9 carbon atoms,
R2 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R represents an alkyl group having 1 to 30 carbon atoms.
Ｒ，は水素原子または炭素原子数１〜９のアルキル基を
示し、Ｒ，は炭素原子数２〜６のアルキレン基を示す。R represents a hydrogen atom or an alkyl group having 1 to 9 carbon atoms, and R represents an alkylene group having 2 to 6 carbon atoms.
）
上記一般式（Ｉ）において、Ｒ１で表される炭素原子数
１〜９のアルキル基としては、メチル、エチル、プロビ
ル、イソプロビル、ブチル、第二ブチル、第三ブチル、
イソブチル、アミル、第三アもル、ヘキシル、ヘブチル
、オクチル、イソオクチル、２−エチルヘキシル、第三
オクチル、ノニル、第三ノニルなどがあげられ、Ｒ２で
表される炭素原子数１〜４のアルキル基としては、メチ
ル、エチル、プロビル、イソプロビル、ブチル、第二ブ
チル、第三ブチル、イソブチルなどがあげられ、また、
Ｒ３で表される炭素原子数１〜３０のアルキル基として
は、メチル、エチル、プロビル、イソブロビル、プチル
、第二プチル、第三ブチル、イソブチル、アミル、第三
アξル、ヘキシル、ヘプチル、オクチル、イソオクチル
、２−エチルヘキシル、第三オクチル、ノニル、第三ノ
ニル、デシル、イソデシル、ドデシル、テトラデシル、
ヘキサデシル、オククデシル、エイコシル、ドコシル、
テトラコシル、トリアコンチルなどがあげられる。) In the above general formula (I), the alkyl group having 1 to 9 carbon atoms represented by R1 includes methyl, ethyl, propyl, isopropyl, butyl, sec-butyl, tert-butyl,
Examples include isobutyl, amyl, tertiary amyl, hexyl, hebutyl, octyl, isooctyl, 2-ethylhexyl, tertiary octyl, nonyl, tertiary nonyl, and an alkyl group having 1 to 4 carbon atoms represented by R2. Examples include methyl, ethyl, propyl, isopropyl, butyl, sec-butyl, tertiary-butyl, isobutyl, etc.
The alkyl group having 1 to 30 carbon atoms represented by R3 includes methyl, ethyl, propyl, isobrobyl, butyl, sec-butyl, tert-butyl, isobutyl, amyl, tertiary-aryl, hexyl, heptyl, octyl. , isooctyl, 2-ethylhexyl, tertiary octyl, nonyl, tertiary nonyl, decyl, isodecyl, dodecyl, tetradecyl,
hexadecyl, occudecyl, eicosyl, docosyl,
Examples include tetracosyl and triacontyl.
また一般式（ＩＩ）おけるＲ４で表される炭素原子数１
〜９のアルキル基としては、前記のＲ１と同一か異なる
アルキル基などがあげられ、Ｒ，で表される炭素原子数
２〜６のアルキレン基としては、エチレン、プロピレン
、ブチレン、ペンチレンおよびヘキシレン基があげられ
る。Also, the number of carbon atoms represented by R4 in general formula (II) is 1
-9 alkyl groups include alkyl groups that are the same as or different from R1, and examples of the alkylene group having 2 to 6 carbon atoms represented by R include ethylene, propylene, butylene, pentylene, and hexylene groups. can be given.
次に、本発明で用いられる上記一般式（Ｉ）で表される
有機環状ホスファイト化合物の代表例としては、次に示
す化合物があげられる。Next, representative examples of the organic cyclic phosphite compound represented by the above general formula (I) used in the present invention include the following compounds.
ｔ − Ｃ ａ ＩＩ ｑ
ｔ−ＣＪｑ
″←、
ｔ−Ｃ．ｌＩｑ
ｔ−Ｃ，Ｉｌ＊
ｔ−ＣＪＬ
ｔ−ｃ４＋＋ｑ
Ｎｎ １
２ Ｃ−１｛ｑ−Ｃｌｌ−ＣＬ−０−ＰＣＨ２
ｔ−ＣＪｗ
ｔ−Ｃ．＋｛，
ｔ−ＣＪｑ
ｔ−Ｃ．ｌ１．
本発明で用いられる上記一般式（Ｉ）で表される有機環
状ホスファイト化合物の添加量はボリアミド系樹脂１０
０重量部に対し、０．００１〜５重量部である。t - C a II q t-CJq ″←, t-C.lIq t-C, Il* t-CJL t-c4++q Nn 1 2 C-1{q-Cll-CL-0-PCH2 t-CJw t- C.+{, t-CJq t-C.l1. The amount of the organic cyclic phosphite compound represented by the above general formula (I) used in the present invention is 10% of the polyamide resin.
The amount is 0.001 to 5 parts by weight relative to 0 parts by weight.
また、本発明で用いられる上記一般式（ｎ）で表される
フェノール化合物の代表例としては、次に示す化合物が
あげられる。In addition, typical examples of the phenol compound represented by the above general formula (n) used in the present invention include the following compounds.
ｔ−ＣＪｑ
また、上記一般式（ＩＩ）で表されるフェノール化合物
の添加量はボリアミド系樹脂１００重量部に対し、０。t-CJq Further, the amount of the phenol compound represented by the above general formula (II) added is 0 with respect to 100 parts by weight of the polyamide resin.
００１〜５重量部である。001 to 5 parts by weight.
本発明の１１１１記一ａ式（Ｉ）で表される有機環状ホ
スファイ１一化合物お上び一般式（ＩＩ）で表されるフ
ェノール化合物をボリアミド系樹脂に添加する方法は特
に制限を受けず、−Ｓに用いられる方法をそのまま適用
することができる。The method of adding the organic cyclic phosphite compound represented by the formula (I) and the phenol compound represented by the general formula (II) to the polyamide resin is not particularly limited, and -The method used for S can be applied as is.
例えば、樹脂粉末あるいはベレットと、添加剤粉末をド
ライブレンドする方法、樹脂粉末あるいはベレットに添
加剤の溶液あるいは溶融液をスプレーする方法、樹脂ラ
テックスに添加剤の分散液を混合し、その後塩析する方
法等を用いることができる。For example, methods include dry blending resin powder or pellets with additive powder, spraying additive solution or melt onto resin powder or pellets, mixing resin latex with additive dispersion, and then salting out. method etc. can be used.
本発明における用いられるボリアミド系樹脂としては、
たとえば、ε一カブロラクタム、，アミノカブロン酸、
エナントラクタム、７−アごノへブタン酸、１１−アミ
ノウンデカン酸、９−アミノノナン酸、α−ビロリドン
、α−ピペリドンなどの重合物、ヘキサメチレンジアミ
ン、ノナメチレンジアミン、ウンデカメチレンジアミン
、ドデカメチレンジアえン、メタキシレ〉・ジアミンな
どのジアもンと、テレフタル酸、イソフタル酸、アジビ
ン酸、セハチン酸、ドデカンジカルボン酸、グルクル酸
などのジカルボン酸とを重縮合させて得られる重合体ま
たはこれらの共重合体、あるいはこれらの重合体もしく
は共重合体の混合物など、すべてのボリアミド系樹脂が
あげられる。また、これらのポリアミド類を主体とした
ボリアミド系樹脂とたとえはポリエステル樹脂のような
他の樹脂とのブレンド品も適用できる。The polyamide resin used in the present invention includes:
For example, ε-cabrolactam, aminocabronic acid,
Polymers such as enantholactam, 7-agonohebbutanoic acid, 11-aminoundecanoic acid, 9-aminononanoic acid, α-pyrrolidone, α-piperidone, hexamethylene diamine, nonamethylene diamine, undecamethylene diamine, dodecamethylene Polymers obtained by polycondensing diamines such as diaenes, metaxylene, diamines, etc., and dicarboxylic acids such as terephthalic acid, isophthalic acid, adivic acid, cehatic acid, dodecanedicarboxylic acid, and glucuric acid, or polymers thereof. Mention may be made of all polyamide resins, such as copolymers or mixtures of these polymers or copolymers. Furthermore, blended products of polyamide-based resins mainly composed of these polyamides and other resins such as polyester resins can also be used.
本発明の組或物に更に硫黄系の抗酸化剤を加えてその酸
化安定性の改善をはかることもできる。It is also possible to add a sulfur-based antioxidant to the composition of the present invention to improve its oxidative stability.
この硫黄系抗酸化剤としては例えば、チオジブロピオン
酸のジラウリル、ジミリスチル、ジステアリルエステル
等のジアルキルチオジブ口ビオネート類およびペンタエ
リスリトールテトラ（β−ドデシルメルカブトプロビオ
ネート）などのボリオールのβ−アルキルメルカブトプ
ロビオン酸エステル類があげられる。Examples of the sulfur-based antioxidants include dialkylthiodibionates such as dilauryl, dimyristyl, and distearyl esters of thiodibropionic acid, and β-alkylmercabutos of polyols such as pentaerythritol tetra (β-dodecylmercabutprobionate). Examples include probionic acid esters.
本発明の組威物に、紫外線吸収剤、ヒンダードアミン化
合物等の光安定剤を添加することによってその耐光性を
一層改善することができる。By adding a light stabilizer such as an ultraviolet absorber or a hindered amine compound to the composition of the present invention, its light resistance can be further improved.
この光安定剤としては例えば、２．４−ジヒドロキシベ
ンゾフェノン、２−ヒドロキシ−４−メトキシベンゾフ
ェノン、２−ヒドロキシ−４−オクトキシベンゾフエノ
ン、５，５゛−メチレンビス（２−ヒドロキシ−４−メ
トキシベンゾフエノン）等の２−ヒドロキシベンゾフェ
ノン類；２−（２”−ヒドロキシ−５゜−メチルフェニ
ル）ペンゾトリアゾール、２−（２’−ヒドロキシ−５
゛一第三オクチルフェニル）ペンゾトリアゾール、２−
（２”−ヒドロキシ−３゛，５”−ジ第三ブチルフェニ
ル）ペンゾトリアゾール、２−（２”−ヒドロキシ３’
，５’−ジ第三ブチルフェニル）−５−クロロベンゾト
リアゾール、２−（２’−ヒドロキシ−３゜一第三ブチ
ル５”−メチルフェニル）−５−クロロベンゾトリアゾ
ール、２−（２゜−ヒドロキシ−３’，５’−ジクミル
フェニル）ペンゾトリアゾール、２．２’−メチレンビ
ス（４第三オクチル−６−ペンゾトリアゾリル）フェノ
ールなどの２−（２゜−ヒドロキシフェニル）ペンゾト
リアゾール類；フエニルサリシレート、レゾルシノール
モノベンゾエート、２．４−ジ第三ブチルフェニル−３
′＋５′−シ第三ブチルー４゛−ヒドロキシベンゾエー
ト、ヘキサデシル−３．５−ジ第三ブチルー４−ヒドロ
キシベンゾエートなどのペンゾエート類；２−エチルー
２゛一エトキシオキザニリド、２−エトキシー４′ドデ
シルオキザニリド等の置換オキザニリド類；エチルーα
−シアノーβ，β−ジフエニルアクリレート、メチル−
２−シアノー３−メチル−３−（ｐ−メトキシフェニル
）アクリレートなどのシアノアクリレート類； ２，２
，６．６一テトラメチル−４−ピペリジルステアレート
、１，２．２．６．６−ペンタメチル−４−ピペリジル
ステアレート、２．２，６．６−テトラメチル−４−ビ
ペリジルベンゾエート、ビス（２．２，６．６−テトラ
メチル−４−ピペリジル）セバヶート、ビス（Ｉ，２，
２，６．６−ペンタメチル−４−ピペリジル）セバヶー
ト、テトラキス（２，２，６．６−テトラメチル−４−
ピペリジル）−１．２．３．４−ブタンテトラカルポキ
シレート、テトラキス（Ｉ，２．２，６．６−ペンタメ
チル−４−ピベリジＢｖ）−１．２．３．４−ブタンテ
トラヵルポキシレート、ビス（Ｉ．２，２，６．６−ペ
ンタメチル〜４−ピペリジル）シ（トリデシル）−１．
２，３．４−ブタンテトラヵルポキシレート、ビス（Ｉ
，２，２，６．６−ペンタメチル−４−ピベリジル）−
２−プチルー２−（３．５−ジ第三ブチルー４−ヒドロ
キシベンジル）マロネート、１−（２−ヒドロキシエチ
ル）−２．２．６．６−テトラメチル−４−ピペリジノ
ール／コハク酸ジェチル重縮合物、１．６−ビス（２，
２．６，６−テトラメチル−４−ピペリジルアミノ）ヘ
キサン／ジブロモエタン重縮合物、１．６−ビス（２，
２．６，６テトラメチル−４−ピベリジルアミノ）ヘキ
サン／２，４−ジクロロー６一第三オクチルアミノ−Ｓ
一トリアジン重縮合物、１．６−ビス（２．２．６．６
−テトラメチル−４−ピペリジルアミノ）ヘキサン／２
，４−ジクロロ−６−モルホリノーｓ−｝リアジン重縮
合物などのヒンダードア旦ン化合物があげられる。Examples of the light stabilizer include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octoxybenzophenone, and 5,5'-methylenebis(2-hydroxy-4-methoxybenzophenone). 2-hydroxybenzophenones such as benzophenone); 2-(2''-hydroxy-5゜methylphenyl)penzotriazole, 2-(2'-hydroxy-5
゛1-tertiary octylphenyl)penzotriazole, 2-
(2”-hydroxy-3゛,5”-di-tert-butylphenyl)penzotriazole, 2-(2”-hydroxy 3′
, 5'-di-tert-butylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3゜-tert-butyl 5''-methylphenyl)-5-chlorobenzotriazole, 2-(2゜- 2-(2°-hydroxyphenyl)penzo such as hydroxy-3',5'-dicumylphenyl)penzotriazole, 2,2'-methylenebis(4tert-octyl-6-penzotriazolyl)phenol;Triazoles; phenyl salicylate, resorcinol monobenzoate, 2,4-di-tert-butylphenyl-3
Penzoates such as '+5'-di-tert-butyl-4'-hydroxybenzoate, hexadecyl-3,5-di-tert-butyl-4-hydroxybenzoate; 2-ethyl-2'-1-ethoxyoxanilide, 2-ethoxy-4' dodecyl Substituted oxanilides such as oxanilide; ethyl-α
-Cyano β, β-diphenyl acrylate, methyl-
Cyanoacrylates such as 2-cyano 3-methyl-3-(p-methoxyphenyl)acrylate; 2,2
, 6.6-tetramethyl-4-piperidyl stearate, 1,2.2.6.6-pentamethyl-4-piperidyl stearate, 2.2,6.6-tetramethyl-4-biperidyl benzoate, Bis(2,2,6,6-tetramethyl-4-piperidyl)sebagate, bis(I,2,
2,6.6-pentamethyl-4-piperidyl)sebagate, tetrakis(2,2,6.6-tetramethyl-4-
piperidyl)-1.2.3.4-butanetetracarpoxylate, tetrakis(I,2.2,6.6-pentamethyl-4-piveridiBv)-1.2.3.4-butanetetracarpoxy rate, bis(I.2,2,6.6-pentamethyl-4-piperidyl)cy(tridecyl)-1.
2,3,4-butanetetracarpoxylate, bis(I
,2,2,6.6-pentamethyl-4-piveridyl)-
2-butyl-2-(3.5-di-tert-butyl-4-hydroxybenzyl)malonate, 1-(2-hydroxyethyl)-2.2.6.6-tetramethyl-4-piperidinol/jetyl succinate polycondensation substance, 1.6-bis(2,
2.6,6-tetramethyl-4-piperidylamino)hexane/dibromoethane polycondensate, 1,6-bis(2,
2.6,6tetramethyl-4-piveridylamino)hexane/2,4-dichloro6-tertiary octylamino-S
monotriazine polycondensate, 1,6-bis(2.2.6.6
-tetramethyl-4-piperidylamino)hexane/2
, 4-dichloro-6-morpholino-s-}riazine polycondensates and other hindered polycondensates.
その他必要に応じて、本発明の組或物には重金属不活性
化剤、造核剤、金属石けん、顔料、充填剤、有機錫化合
物、可塑剤、エボキシ化合物、発泡剤、帯電防止剤、難
燃剤、滑剤、加工助剤などを包含させることができる。If necessary, the composition of the present invention may contain heavy metal deactivators, nucleating agents, metal soaps, pigments, fillers, organotin compounds, plasticizers, epoxy compounds, blowing agents, antistatic agents, and antistatic agents. Fuel agents, lubricants, processing aids, etc. can be included.
次に本発明を実施例によって具体的に説明する。 Next, the present invention will be specifically explained with reference to Examples.
しかしながら、本発明はこれらの実施例によって制限を
受けるものではない。However, the present invention is not limited to these examples.
実施例ｌ
〔配 合〕
未安定化ナイロン６
７５重量部
表−１
フェノール化合物（ＮαＩＩ − ２ ） ０．
２５有機ホスファイト化合物（表−１） ０．２上記
配合物をドライブレンドした後、二軸スクリュー押出機
で最高２４０″Ｃで押出し、ペレ・ント化した。ついで
このベレットを充分乾燥後、射出戒型機を用い、滞留な
しまたは５分滞留させた後、２８０゜Ｃで射出威型して
試験片を作威し、２３゜Ｃにおけるアイゾット衝撃強度
（ノ・ンチ付）および色差（ΔＥ）を測定した。Example 1 [Formulation] Unstabilized nylon 6 75 parts by weight Table 1 Phenol compound (NαII-2) 0.
25 Organic phosphite compound (Table 1) 0.2 After dry-blending the above formulation, it was extruded using a twin-screw extruder at a maximum of 240"C to form a pellet. The pellet was then thoroughly dried and then injected. Using a Kai-type machine, test specimens were prepared by injection molding at 280°C after no retention or 5 minutes of retention, and the Izod impact strength (with punches) and color difference (ΔE) at 23°C. was measured.
結果を表−１に示す。The results are shown in Table-1.
実施例 ２
〔配 合〕
未安定化ナイロン１ ２ １００重量部有
機ホスファイト（ＮＯ．Ｉ−４） ０．３フェノ
ール化合物（表−２ ） ０．１５上記配合物
をドライブレンドした後、二輪スクリュー押出機で最高
２ ４ ０ ’Ｃで押出し、次いでベレ・ノトにした。Example 2 [Blend] Unstabilized nylon 1 2 100 parts by weight Organic phosphite (NO.I-4) 0.3 Phenol compound (Table 2) 0.15 After dry blending the above formulation, two-wheeled screw It was extruded in an extruder at a maximum of 240'C and then made into a beret.
このペレットを充分乾燥後、射出成型機で最高温度２８
０″Ｃで成型して１．５ｉｎ＋厚の試験片を作威した。After thoroughly drying these pellets, the injection molding machine is heated to a maximum temperature of 28°C.
A test piece with a thickness of 1.5 inches was made by molding at 0''C.
該試験片を１６０゜Ｃのギャーオブン中で熱老化試験を
行った。老化の進行度を一定時間毎に応カー歪曲線を求
めることによって追跡した。降伏応力が８０％に低下し
た時点をもって試験の終点とした。The test piece was subjected to a heat aging test in a 160°C oven. The progress of aging was tracked by determining the stress curve at regular intervals. The end point of the test was when the yield stress decreased to 80%.
その結果を表−２に示す。The results are shown in Table-2.
表
２
実施例３
二酸化チタンを０．０５重量％添加して艶消ししたナイ
ロン６６の１００重量部を９０％ギ酸９０重量部に溶か
し、これにフェノール化合物■ｌ化合物０．２重量部お
よび有機ホスファイト化合物（表−３）０．１５重量部
を加え充分に混合する。この溶液をガラス板上に均一に
流し出し、１０５゜Ｃのギャーオーブン中で１０分間乾
燥してフィルムを作或する。このフィルムを２２５゜Ｃ
で３０分間ギャーオーブン中で加熱した時のフィルムの
変色程度を測定し、結果を表−３に示す。Table 2 Example 3 100 parts by weight of nylon 66 matted by adding 0.05% by weight of titanium dioxide was dissolved in 90 parts by weight of 90% formic acid, and 0.2 parts by weight of a phenol compound 1 compound and an organic phosphorus compound were dissolved in 90 parts by weight of 90% formic acid. Add 0.15 parts by weight of phytocompound (Table 3) and mix thoroughly. This solution was poured out uniformly onto a glass plate and dried for 10 minutes in a 105°C gear oven to form a film. Heat this film to 225°C
The degree of discoloration of the film was measured when it was heated in a gar oven for 30 minutes, and the results are shown in Table 3.
表−３
実施例４
本発明になる組底物の光安定剤との併用による効果を見
るため、次の配合の混合物を充分に混和した後、２ ５
０ ’Ｃでプレス加工し、０．５１ＩＩＩＩｌ厚のシ
ートを作威した。このシートを用いウエザオメーター中
で１２０時間照射後のシートの着色をみて耐光性とした
。また、２２５゜Ｃで３０分間加熱あとのシートの着色
をみて熱安定性とした。Table 3 Example 4 In order to see the effect of using the composite sole of the present invention in combination with a light stabilizer, a mixture of the following composition was thoroughly mixed, and then 25
Pressing was carried out at 0'C to produce a sheet with a thickness of 0.51III. Using this sheet, the coloring of the sheet after 120 hours of irradiation in a weatherometer was checked to determine its light resistance. In addition, thermal stability was determined by observing the coloring of the sheet after heating at 225°C for 30 minutes.
その結果を表−４に示す。The results are shown in Table-4.
（配合）
ナイロン６ １００重量部有機
ホスファイト（ １ − １ ＞ ０．２
フェノール化合物（表−４） ０．１５表−
４
〔発明の効果〕
上記各実施例から明らかな如く、本発明の特定の環状ホ
スファイト化合物と特定のフェノール化合物を併用する
ことにより、ボリアミド樹脂の耐熱性、着色性を改良す
ることができる。(Composition) Nylon 6 100 parts by weight Organic phosphite (1-1 > 0.2
Phenol compounds (Table-4) 0.15 Table-
4 [Effects of the Invention] As is clear from the above examples, by using the specific cyclic phosphite compound of the present invention and the specific phenol compound in combination, the heat resistance and colorability of the polyamide resin can be improved.
Claims (1)
I ）で表される有機環状ホスファイト化合物０．００
１〜５重量部および次の一般式（II）で表されるフェノ
ール化合物を０．００１〜５重量部を添加してなる安定
化されたポリアミド系樹脂組成物。 ▲数式、化学式、表等があります▼（ I ） ▲数式、化学式、表等があります▼（II） （式中、Ｒ＿１は炭素原子数１〜９のアルキル基を示し
、Ｒ＿２は水素原子または炭素原子数１〜４のアルキル
基を示し、Ｒ＿３は炭素原子数１〜３０のアルキル基を
示す。Ｒ＿４は水素原子または炭素原子数１〜９のアル
キル基を示し、Ｒ＿５は炭素原子数２〜６のアルキレン
基を示す。）[Claims] Based on 100 parts by weight of polyamide resin, the following general formula (
I) Organic cyclic phosphite compound represented by 0.00
A stabilized polyamide resin composition containing 1 to 5 parts by weight and 0.001 to 5 parts by weight of a phenol compound represented by the following general formula (II). ▲There are mathematical formulas, chemical formulas, tables, etc.▼(I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(II) (In the formula, R_1 represents an alkyl group having 1 to 9 carbon atoms, and R_2 represents a hydrogen atom or a carbon Represents an alkyl group having 1 to 4 atoms, R_3 represents an alkyl group having 1 to 30 carbon atoms, R_4 represents a hydrogen atom or an alkyl group having 1 to 9 carbon atoms, and R_5 represents an alkyl group having 2 to 6 carbon atoms. )
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1235174A JP2772836B2 (en) | 1989-09-11 | 1989-09-11 | Stabilized polyamide resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1235174A JP2772836B2 (en) | 1989-09-11 | 1989-09-11 | Stabilized polyamide resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0397755A true JPH0397755A (en) | 1991-04-23 |
| JP2772836B2 JP2772836B2 (en) | 1998-07-09 |
Family
ID=16982164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1235174A Expired - Fee Related JP2772836B2 (en) | 1989-09-11 | 1989-09-11 | Stabilized polyamide resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2772836B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999013006A1 (en) * | 1997-09-08 | 1999-03-18 | Unitika Ltd | Polyamide resin corporation |
| JP2017115066A (en) * | 2015-12-25 | 2017-06-29 | 東レ株式会社 | Polyamide resin composition and molded article consisting of the same |
-
1989
- 1989-09-11 JP JP1235174A patent/JP2772836B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999013006A1 (en) * | 1997-09-08 | 1999-03-18 | Unitika Ltd | Polyamide resin corporation |
| JP2017115066A (en) * | 2015-12-25 | 2017-06-29 | 東レ株式会社 | Polyamide resin composition and molded article consisting of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2772836B2 (en) | 1998-07-09 |
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