JPH0396U - - Google Patents
Info
- Publication number
- JPH0396U JPH0396U JP5722089U JP5722089U JPH0396U JP H0396 U JPH0396 U JP H0396U JP 5722089 U JP5722089 U JP 5722089U JP 5722089 U JP5722089 U JP 5722089U JP H0396 U JPH0396 U JP H0396U
- Authority
- JP
- Japan
- Prior art keywords
- shield plate
- slits
- mounting device
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5722089U JPH0396U (de) | 1989-05-18 | 1989-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5722089U JPH0396U (de) | 1989-05-18 | 1989-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0396U true JPH0396U (de) | 1991-01-07 |
Family
ID=31581735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5722089U Pending JPH0396U (de) | 1989-05-18 | 1989-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0396U (de) |
-
1989
- 1989-05-18 JP JP5722089U patent/JPH0396U/ja active Pending