JPH0396067U - - Google Patents
Info
- Publication number
- JPH0396067U JPH0396067U JP521190U JP521190U JPH0396067U JP H0396067 U JPH0396067 U JP H0396067U JP 521190 U JP521190 U JP 521190U JP 521190 U JP521190 U JP 521190U JP H0396067 U JPH0396067 U JP H0396067U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- laminated
- terminal
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP521190U JPH0396067U (de) | 1990-01-23 | 1990-01-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP521190U JPH0396067U (de) | 1990-01-23 | 1990-01-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0396067U true JPH0396067U (de) | 1991-10-01 |
Family
ID=31508927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP521190U Pending JPH0396067U (de) | 1990-01-23 | 1990-01-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0396067U (de) |
-
1990
- 1990-01-23 JP JP521190U patent/JPH0396067U/ja active Pending
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