JPH0396044U - - Google Patents

Info

Publication number
JPH0396044U
JPH0396044U JP415490U JP415490U JPH0396044U JP H0396044 U JPH0396044 U JP H0396044U JP 415490 U JP415490 U JP 415490U JP 415490 U JP415490 U JP 415490U JP H0396044 U JPH0396044 U JP H0396044U
Authority
JP
Japan
Prior art keywords
wafer
tray
packaging container
back surfaces
semiconductor wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP415490U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP415490U priority Critical patent/JPH0396044U/ja
Publication of JPH0396044U publication Critical patent/JPH0396044U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)
JP415490U 1990-01-19 1990-01-19 Pending JPH0396044U (pl)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP415490U JPH0396044U (pl) 1990-01-19 1990-01-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP415490U JPH0396044U (pl) 1990-01-19 1990-01-19

Publications (1)

Publication Number Publication Date
JPH0396044U true JPH0396044U (pl) 1991-10-01

Family

ID=31507917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP415490U Pending JPH0396044U (pl) 1990-01-19 1990-01-19

Country Status (1)

Country Link
JP (1) JPH0396044U (pl)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010165882A (ja) * 2009-01-16 2010-07-29 Lintec Corp 半導体ウエハの搬送装置及び搬送方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010165882A (ja) * 2009-01-16 2010-07-29 Lintec Corp 半導体ウエハの搬送装置及び搬送方法

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